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onsemi ESD8551N2T5G
- Part No.:
- ESD8551N2T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XDFN
- Datasheet:
-
ESD8551N2T5G.pdf
- Description:
- TVS DIODE 3.3VWM 16VC 2X2DFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,860
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Product details
Overview
ESD8551N2T5G from onsemi is a low-capacitance bidirectional ESD protection diode designed for high-speed data lines, featuring 0.30 pF max junction capacitance (at 1 MHz), 3.3 V reverse working voltage, and IEC 61000−4−2 Level 4 (±20 kV contact) compliance - deployed in USB 3.0, MHL 2.0, and eSATA interfaces.
For engineers reviewing the ESD8551N2T5G datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low signal-line capacitance, sub-10 V clamping at 8 A TLP, latch-up-free operation for USB 3.0 SuperSpeed, and X2DFN2 wettable flank–compatible footprint.
Technical Context
The ESD8551N2T5G employs a snap-back SCR-based structure optimized for transient suppression without latch-up in USB 3.0 SS and DisplayPort applications. Its bidirectional configuration protects I/O-to-GND paths with symmetric clamping behavior and dynamic resistance of 0.84 Ω.
It meets ISO 10605 (±30 kV at 150 pF/2 kΩ) and IEC 61000−4−2 Level 4 (±20 kV contact/air), with clamping voltage specified at 9.0 V (IPP = 8 A) and 16.0 V (IPP = 16 A), directly correlating to IEC Level 2 and Level 4 ESD event equivalence.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Working Voltage | 3.3 V - sets maximum continuous DC bias before leakage rise; matches USB 3.0 VBUS-referenced signaling rails. |
| Junction Capacitance | 0.20–0.30 pF @ 1 MHz - ensures minimal signal integrity degradation on >5 Gbps differential lanes. |
| Clamping Voltage | 9.0 V @ 8 A TLP - limits transient overvoltage during IEC Level 2–equivalent events to protect 3.3 V I/O buffers. |
| ESD Withstand | ±20 kV contact per IEC 61000−4−2 Level 4 - exceeds industrial immunity requirements for handheld and docking interfaces. |
| Breakdown Voltage | 5.5–8.3 V @ 1 mA - provides robust margin above 3.3 V operating rail while enabling fast snap-back turn-on. |
| Dynamic Resistance | 0.84 Ω - lowers voltage overshoot during high-di/dt ESD pulses by minimizing IR drop across protection path. |
Pinout & Package
X2DFN2 package (Case 714AB), 1.00 mm × 0.60 mm × 0.37 mm, 0.65 mm pitch, Pb-free, wettable flank capable - compatible with automated optical inspection and fine-pitch SMT reflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | I/O Terminal (Anode/Cathode) | Bidirectional ESD path - connects to protected high-speed data line (e.g., USB 3.0 TX+/RX+). |
| Pin 2 | GND Terminal | Low-inductance return path to system ground plane - critical for maintaining clamping efficacy under fast transients. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.30 pF max (I/O-to-GND) - preserves signal rise/fall times and insertion loss in 5+ Gbps serial links. |
| IEC 61000−4−2 Level 4 rated | ±20 kV contact discharge - satisfies end-equipment EMC certification for consumer and industrial USB peripherals. |
| Latch-up free for USB 3.0 | Validated via load-line analysis per AND9116/D - eliminates risk of sustained conduction after ESD event on SuperSpeed lanes. |
| Low clamping voltage | 9.0 V @ 8 A TLP - holds protected IC I/O below absolute maximum rating during worst-case ESD stress. |
Applications
| USB 3.0 Interface Protection | MHL 2.0 Video Link Protection |
|---|---|
Use Scenario: Protecting differential SuperSpeed TX/RX pairs in host controllers, hubs, and storage enclosures against user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed within 3 mm of connector, shunting ESD current to ground before reaching PHY. Use Value: Enables pass-fail compliance with IEC 61000−4−2 Level 4 without degrading 5 Gbps eye diagram margin due to 0.25 pF typical capacitance. |
Use Scenario: Safeguarding MHL 2.0 high-definition video lanes (up to 3 Gbps) in mobile dock adapters and display receivers. IC Role / Device Role / Timing Role: Low-capacitance clamp on each TMDS-equivalent data pair, referenced to local ground with minimal stub length. Use Value: Maintains MHL AC-coupled signal integrity while delivering ±20 kV contact ESD immunity per interface pin. |
| eSATA Data Line Protection | DisplayPort Main Link Protection |
Use Scenario: Shielding external SATA II/III 3.0 Gbps data lines in NAS enclosures and laptop docking stations from cable-discharge events. IC Role / Device Role / Timing Role: I/O-to-GND ESD diode mounted adjacent to eSATA connector, leveraging low dynamic resistance to limit overshoot. Use Value: Achieves full IEC 61000−4−2 Level 4 compliance while adding <0.05 dB insertion loss at 1.5 GHz - critical for SATA Gen III jitter budgets. |
Use Scenario: Protecting DisplayPort 1.2 main link (5.4 Gbps per lane) in monitors, GPUs, and MST hubs against connector-touch ESD. IC Role / Device Role / Timing Role: Per-lane bidirectional clamp with matched capacitance across all four lanes to avoid skew-induced eye closure. Use Value: Provides latch-up–free operation verified per Table 1, ensuring no DC failure mode after repeated ±15 kV air discharges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD8004MUTAG | 0.35 pF max capacitance; 3.6 V VRWM; lower clamping (8.5 V @ 8 A); same X2DFN2 package | Optimized for USB 2.0 HS/FS and DisplayPort; not validated for USB 3.0 SS latch-up margin | Select when lower clamping voltage is prioritized over USB 3.0 SS qualification; verify layout for higher capacitance impact. |
| ESD8006MUTAG | 0.25 pF max capacitance; 5.0 V VRWM; 10.5 V clamping @ 8 A; X2DFN2 footprint | Rated for HDMI 1.4 TMDS (latch-up free); supports higher DC bias rails than ESD8551N2T5G | Choose for HDMI or multi-standard interfaces requiring >3.3 V working voltage; not recommended for strict USB 3.0 SS designs due to higher VRWM. |
Compared with ESD8551N2T5G, ESD8004MUTAG offers tighter clamping but slightly higher capacitance and lacks explicit USB 3.0 SS latch-up validation, while ESD8006MUTAG supports higher VRWM and HDMI use cases but trades off clamping performance and USB 3.0 optimization.
