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onsemi ESD8104MUTAG
- Part No.:
- ESD8104MUTAG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-UFDFN
- Datasheet:
-
ESD8104MUTAG.pdf
- Description:
- TVS DIODE 3.3VWM 11.4VC 10UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:331
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Product details
Overview
ESD8104MUTAG from onsemi is a unidirectional, low-capacitance ESD protection diode array in a 10-pin UDFN package, designed for high-speed differential data lines. It delivers 0.37 pF max junction capacitance (I/O to GND), ±15 kV IEC 61000−4−2 contact/air ESD rating, and clamps to 11.4 V at +16 A TLP, enabling robust protection of USB 3.1 (10 Gb/s), HDMI 2.0 (6 Gb/s), and DisplayPort interfaces without signal integrity degradation.
For engineers reviewing the ESD8104MUTAG datasheet, pinout, applications, or equivalent options, this device is selected for ultra-low capacitance, flow-through layout compatibility with matched trace lengths, and AEC−Q101 qualification-critical for high-speed serial interface protection where insertion loss and eye diagram preservation are design constraints.
Technical Context
The ESD8104MUTAG employs Low Voltage Punch Through (LVPT) technology, enabling fast turn-on below 4.0 V breakdown and optimized clamping for "soft failure" prevention in sub-28 nm ICs. Its unidirectional configuration protects against negative transients only, with common GND pins (Pins 3 & 8) shared across four I/O channels.
Designed for flow-through PCB routing, it supports impedance-matched differential pairs via symmetric pin placement: I/O pins occupy positions 1, 2, 4, 5 and GND pins occupy 3 and 8-enabling direct in-line placement between connectors and AC coupling capacitors without stubs or vias.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (I/O to GND) | 0.37 pF max @ 1 MHz - preserves signal integrity up to 10 Gb/s (USB 3.1 Gen 2) with <0.66 dB insertion loss at 5 GHz |
| ESD Rating | ±15 kV contact / ±15 kV air per IEC 61000−4−2 Level 4 - exceeds system-level immunity requirements for consumer and industrial ports |
| Clamping Voltage | 11.4 V @ +16 A TLP - limits transient overvoltage to safe levels for 3.3 V I/O rails without latch-up risk |
| Working Voltage | 3.3 V VRWM - compatible with standard high-speed interface supply domains including USB 3.x, HDMI, and DisplayPort |
| Breakdown Voltage | 4.0–5.0 V @ 1 mA - ensures reliable turn-on before damage threshold of protected transceivers |
| Dynamic Resistance | 0.36 Ω (GND→I/O), 0.44 Ω (I/O→GND) - minimizes voltage overshoot during fast-rising ESD events |
| Operating Temperature | −55 °C to +125 °C - supports automotive under-hood and industrial edge computing environments |
Pinout & Package
ESD8104MUTAG is housed in a Pb-free UDFN10 package (Case 517BB), measuring 2.5 mm × 1.0 mm × 0.55 mm with 0.5 mm pitch. The flow-through layout enables straight-line routing for differential pairs, minimizing stub length and impedance discontinuity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 4, 5 | I/O (Protected Line) | Four independent unidirectional ESD protection paths - each connects to one high-speed data line (e.g., USB TX+/−, RX+/−) |
| 3, 8 | GND (Common Cathode) | Shared ground reference for all four channels - minimum one connection required; dual pins reduce ground inductance |
| 6, 7, 9, 10 | N/C | No internal connection - left floating; no PCB routing or thermal relief needed |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.37 pF max ensures <0.15 dB RF insertion loss at 2.5 GHz (USB 3.0) and maintains clean eye diagrams at 10 Gb/s |
| LVPT technology | Enables sub-4.0 V turn-on for early clamping - prevents voltage overshoot that causes soft failures in advanced-node PHYs |
| Flow-through UDFN10 layout | Enables symmetric, stub-free routing of differential pairs - eliminates impedance mismatch and common-mode noise generation |
