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STMicroelectronics ESDA14V2-1BF3
- Part No.:
- ESDA14V2-1BF3
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 2-XFBGA, FCBGA
- Datasheet:
-
ESDA14V2-1BF3.pdf
- Description:
- TVS DIODE 12VWM 2FLIPCHIP
- Quantity:
- Payment:
- Shipping:
Inventory:1,881
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Product details
Overview
ESDA14V2-1BF3 from STMicroelectronics is a monolithic bidirectional Transil™ diode array designed for single-line ESD protection in high-speed signal paths. It delivers 14.2 V minimum breakdown voltage, 10 pF typical line capacitance at 0 V, 8 kV contact/15 kV air IEC61000-4-2 level 4 ESD immunity, and 2.2 Ω dynamic resistance-enabling robust transient suppression in space-constrained interfaces like USB 2.0 and HDMI data lines.
For engineers reviewing the ESDA14V2-1BF3 datasheet, ESDA14V2-1BF3 pinout, ESDA14V2-1BF3 application, or ESDA14V2-1BF3 equivalent, key selection criteria include clamping voltage under 25 V at 3 A, sub-0.4 mm² PCB footprint, 400 µm bump pitch flip-chip package, and leakage current ≤0.5 µA at 12 V - all critical for preserving signal integrity in portable RF and audio interfaces.
Technical Context
This device implements a silicon avalanche diode structure optimized for fast response (<1 ns) to ESD transients while maintaining low parasitic capacitance. Its bidirectional clamping action symmetrically limits both positive and negative surges without polarity dependence, making it suitable for AC-coupled or differential signaling lines.
The flip-chip (2-bump) construction eliminates bond wires, minimizing inductance and enabling stable clamping performance up to 4 GHz - verified by S21 attenuation measurements showing <−5.6 dB insertion loss across 0.8–4 GHz with a 505 MHz −3 dB point.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage (VBR) | 14.2 V min @ 1 mA - ensures reliable turn-on before damage to downstream ICs |
| Clamping Voltage (VCL) | ≤25 V @ 3 A square pulse - limits transient voltage seen by protected IC input |
| Line Capacitance (Cline) | 10 pF typ @ 0 V, 1 MHz - preserves signal rise time in USB 2.0 (480 Mbps) and audio paths |
| ESD Rating | ±15 kV air / ±8 kV contact per IEC61000-4-2 level 4 - meets industrial and consumer immunity requirements |
| Leakage Current (IRM) | ≤0.5 µA @ 12 V - avoids DC loading on high-impedance sensor or reference lines |
| Dynamic Resistance (RD) | 2.2 Ω typ - reduces voltage overshoot during fast ESD current injection |
Pinout & Package
ESDA14V2-1BF3 uses a 2-bump flip-chip package (0.36 mm × 0.69 mm, 400 µm pitch) with no external leads. The two bumps serve as symmetrical anode/cathode terminals for bidirectional operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Bump 1 | Anode/Cathode (bidirectional) | Common terminal for ESD current path - connects to protected signal line |
| Bump 2 | Anode/Cathode (bidirectional) | Ground reference terminal - must be connected to low-inductance system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables protection of AC-coupled or differential signals without polarity constraints |
| 10 pF line capacitance | Maintains signal integrity in 480 Mbps USB 2.0 and 720p video interfaces |
| Sub-0.4 mm² footprint | Reduces PCB area by >50% vs. standard SOD-323 TVS diodes |
| Flip-chip construction | Eliminates bond wire inductance, supporting stable RF performance to 4 GHz |
Applications
| USB 2.0 Data Lines | HDMI DDC/CEC Channels |
|---|---|
Use Scenario: Protecting D+ and D− pins of USB transceivers against ESD events during hot-plug insertion. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector interface. Use Value: 10 pF capacitance prevents signal degradation at 480 Mbps; clamping <25 V avoids PHY latch-up. | Use Scenario: Shielding HDMI DDC (I²C) and CEC control lines from user-handling ESD in home theater systems. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on 5 V-tolerant open-drain buses. Use Value: ≤0.5 µA leakage prevents pull-up current errors; 14.2 V VBR matches 5 V logic rail margin. |
| Smartphone Audio Jacks | Bluetooth/Wi-Fi Antenna Switch Control |
Use Scenario: Guarding 3.5 mm TRRS jack microphone and headset detection lines against human-body-model ESD. IC Role / Device Role / Timing Role: Single-line ESD clamp between analog audio path and codec GPIO. Use Value: 0.37 mg mass and 0.4 mm² area enable placement within tight jack PCB cutouts. | Use Scenario: Protecting antenna switch control inputs (e.g., SPDT enable pins) from ESD during board handling. IC Role / Device Role / Timing Role: Low-leakage transient suppressor on CMOS logic control lines. Use Value: 2.2 Ω RD minimizes voltage overshoot during 1 ns ESD rise time; 125 °C max Tj supports mobile thermal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar single-line bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESDALC6V1-1BF3 | Lower VBR (5.6 V min), higher Cline (15 pF typ), same 2-bump flip-chip package | Better suited for 3.3 V I/O rails; less ideal for 5 V tolerant lines due to premature conduction | Select when protecting low-voltage logic with tighter clamping margin |
