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onsemi ESD8504GMUTAG
- Part No.:
- ESD8504GMUTAG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-UFDFN
- Datasheet:
-
ESD8504GMUTAG.pdf
- Description:
- TVS DIODE 3VWM 7VC 10UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,261
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Product details
Overview
ESD8504GMUTAG from onsemi is a low-capacitance quad-channel ESD protection diode array designed for high-speed differential data lines. It delivers 0.5 pF max I/O-to-GND capacitance, ±25 kV IEC 61000−4−2 contact/air ESD rating, and 7.0 V clamping voltage at ±8 kV contact discharge, enabling robust protection of USB 3.0/3.1 SuperSpeed lanes without signal integrity degradation.
For engineers reviewing the ESD8504GMUTAG datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low junction capacitance (0.39 pF typ @ 1 MHz), latch-up–free operation in USB 3.0/3.1 and DisplayPort, and UDFN10 2.5×1 mm flow-through layout compatibility with matched trace routing.
Technical Context
The ESD8504GMUTAG employs a snap-back SCR-based structure optimized for high-speed interfaces, with verified latch-up immunity in USB 3.0/3.1 and DisplayPort applications per load-line analysis. Its flow-through pinout (I/O–I/O–GND–N/C–N/C–N/C–N/C–GND–I/O–I/O) minimizes parasitic inductance and supports impedance-controlled PCB routing.
Clamping performance is characterized using both IEC 61000−4−2 and TLP methods: VC = 7.0 V at +16 A (IEC Level 4 equivalent), with dynamic resistance RDYN = 0.3 Ω (I/O to GND). Junction capacitance remains stable across 1 MHz–2.5 GHz (0.39–0.45 pF), critical for 5–10 Gb/s data rates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (I/O–GND) | 0.39 pF typ @ 1 MHz - preserves USB 3.0 eye diagram integrity at 5 Gb/s |
| ESD Rating | ±25 kV contact & air (IEC 61000−4−2 Level 4) - exceeds industrial system-level requirements |
| Clamping Voltage | 7.0 V @ +16 A TLP - limits transient overvoltage to safe levels for 3.3 V I/O receivers |
| Working Voltage | 3.0 V VRWM - compatible with standard USB 3.0/3.1 and DisplayPort supply rails |
| Breakdown Voltage | 4.0–6.0 V VBR @ 1 mA - ensures reliable turn-on before IC damage threshold |
| Dynamic Resistance | 0.3 Ω (I/O to GND) - enables fast energy dissipation with minimal voltage overshoot |
| Operating Temp | −55 °C to +125 °C - supports automotive under-hood and industrial edge computing environments |
Pinout & Package
ESD8504GMUTAG is housed in a Pb-free UDFN10 (Case 517BB) package measuring 2.5 mm × 1.0 mm × 0.5 mm, featuring a flow-through layout optimized for differential pair routing and impedance matching.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 4, 5 | I/O Channel Input/Output | Four independent protected data lanes; bidirectional conduction for ±ESD transients |
| 3, 8 | Common GND | Shared cathode connection; minimum one GND required for functional operation |
| 6, 7, 9, 10 | No Connect (N/C) | Unbonded die pads; no electrical function or PCB routing needed |
Key Features
| Feature | Design Value |
|---|---|
| Latch-up–free operation | Validated for USB 3.0/3.1 and DisplayPort via load-line analysis - eliminates risk of destructive DC latch-up during ESD events |
| Flow-through pinout | Enables straight-through PCB trace routing between connector and controller - maintains 90 Ω differential impedance without stubs or vias |
| Ultra-low capacitance | 0.39 pF typ (1 MHz) - reduces insertion loss to −0.13 dB at 2.5 GHz fundamental (USB 3.0 m1) |
| High ESD survivability | ±25 kV contact/air per IEC 61000−4−2 - protects against human-body-model discharges in handheld and docking station environments |
| Pb-free & RoHS compliant | Meets J-STD-609 Category 1 moisture sensitivity and JEDEC MSL 1 reflow profile - supports lead-free manufacturing |
Applications
| USB 3.0/3.1 Interface Protection | eSATA Interface Protection |
|---|---|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs in laptop docking stations and external SSD enclosures exposed to frequent hot-plug cycles. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between AC coupling capacitors and Type-A/B connectors. Use Value: Maintains <0.13 dB insertion loss at 2.5 GHz while clamping ±8 kV ESD to ≤7.0 V - preserves 5 Gb/s eye opening per Figure 11. | Use Scenario: Safeguarding eSATA Gen II (3 Gb/s) host and device ports in industrial storage subsystems operating in electrically noisy factory environments. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on differential SATA data lanes (SATA_TXP/N, SATA_RXP/N). Use Value: 0.45 pF capacitance at 500 MHz–10 GHz ensures <−0.5 dB loss up to 3rd harmonic (4.5 GHz), preventing jitter accumulation. |
| DisplayPort 1.2/1.4 Protection | High-Speed Industrial Camera Link |
Use Scenario: ESD hardening of DisplayPort main link lanes (AUX, HPD, and 4-lane data) in digital signage controllers and medical imaging displays. IC Role / Device Role / Timing Role: Quad-channel clamp on DP++ source-side outputs, placed adjacent to receptacle per layout guidelines in Figure 13. Use Value: Latch-up–free operation confirmed per Table 1 - avoids system lockup during field ESD events on DP AUX channel. | Use Scenario: Protecting 800 Mbps–3.2 Gbps Camera Link base/medium/full configurations in machine vision systems deployed on automated production lines. IC Role / Device Role / Timing Role: Per-lane ESD suppression on serialized pixel data and clock signals routed over flexible flat cables. Use Value: 0.5 pF max capacitance prevents rise-time degradation beyond 10% - critical for maintaining pixel clock edge fidelity at >100 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD8006MUTAG | 0.35 pF typ capacitance; identical UDFN10 package and latch-up behavior | Optimized for USB 3.0/3.1 and DisplayPort per same load-line validation | Select when lower capacitance is prioritized and VRWM = 3.0 V suffices |
| ESD7L5.0DT5G | Single-channel SOD-523; 0.55 pF typ; 5.0 V VRWM | Targeted at lower-speed interfaces (USB 2.0, HDMI DDC); not latch-up–free for USB 3.0 | Choose only for cost-sensitive single-lane designs where 5.0 V working voltage is acceptable |
Compared with ESD8504GMUTAG, ESD8006MUTAG offers marginally lower capacitance but identical form factor and application scope, whereas ESD7L5.0DT5G requires four discrete placements, increases board area by 3.2×, and lacks latch-up immunity for SuperSpeed protocols.