| AEC−Q101 qualified | Validated for automotive applications including infotainment and ADAS video links requiring zero field failure under ESD stress |
| Pb-free, RoHS-compliant | Meets J-STD-020 moisture sensitivity level 1 (MSL1) and supports 260 °C lead-free reflow without delamination |
Applications
| USB 3.1 Gen 2 Interface | HDMI 2.0 Video Link |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX differential lanes in host controllers and Type-C receptacles operating at 10 Gb/s. IC Role / Device Role / Timing Role: Unidirectional ESD clamp placed between connector and AC coupling capacitor - absorbs ±15 kV contact discharge before reaching the USB PHY. Use Value: Maintains >95% eye opening in 10 Gb/s eye diagrams (Fig. 11), preventing link training failures caused by transient-induced jitter. |
Use Scenario: Shielding TMDS clock and data channels in 4K@60Hz HDMI 2.0 sources and sinks. IC Role / Device Role / Timing Role: Four-channel ESD protection on D0+/−, D1+/−, D2+/−, and CLK+/− lines - grounded via shared cathodes to minimize loop area. Use Value: Limits insertion loss to ≤0.66 dB at 3 GHz fundamental frequency (Table 1), preserving HDMI 2.0 timing margin and reducing bit error rate. |
| eSATA Express Link | DisplayPort 1.4 Channel |
|
Use Scenario: Securing eSATA 6 Gb/s differential pairs in external storage enclosures exposed to frequent hot-plug events. IC Role / Device Role / Timing Role: In-line ESD suppressor on TX+/− and RX+/− lanes - positioned adjacent to connector to minimize transient path inductance. Use Value: Clamps 8 kV IEC contact discharge within 1 ns, preventing PHY lockup and maintaining SATA link negotiation reliability. |
Use Scenario: Protecting DP 1.4 main link lanes (HBR3, 8.1 Gb/s) in thin-client docking stations and embedded graphics modules. IC Role / Device Role / Timing Role: Channel-specific clamping on each of four DP lanes - leverages N/C pins for compact 2.5×1 mm footprint without compromising routing symmetry. Use Value: Delivers 0.30 pF typical capacitance (TA = 25°C), ensuring <0.1 dB loss at 4.05 GHz - critical for DP 1.4's 32.4 Gb/s aggregate bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD8004MUTAG | SCR-based architecture; higher holding voltage (VH ≈ 3.5 V); 0.55 pF max capacitance | Better suited for "hard failure" protection under high-current surges; less ideal for 10 Gb/s due to higher capacitance | Select when protecting legacy 28 nm+ PHYs where thermal failure risk dominates over signal integrity concerns |
| NUP4114MR6T1G | Quad bidirectional diode array; 0.8 pF max capacitance; 12 kV IEC 61000−4−2 rating | Supports both polarities but adds 0.43 pF average capacitance penalty - degrades eye height at >5 Gb/s | Prefer for cost-sensitive, lower-speed applications (e.g., USB 2.0, HDMI 1.4) where bidirectional clamping is mandatory |
Compared with ESD8104MUTAG, ESD8004MUTAG offers deeper snapback for high-energy transients but sacrifices bandwidth; NUP4114MR6T1G provides polarity flexibility at the expense of 115% higher capacitance - making ESD8104MUTAG the optimal choice for 10 Gb/s differential signaling where low capacitance and unidirectional precision are non-negotiable.
Availability
ESD8104MUTAG is available at Aetrix Electronics and suitable for USB 3.1 Gen 2 host designs, HDMI 2.0 video transmission systems, and DisplayPort 1.4 embedded graphics applications requiring stable component supply, long-term lifecycle support, and AEC−Q101 compliance.
Supply support for ESD8104MUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power, analog, sensor, and ESD protection solutions for automotive, industrial, and communications markets.
The ESD8100 series-including ESD8104MUTAG-is engineered specifically for ultra-high-speed serial interfaces using LVPT technology to prevent soft failures in advanced-node ICs while maintaining sub-0.4 pF capacitance.
