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onsemi ESD8351XV2T1G
- Part No.:
- ESD8351XV2T1G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- SC-79, SOD-523
- Datasheet:
-
ESD8351XV2T1G.pdf
- Description:
- TVS DIODE 3.3VWM 11.2VC SOD523
- Quantity:
- Payment:
- Shipping:
Inventory:15,941
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Product details
Overview
ESD8351XV2T1G from onsemi is a low-capacitance bidirectional ESD protection diode in SOD-523 package, designed for high-speed data lines including USB 2.0 and eSATA. It delivers 0.55 pF max junction capacitance, ±15 kV IEC 61000-4-2 contact ESD rating, 3.3 V reverse working voltage, 7.0 V typical breakdown voltage, and 8.2 V clamping voltage at 5 A peak pulse current.
For engineers reviewing the ESD8351XV2T1G datasheet, pinout, applications, or equivalent options, this device is selected for signal integrity–critical interfaces where sub-0.6 pF loading and fast transient suppression are required to protect sensitive transceivers without degrading eye diagrams.
Technical Context
The ESD8351XV2T1G employs a snap-back SCR-based structure optimized for latch-up-free operation on USB 2.0 HS, LS/FS, and DisplayPort lines - validated via load-line analysis per Application Note AND9116/D. Its bidirectional clamping behavior ensures symmetrical protection for AC-coupled differential pairs.
It meets IEC 61000-4-2 Level 4 (±15 kV air, ±8 kV contact) and ISO 10605 (±30 kV, 330 pF/2 kΩ), with dynamic resistance of 0.62 Ω (Pin1→Pin2) enabling low-voltage clamping under high di/dt transients. The device is AEC-Q101 qualified and PPAP capable when ordered with SZ prefix.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Working Voltage | 3.3 V - sets maximum continuous DC bias before leakage rise; matches USB 2.0 VBUS-referenced I/O rails. |
| Junction Capacitance | 0.55 pF max @ 1 MHz, 0 V - ensures minimal signal distortion on 480 Mbps USB 2.0 channels. |
| Clamping Voltage | 8.2 V @ 5 A, 8/20 µs - limits transient overvoltage to safe levels for 3.3 V logic receivers. |
| ESD Rating | ±15 kV IEC 61000-4-2 contact - exceeds industrial and automotive system-level ESD immunity requirements. |
| Breakdown Voltage | 7.0 V typ @ 1 mA - provides margin above 3.3 V operating rail while enabling early turn-on during ESD events. |
| Dynamic Resistance | 0.62 Ω (Pin1→Pin2) - reduces voltage overshoot during fast-rising ESD pulses by minimizing IR drop. |
Pinout & Package
SOD-523 package (1.20 × 0.80 × 0.60 mm), anode/cathode polarity marked with cathode band on Pin 1. RoHS-compliant, Pb-free, halogen-free/BFR-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Cathode | Connected to GND reference plane; forms low-impedance path for negative ESD transients. |
| Pin 2 | Anode | Connected to protected I/O line; enables bidirectional clamping to ground during both polarities of ESD event. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.55 pF max preserves signal integrity on 480 Mbps USB 2.0 and eSATA links without equalization penalty. |
| Latch-up free operation | Validated for USB 2.0 HS/LS/FS and DisplayPort per load-line analysis - avoids destructive sustained conduction. |
| AEC-Q101 qualification | Available with SZ prefix (SZESD8351XV2T1G*) - supports automotive infotainment and ADAS interface protection. |
| Bidirectional clamping | Enables single-device protection of AC-coupled differential pairs without polarity constraints on PCB layout. |
Applications
| USB 2.0 Interface Protection | eSATA Data Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of USB 2.0 host/device ports against user-handling ESD events in consumer and industrial equipment. IC Role / Device Role: Bidirectional transient voltage suppressor placed directly at connector entry point, shunting ESD energy to chassis/GND. Use Value: 0.55 pF capacitance prevents eye diagram closure at 480 Mbps; ±15 kV contact rating exceeds IEC 61000-4-2 Level 4 compliance. |
Use Scenario: Shielding eSATA TX/RX differential pairs from electrostatic discharge during hot-plug insertion in external storage enclosures. IC Role / Device Role: Low-capacitance ESD clamp mounted adjacent to eSATA receptacle, referenced to system ground plane. Use Value: 8.2 V clamping at 5 A ensures protected PHY ICs remain below absolute maximum ratings during ±8 kV contact ESD strikes. |
| Industrial Control Panel Interfaces | Automotive Infotainment USB Ports |
Use Scenario: Securing front-panel USB ports on PLC HMIs and human-machine interfaces exposed to factory-floor ESD hazards. IC Role / Device Role: Primary ESD protection element in series with USB data lines, upstream of internal USB transceiver IC. Use Value: −55 °C to +125 °C operating range supports extended temperature industrial environments without derating. |
Use Scenario: Safeguarding USB 2.0 ports in automotive head units and rear-seat entertainment systems per ISO 10605 requirements. IC Role / Device Role: AEC-Q101-qualified ESD suppressor used with SZESD8351XV2T1G* variant for PPAP-compliant automotive BOMs. Use Value: ±30 kV ISO 10605 rating covers worst-case vehicle-body discharge scenarios; SOD-523 footprint enables compact routing near connectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD8004MUT5G | 0.35 pF max capacitance; 3.6 V VRWM; 6.5 V clamping @ 5 A | Targeted for lower-voltage interfaces (e.g., 1.8 V/2.5 V I/O); tighter clamping but reduced voltage margin vs. 3.3 V rails | Select when lowest possible capacitance is critical and system operates below 3.3 V nominal. |
| ESD8104MUT5G | 0.25 pF max capacitance; 5.5 V VRWM; 6.0 V clamping @ 5 A; HDMI-optimized latch-up immunity | Qualified for HDMI TMDS lanes; higher VRWM allows use on 5 V tolerant interfaces | Choose for HDMI 1.4/1.3a or multi-protocol designs requiring latch-up immunity beyond USB/DisplayPort. |
Compared with ESD8351XV2T1G, ESD8004MUT5G offers lower capacitance but reduced voltage headroom, while ESD8104MUT5G adds HDMI-safe latch-up performance at the cost of larger package and higher VRWM - making ESD8351XV2T1G optimal for cost-sensitive, 3.3 V USB/eSATA protection with proven latch-up safety.
