onsemi ESD8704MUTAG
- Part No.:
- ESD8704MUTAG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-UFDFN
- Datasheet:
-
ESD8704MUTAG.pdf
- Description:
- TVS DIODE 3.3VWM 10UDFN
- Quantity:
- Payment:

- Shipping:

Inventory:33,585
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Product details
Overview
ESD8704MUTAG from onsemi is a low-capacitance quad-channel ESD protection diode array designed for high-speed differential data lines. It delivers 0.30 pF typical junction capacitance at 1 MHz, ±30 kV IEC 61000-4-2 contact/air ESD rating, and 4.7 V clamping voltage at 8 A TLP, enabling robust protection of USB 3.0/3.1, eSATA, and DisplayPort interfaces without signal integrity degradation.
For engineers reviewing the ESD8704MUTAG datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance (≤0.5 pF), latch-up-free operation in USB 3.0/3.1 and DisplayPort, flow-through UDFN10 package layout compatibility, and verified IEC 61000-4-2 Level 4 compliance.
Technical Context
The ESD8704MUTAG employs a snap-back SCR-based protection structure optimized for high-speed serial interfaces. Its 0.5 pF max capacitance ensures minimal signal distortion up to 10 Gb/s (5 GHz fundamental), while its 3.3 V reverse working voltage and 1.9 V holding voltage enable safe operation with 3.3 V I/O rails.
Designed specifically for differential pair routing, the flow-through UDFN10 package places I/O pins 1–2 and 4–5 on opposite edges to support matched trace lengths and consistent impedance control. The device is qualified to AEC-Q101 and supports Pb-free, halogen-free manufacturing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (I/O–GND) | 0.30 pF typ @ 1 MHz - preserves signal integrity on 5–10 Gb/s links |
| ESD Rating | ±30 kV contact/air per IEC 61000-4-2 Level 4 - exceeds system-level immunity requirements |
| Clamping Voltage | 4.7 V @ 8 A TLP - limits transient overvoltage below 3.3 V I/O rail tolerance |
| Reverse Working Voltage | 3.3 V - matches standard USB 3.x and DisplayPort supply domains |
| Holding Voltage | 1.9 V - ensures stable snap-back conduction without latch-up in USB 3.0/3.1 |
| Dynamic Resistance | 0.30 Ω - enables fast energy dissipation during ESD events |
| Operating Temp Range | −55 °C to +125 °C - supports industrial and automotive under-hood environments |
Pinout & Package
ESD8704MUTAG uses the UDFN10 (Case 517BB) 2.5 mm × 1.0 mm, 0.5 mm pitch wettable flank package. Its flow-through layout minimizes stub length and enables symmetric routing for differential pairs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O Channel A+ | Input/output terminal for first differential line (e.g., USB3 TX+) |
| 2 | I/O Channel A− | Input/output terminal for first differential line (e.g., USB3 TX−) |
| 3 | GND | Common cathode connection; minimum one GND required for SCR operation |
| 4 | I/O Channel B+ | Input/output terminal for second differential line (e.g., USB3 RX+) |
| 5 | I/O Channel B− | Input/output terminal for second differential line (e.g., USB3 RX−) |
| 6–7, 9–10 | N/C | No internal connection - electrically isolated, may be used as thermal pads or left floating |
| 8 | GND | Second GND terminal - improves thermal dissipation and grounding path redundancy |
Key Features
| Feature | Design Value |
|---|---|
| Latch-up free in USB 3.0/3.1 | Validated via load-line analysis and PCB layout guidelines - eliminates risk of destructive DC latch-up during normal operation |
| Flow-through UDFN10 package | Enables straight-through trace routing for differential pairs - maintains 90 Ω differential impedance and minimizes stub-induced reflections |
| 0.30 pF typical capacitance @ 1 MHz | Reduces insertion loss to −0.09 dB at 2.5 GHz (USB 3.0 m1) - preserves eye diagram opening at 5 Gb/s |
| AEC-Q101 qualified | Meets automotive-grade reliability requirements including temperature cycling, HTOL, and ESD stress testing |
| Wettable flank terminations | Supports automated optical inspection (AOI) - enables 100% solder joint quality verification in high-volume SMT lines |
Applications
| USB 3.0/3.1 Interface Protection | eSATA Interface Protection |
|---|---|
Use Scenario: Protecting host and device-side SuperSpeed differential lanes (SSTX+/−, SSRX+/−) against ESD events during hot-plug insertion. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between AC coupling capacitors and connector - clamps ESD surges before they reach the PHY. Use Value: Maintains 5–10 Gb/s signal fidelity with <0.1 dB insertion loss at fundamental frequency and preserves eye diagram margin per Figure 11–12. | Use Scenario: Safeguarding eSATA transmitter/receiver pins on motherboards and external enclosures exposed to frequent cable mating cycles. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on differential SATA lanes - operates within 3.3 V rail constraints and avoids signal attenuation. Use Value: Enables full compliance with IEC 61000-4-2 Level 4 (±30 kV) while adding <0.05 mm of PCB footprint per channel. |
| DisplayPort Source Protection | Industrial High-Speed Serial Link Protection |
Use Scenario: Shielding DisplayPort 1.2/1.4 source outputs (main link lanes) in monitors, docking stations, and graphics adapters. IC Role / Device Role / Timing Role: Quad-channel ESD suppressor aligned with DP's four main link differential pairs - placed adjacent to edge connectors per layout guidelines. Use Value: Prevents ESD-induced pixel corruption or link training failure with 0.31 pF capacitance @ 5 GHz - meets DP's 20 Gb/s (HBR3) bandwidth requirement. | Use Scenario: Hardening high-speed serial links in industrial vision systems, test equipment, and medical imaging devices where ESD exposure is frequent and signal integrity is mission-critical. IC Role / Device Role / Timing Role: Robust interface protector for custom LVDS or mini-SAS derivatives operating at 3–6 Gb/s in harsh environments. Use Value: Delivers −55 °C to +125 °C operational range and AEC-Q101 qualification - supports extended lifecycle deployment without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD8006MUTAG | 0.35 pF max capacitance; identical UDFN10 package and 3.3 V VRWM | Qualified for both USB 3.0/3.1 and DisplayPort; same latch-up behavior | Select when dual-source availability or alternate supply chain validation is required |
| ESD8104MUTAG | 0.50 pF max capacitance; higher VHOLD (2.5 V); rated for HDMI TMDS | Required for HDMI 1.4/1.3a due to stricter latch-up margin; not recommended for USB 3.0 | Choose only for HDMI applications - ESD8704MUTAG is superior for USB/DP due to lower capacitance and proven latch-up immunity |
Compared with ESD8006MUTAG, ESD8704MUTAG offers lower typical capacitance (0.30 vs. 0.35 pF) and tighter clamping (4.7 V vs. 5.0 V @ 8 A), making it preferred for 10 Gb/s USB 3.1 Gen 2. Against ESD8104MUTAG, ESD8704MUTAG provides better high-frequency signal fidelity and is explicitly validated for USB/DP - whereas ESD8104MUTAG targets HDMI-specific latch-up margins.