FAQ
What is the maximum clamping voltage of ESD8104MUTAG under IEC 61000−4−2 Level 4 stress?
The ESD8104MUTAG clamps to 11.4 V at +16 A TLP current, which corresponds to IEC 61000−4−2 Level 4 (±8 kV contact). This value is measured per Figure 5 and Table on page 2 of the official datasheet, and ensures safe operation for 3.3 V I/O rails without exceeding absolute maximum ratings of protected PHYs. ESD8104MUTAG achieves this with LVPT technology and low dynamic resistance.
Does ESD8104MUTAG support bidirectional ESD protection?
No, ESD8104MUTAG is a unidirectional ESD protection diode array. Its electrical characteristics specify reverse working voltage (VRWM = 3.3 V) and breakdown only in the reverse direction (I/O to GND), with no rated forward conduction capability. For bidirectional protection, alternatives like NUP4114MR6T1G must be considered - ESD8104MUTAG is optimized for asymmetric high-speed data lines where ground-referenced transients dominate.
What is the recommended PCB layout for ESD8104MUTAG in USB 3.1 Type-C applications?
Per Figure 14 of the datasheet, ESD8104MUTAG should be placed between the USB 3.1 Type-C connector and AC coupling capacitors on TX1+/−, TX2+/−, RX1+/−, and RX2+/− lanes. Use top-layer routing with matched trace lengths, place ground planes beneath all I/O traces, and connect Pins 3 and 8 directly to a low-inductance GND plane - avoiding vias or daisy-chaining. This layout preserves differential impedance and minimizes ESD path inductance for ESD8104MUTAG to respond within 1 ns.
Is ESD8104MUTAG qualified for automotive use?
Yes, ESD8104MUTAG is AEC−Q101 qualified and PPAP capable, as explicitly stated in the Features section of the datasheet. It operates from −55 °C to +125 °C and meets IEC 61000−4−2 Level 4 ESD immunity - making it suitable for automotive infotainment displays, camera links, and ADAS video backhaul where ESD robustness and temperature resilience are mandatory. The "SZ" prefix variant (SZESD8104MUTAG) denotes full automotive traceability.
How does ESD8104MUTAG compare to ESD7L5.0 in USB 3.0 protection?
ESD8104MUTAG offers 0.37 pF max capacitance versus ESD7L5.0's 0.5 pF, delivering superior signal integrity at 5 Gb/s - evidenced by Figure 9's eye diagram showing >98% opening with ESD8104MUTAG vs. ~85% with ESD7L5.0. Additionally, ESD8104MUTAG's LVPT architecture provides faster turn-on (<4.0 V VBR) than ESD7L5.0's Zener-based structure, reducing voltage overshoot during sub-nanosecond ESD events. Both are unidirectional, but ESD8104MUTAG is purpose-built for Gen 2+ speeds.
ESD8104MUTAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 4V
- Voltage - Clamping (Max) @ Ipp:
- 11.4V (Typ)
- Current - Peak Pulse (10/1000µs):
- 16A (100ns)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.3pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UDFN (2.5x1)
ESD8104MUTAG FAQ
1.How can I place an order for ESD8104MUTAG through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD8104MUTAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD8104MUTAG reliable?
The price and inventory of ESD8104MUTAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD8104MUTAG is usually 5 days.
3.What payment methods are accepted for ESD8104MUTAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD8104MUTAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD8104MUTAG?
ESD8104MUTAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD8104MUTAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD8104MUTAG?
For technical support, including ESD8104MUTAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD8104MUTAG requirements.
6.How does Aetrix verify that ESD8104MUTAG is sourced from the original manufacturer or authorized distributors?
All ESD8104MUTAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD8104MUTAG meets industry standards.
7.What is the process for return or replacement of ESD8104MUTAG?
All ESD8104MUTAG units undergo pre-shipment inspection (PSI). If there is an issue with ESD8104MUTAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD8104MUTAG part is unused and in its original packaging.
Return procedure for ESD8104MUTAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD8104MUTAG Tags
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