| SMA6J15CA | Unidirectional, DO-214AC package, 15 V VBR, 100 pF Cline, 600 W PPP | Higher capacitance limits use to DC/low-speed lines; larger footprint increases routing inductance | Choose only for cost-sensitive, non-high-speed applications where PCB area is not constrained |
Compared with ESDALC6V1-1BF3 and SMA6J15CA, ESDA14V2-1BF3 uniquely balances 14.2 V standoff, 10 pF capacitance, and 0.4 mm² footprint - making it optimal for 5 V-tolerant high-speed interfaces where both voltage margin and signal fidelity are critical.
Availability
ESDA14V2-1BF3 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI control channel safeguarding, and smartphone audio jack ESD hardening requiring stable component supply across production lifecycles.
Supply support for ESDA14V2-1BF3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in power management, analog, MEMS, and automotive ICs with strong emphasis on industrial and consumer-grade reliability.
This device belongs to ST's Transil™ ESD protection portfolio, engineered specifically for ultra-compact, high-frequency signal line protection in portable and connectivity-focused electronics.
FAQ
What is the maximum operating temperature for ESDA14V2-1BF3?
The device supports an operating junction temperature range of −40 °C to +125 °C, with absolute maximum junction temperature rated at 125 °C. This allows reliable deployment in smartphones, set-top boxes, and industrial HMI panels where ambient temperatures may exceed 85 °C under sustained operation.
Does ESDA14V2-1BF3 require external biasing or control signals?
No - it is a passive, unidirectional-agnostic silicon avalanche diode that operates without any external power, bias, or control. Its bidirectional clamping behavior is inherent to the monolithic P-N junction structure and activates automatically when transient voltage exceeds ±14.2 V.
Can ESDA14V2-1BF3 be used on differential pairs like USB D+/D− simultaneously?
Yes - one device protects a single line, so two ESDA14V2-1BF3 units (one per line) are required for full differential pair protection. Each unit must be placed as close as possible to the connector, with independent low-inductance ground connections to avoid coupling during ESD events.
Is lead-free reflow compatible with the ESDA14V2-1BF3 flip-chip package?
Yes - the device is qualified for three lead-free reflow cycles with peak temperature ≤260 °C, dwell time >220 °C limited to 90 seconds max, and recommended N₂ atmosphere above 150 °C. ST specifies 75–80 µm stencil thickness and 330 × 330 µm² aperture for optimal solder joint formation.
ESDA14V2-1BF3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 2-XFBGA, FCBGA
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 12V
- Voltage - Breakdown (Min):
- 14.2V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 50W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-FlipChip
ESDA14V2-1BF3 FAQ
1.How can I place an order for ESDA14V2-1BF3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDA14V2-1BF3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDA14V2-1BF3 reliable?
The price and inventory of ESDA14V2-1BF3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDA14V2-1BF3 is usually 5 days.
3.What payment methods are accepted for ESDA14V2-1BF3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDA14V2-1BF3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDA14V2-1BF3?
ESDA14V2-1BF3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDA14V2-1BF3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDA14V2-1BF3?
For technical support, including ESDA14V2-1BF3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDA14V2-1BF3 requirements.
6.How does Aetrix verify that ESDA14V2-1BF3 is sourced from the original manufacturer or authorized distributors?
All ESDA14V2-1BF3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDA14V2-1BF3 meets industry standards.
7.What is the process for return or replacement of ESDA14V2-1BF3?
All ESDA14V2-1BF3 units undergo pre-shipment inspection (PSI). If there is an issue with ESDA14V2-1BF3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDA14V2-1BF3 part is unused and in its original packaging.
Return procedure for ESDA14V2-1BF3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDA14V2-1BF3 Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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