Availability
ESD8351XV2T1G is available at Aetrix Electronics and suitable for USB 2.0 interface protection, eSATA data line hardening, and industrial control panel ESD mitigation requiring stable component supply across production lifecycles.
Supply support for ESD8351XV2T1G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESD8351 Series belongs to onsemi's 8000-series ESD protection portfolio, engineered specifically for high-speed serial interfaces requiring ultra-low capacitance, latch-up immunity, and system-level ESD compliance without signal degradation.
FAQ
What is the package type and dimensions of ESD8351XV2T1G?
The ESD8351XV2T1G uses the SOD-523 package (1.20 mm × 0.80 mm × 0.60 mm) with cathode marking on Pin 1. This compact, surface-mount outline enables dense placement near high-speed connectors while maintaining thermal and electrical performance. The SOD-523 footprint is standardized and supported by all major PCB design tools for ESD8351XV2T1G layout integration.
Does ESD8351XV2T1G support automotive applications?
Yes - the automotive-grade variant SZESD8351XV2T1G* is AEC-Q101 qualified and PPAP capable. While ESD8351XV2T1G itself is not automotive-certified, its datasheet-specified parameters (−55 °C to +125 °C TJ range, ±30 kV ISO 10605 rating) align with automotive environmental stress requirements. For production automotive use, specify the SZ-prefix version to ensure full qualification documentation and process control.
Is ESD8351XV2T1G suitable for HDMI interface protection?
No - ESD8351XV2T1G is explicitly excluded for HDMI 1.4/1.3a TMDS applications due to latch-up risk, as confirmed in the datasheet's Latch-Up Considerations section. The device's SCR-based structure may sustain conduction under HDMI load conditions. For HDMI, onsemi recommends ESD8104 or ESD8040, which are designed with modified trigger characteristics to guarantee latch-up immunity - ESD8351XV2T1G must not be substituted in HDMI designs.
What is the clamping voltage of ESD8351XV2T1G at 8 A peak pulse current?
The ESD8351XV2T1G clamps to 11.2 V at 8 A peak pulse current (IEC 61000-4-2 Level 4 equivalent), as specified in the Electrical Characteristics table. This value reflects the voltage measured across the device during a TLP test at 8 A, confirming robust suppression capability for high-energy ESD events while remaining within safe operating limits for 3.3 V interface ICs.
How does the dynamic resistance of ESD8351XV2T1G affect ESD protection performance?
The ESD8351XV2T1G has a dynamic resistance of 0.62 Ω (Pin1→Pin2), which directly determines voltage overshoot during fast-rising ESD transients. Lower RDYN minimizes the IR component of clamping voltage (VC = VHOLD + IPP × RDYN), resulting in tighter voltage control - critical for protecting sensitive 3.3 V transceivers where even brief excursions above 12 V can cause damage. This value is measured under TLP conditions and validated per AND8307/D.
ESD8351XV2T1G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- SC-79, SOD-523
- Series:
- ESD8351
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 11.2V
- Current - Peak Pulse (10/1000µs):
- 5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.4pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-523
ESD8351XV2T1G FAQ
1.How can I place an order for ESD8351XV2T1G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD8351XV2T1G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD8351XV2T1G reliable?
The price and inventory of ESD8351XV2T1G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD8351XV2T1G is usually 5 days.
3.What payment methods are accepted for ESD8351XV2T1G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD8351XV2T1G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD8351XV2T1G?
ESD8351XV2T1G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD8351XV2T1G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD8351XV2T1G?
For technical support, including ESD8351XV2T1G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD8351XV2T1G requirements.
6.How does Aetrix verify that ESD8351XV2T1G is sourced from the original manufacturer or authorized distributors?
All ESD8351XV2T1G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD8351XV2T1G meets industry standards.
7.What is the process for return or replacement of ESD8351XV2T1G?
All ESD8351XV2T1G units undergo pre-shipment inspection (PSI). If there is an issue with ESD8351XV2T1G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD8351XV2T1G part is unused and in its original packaging.
Return procedure for ESD8351XV2T1G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD8351XV2T1G Tags
-
ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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