Availability
ESD8704MUTAG is available at Aetrix Electronics and suitable for USB 3.0/3.1 interface protection, DisplayPort source hardening, and industrial high-speed serial link safeguarding requiring stable component supply across production lifecycles.
Supply support for ESD8704MUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESD8704MUTAG belongs to onsemi's ESD8000 series of SCR-based protection devices, engineered specifically for latch-up-free operation in high-speed serial interfaces including USB 3.x, DisplayPort, and eSATA.
FAQ
What is the maximum junction capacitance of ESD8704MUTAG and at what frequency is it specified?
The maximum junction capacitance of ESD8704MUTAG is 0.50 pF, measured between I/O pins and GND at VR = 0 V and f = 1 MHz. At higher frequencies - 2.5 GHz (USB 3.0 fundamental) and 5.0 GHz (USB 3.1 fundamental) - capacitance drops to 0.40 pF and 0.25 pF respectively, ensuring minimal impact on 5–10 Gb/s signal integrity. This frequency-dependent behavior is confirmed in Figure 10 of the official datasheet.
Is ESD8704MUTAG suitable for HDMI 1.4/1.3a TMDS applications?
No, ESD8704MUTAG is not recommended for HDMI 1.4/1.3a TMDS applications. Datasheet Table 1 explicitly lists HDMI as a "Potential Latch-up" use case for ESD8704MUTAG due to insufficient holding voltage margin. For HDMI, onsemi specifies ESD8104 or ESD8040 - devices with higher VHOLD (2.5 V) and optimized SCR parameters. Using ESD8704MUTAG in HDMI may result in latch-up and permanent failure.
What package type and dimensions does ESD8704MUTAG use?
ESD8704MUTAG uses the UDFN10 package (Case 517BB), measuring 2.5 mm × 1.0 mm with 0.5 mm pitch. It features wettable flank terminations for AOI compatibility and an exposed copper thermal pad. Pin 1 marking is indicated by a microdot or "7D" laser marking. Mechanical drawings confirm body thickness of 0.45–0.55 mm and terminal coplanarity ≤0.10 mm - critical for reliable reflow soldering.
Does ESD8704MUTAG require multiple ground connections for proper operation?
No, ESD8704MUTAG requires only a minimum of one GND connection (Pin 3 or Pin 8) for functional SCR operation, as stated in the datasheet pin configuration note. However, connecting both GND pins (3 and 8) is strongly recommended to reduce dynamic resistance, improve thermal dissipation, and enhance ESD current shunting capability - especially in high-reliability or high-power transient scenarios.
What is the clamping voltage performance of ESD8704MUTAG under IEC 61000-4-2 testing?
ESD8704MUTAG does not specify a single clamping voltage under IEC 61000-4-2 because the standard defines pass/fail criteria, not device-level clamping. Instead, datasheet Figures 1–2 show oscilloscope waveforms demonstrating clamping at ~8–10 V peak during ±8 kV contact discharge. For design purposes, the TLP-derived clamping voltage of 4.7 V @ 8 A (positive) and −4.0 V @ 8 A (negative) is the validated, repeatable metric used for circuit protection analysis in ESD8704MUTAG applications.
ESD8704MUTAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5V (Typ)
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.3pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UDFN (2.5x1)
ESD8704MUTAG FAQ
1.How can I place an order for ESD8704MUTAG through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD8704MUTAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD8704MUTAG reliable?
The price and inventory of ESD8704MUTAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD8704MUTAG is usually 5 days.
3.What payment methods are accepted for ESD8704MUTAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD8704MUTAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD8704MUTAG?
ESD8704MUTAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD8704MUTAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD8704MUTAG?
For technical support, including ESD8704MUTAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD8704MUTAG requirements.
6.How does Aetrix verify that ESD8704MUTAG is sourced from the original manufacturer or authorized distributors?
All ESD8704MUTAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD8704MUTAG meets industry standards.
7.What is the process for return or replacement of ESD8704MUTAG?
All ESD8704MUTAG units undergo pre-shipment inspection (PSI). If there is an issue with ESD8704MUTAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD8704MUTAG part is unused and in its original packaging.
Return procedure for ESD8704MUTAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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