Availability
ESD8551N2T5G is available at Aetrix Electronics and suitable for USB 3.0 interface protection, MHL 2.0 video link safeguarding, and eSATA data line hardening requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.
Supply support for ESD8551N2T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESD8551N2T5G belongs to onsemi's ESD8000 series of snap-back SCR-based protection devices, engineered specifically for latch-up–free, ultra-low-capacitance ESD suppression on high-speed serial interfaces including USB 3.0 and DisplayPort.
FAQ
What is the maximum junction capacitance of ESD8551N2T5G and why does it matter for high-speed interfaces?
The ESD8551N2T5G has a maximum junction capacitance of 0.30 pF at 1 MHz and 0.25 pF at 2.5 GHz. This ultra-low value minimizes signal distortion, preserves eye diagram integrity, and avoids excessive insertion loss on high-speed differential pairs such as USB 3.0 SuperSpeed (5 Gbps) and MHL 2.0 (3 Gbps). The ESD8551N2T5G achieves this while maintaining robust ±20 kV ESD protection - a critical balance for modern serial interfaces.
Is ESD8551N2T5G qualified for automotive applications?
No - the base ESD8551N2T5G is not AEC-Q101 qualified. However, its automotive-grade variant SZESD8551N2T5G* (with SZ prefix) is AEC-Q101 qualified and PPAP capable. The ESD8551N2T5G itself is intended for industrial and consumer applications; design-in for automotive systems requires explicit use of the SZ-prefixed part number and associated qualification documentation.
Does ESD8551N2T5G support bidirectional ESD protection, and how is that implemented?
Yes, the ESD8551N2T5G provides symmetrical bidirectional protection between its I/O pin (Pin 1) and GND (Pin 2). It uses a back-to-back SCR structure that triggers identically for positive and negative transients, enabling clamping in both polarities without polarity-sensitive placement. This architecture ensures consistent ±20 kV IEC 61000−4−2 performance and eliminates orientation errors during assembly - a key advantage for high-density PCB layouts.
Can ESD8551N2T5G be used to protect HDMI TMDS lines?
No - the ESD8551N2T5G is explicitly excluded for HDMI 1.4/1.3a TMDS applications due to latch-up risk, as confirmed in the datasheet's Table 1 and latch-up analysis section. For HDMI, onsemi recommends ESD8104 or ESD8040. Using ESD8551N2T5G on HDMI lanes may result in sustained conduction after ESD stress, leading to functional failure. Always match the protection device to the interface's latch-up load-line requirements.
What is the clamping voltage of ESD8551N2T5G under IEC 61000−4−2 Level 4 stress?
The ESD8551N2T5G does not specify a single clamping voltage for IEC 61000−4−2 Level 4 (±20 kV), because clamping depends on transient current profile. Instead, its TLP-derived clamping is characterized at 9.0 V @ 8 A (IEC Level 2 equivalent) and 16.0 V @ 16 A (IEC Level 4 equivalent). These values reflect actual voltage limiting during standardized ESD events and are validated per ANSI/ESD STM5.5.1 TLP testing - critical for verifying protection margin against 3.3 V I/O absolute maximum ratings.
ESD8551N2T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 16V (Typ)
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.2pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X2DFN (1x0.6)
ESD8551N2T5G FAQ
1.How can I place an order for ESD8551N2T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD8551N2T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD8551N2T5G reliable?
The price and inventory of ESD8551N2T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD8551N2T5G is usually 5 days.
3.What payment methods are accepted for ESD8551N2T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD8551N2T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD8551N2T5G?
ESD8551N2T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD8551N2T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD8551N2T5G?
For technical support, including ESD8551N2T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD8551N2T5G requirements.
6.How does Aetrix verify that ESD8551N2T5G is sourced from the original manufacturer or authorized distributors?
All ESD8551N2T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD8551N2T5G meets industry standards.
7.What is the process for return or replacement of ESD8551N2T5G?
All ESD8551N2T5G units undergo pre-shipment inspection (PSI). If there is an issue with ESD8551N2T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD8551N2T5G part is unused and in its original packaging.
Return procedure for ESD8551N2T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD8551N2T5G Tags
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ESD5Z3.3T1G
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D12V0L1B2LP-7B
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PESD2V0Y1BSFYL
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