Availability
ESD8504GMUTAG is available at Aetrix Electronics and suitable for USB 3.0/3.1 interface protection, DisplayPort 1.2/1.4 hardening, and industrial camera link designs requiring stable component supply across extended product lifecycles.
Supply support for ESD8504GMUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, and consumer markets.
The ESD8504GMUTAG belongs to onsemi's 8000-series SCR-based ESD protection portfolio, engineered specifically for latch-up–free operation in high-speed serial interfaces including USB 3.x, DisplayPort, and eSATA.
FAQ
What is the maximum clamping voltage of ESD8504GMUTAG under IEC 61000−4−2 Level 4 stress?
The ESD8504GMUTAG exhibits a clamping voltage of 7.0 V at +16 A and −8.5 V at −16 A under IEC 61000−4−2 Level 4 equivalent conditions (±8 kV contact, ±15 kV air), measured per TLP characterization in Figures 5–8 of the official datasheet. This ensures downstream 3.3 V logic remains within safe operating limits during worst-case ESD events. The ESD8504GMUTAG's low dynamic resistance (0.3 Ω) contributes directly to this controlled clamping behavior.
Is ESD8504GMUTAG suitable for HDMI 2.0 or HDMI 2.1 interfaces?
No, ESD8504GMUTAG is not recommended for HDMI 2.0 or HDMI 2.1 applications due to latch-up risk. Per Table 1 and latch-up analysis on page 8 of the datasheet, HDMI TMDS lanes require higher holding current (IH ≥ 54.78 mA) than ESD8504GMUTAG provides (IHOLD = 20 mA). For HDMI, onsemi specifies ESD8104 or ESD8040 - devices validated for latch-up–free operation. Using ESD8504GMUTAG on HDMI may result in destructive DC latch-up after an ESD event.
What is the junction capacitance of ESD8504GMUTAG at 2.5 GHz, and why does it matter for USB 3.0?
The junction capacitance of ESD8504GMUTAG is 0.45 pF at 2.5 GHz (VR = 0 V), as specified in the Electrical Characteristics table. This value is critical for USB 3.0 because it directly determines insertion loss at the fundamental frequency (2.5 GHz) and third harmonic (7.5 GHz); Figure 12 confirms −0.13 dB loss at m1, preserving signal integrity and eye opening. Higher capacitance would distort the 5 Gb/s NRZ waveform and increase bit error rate.
How many ground connections are required for proper operation of ESD8504GMUTAG?
Only one ground connection is required for functional operation of ESD8504GMUTAG, as explicitly stated in the Pin Configuration note: "Common GND - Only Minimum of 1 GND connection required." Pins 3 and 8 are internally tied to the same cathode node. However, best practice for high-frequency ESD performance recommends connecting both pins to a low-inductance ground plane to minimize loop inductance and improve transient current return path efficiency.
Does ESD8504GMUTAG meet RoHS and halogen-free compliance standards?
Yes, ESD8504GMUTAG is Pb-free, halogen-free/BFR-free, and fully RoHS compliant, as confirmed in the Features section of the datasheet (Rev. 3, May 2024). It satisfies EU Directive 2011/65/EU and meets IPC/JEDEC J-STD-609A Category 1 moisture sensitivity requirements. The "G" suffix in ESD8504GMUTAG denotes Pb-free packaging, and the device is qualified for reflow soldering per JEDEC J-STD-020D.3 MSL 1 profile.
ESD8504GMUTAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3V (Max)
- Voltage - Breakdown (Min):
- 4V
- Voltage - Clamping (Max) @ Ipp:
- 7V
- Current - Peak Pulse (10/1000µs):
- 16A (100ns)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.39pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UDFN (2.5x1)
ESD8504GMUTAG FAQ
1.How can I place an order for ESD8504GMUTAG through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD8504GMUTAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD8504GMUTAG reliable?
The price and inventory of ESD8504GMUTAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD8504GMUTAG is usually 5 days.
3.What payment methods are accepted for ESD8504GMUTAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD8504GMUTAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD8504GMUTAG?
ESD8504GMUTAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD8504GMUTAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD8504GMUTAG?
For technical support, including ESD8504GMUTAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD8504GMUTAG requirements.
6.How does Aetrix verify that ESD8504GMUTAG is sourced from the original manufacturer or authorized distributors?
All ESD8504GMUTAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD8504GMUTAG meets industry standards.
7.What is the process for return or replacement of ESD8504GMUTAG?
All ESD8504GMUTAG units undergo pre-shipment inspection (PSI). If there is an issue with ESD8504GMUTAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD8504GMUTAG part is unused and in its original packaging.
Return procedure for ESD8504GMUTAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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