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STMicroelectronics ESDA14V2-4BF3
- Part No.:
- ESDA14V2-4BF3
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 5-WFBGA, FCBGA
- Datasheet:
-
ESDA14V2-4BF3.pdf
- Description:
- TVS DIODE 12VWM 5FLIPCHIP
- Quantity:
- Payment:
- Shipping:
Inventory:2,316
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Product details
Overview
ESDA14V2-4BF3 from STMicroelectronics is a quad bidirectional Transil™ ESD protection array in a 5-bump flip-chip package, designed to protect four symmetrical signal lines against IEC 61000-4-2 level 4 (±15 kV air / ±8 kV contact) and MIL-STD-883G Class 3 (±25 kV HBM) transients. It features 12 V minimum stand-off voltage, 14.2 V typical breakdown voltage, and 3.2 Ω dynamic impedance for low clamping under surge.
For engineers reviewing the ESDA14V2-4BF3 datasheet, ESDA14V2-4BF3 pinout, ESDA14V2-4BF3 application, or ESDA14V2-4BF3 equivalent, this device is selected for high-density board-level ESD protection of bidirectional analog/digital interfaces where capacitance ≤15 pF at 0 V and leakage <0.5 µA at 12 V are critical.
Technical Context
This monolithic silicon avalanche diode array integrates four identical bidirectional Transil structures in a single flip-chip die. Each channel provides symmetrical clamping with 14.2 V (min 10 V) breakdown and 3 V clamping at 1 A, enabling robust protection of balanced differential or single-ended signals without polarity constraints.
Its 5-bump layout (A1, A3, B2, C1, C3) assigns dedicated input/output terminals per line plus shared GND, optimized for minimal parasitic inductance (<300 pH per path). The 400 µm pitch and 255 µm bump height support fine-pitch routing on compact PCBs while maintaining 50 W (8/20 µs) peak pulse power handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | IEC 61000-4-2: ±15 kV air / ±8 kV contact; MIL-STD-883G: ±25 kV HBM - meets industrial and consumer immunity requirements |
| Stand-off Voltage | 12 V min - ensures no conduction during normal 12 V rail operation |
| Breakdown Voltage | 14.2 V typ (10–18 V range) - triggers clamping before downstream IC damage thresholds |
| Clamping Voltage | 3 V @ 1 A - limits transient voltage seen by protected ICs to safe levels |
| Junction Capacitance | 15 pF max @ 0 V - preserves signal integrity for USB 2.0, HDMI, and audio lines |
| Leakage Current | <0.5 µA @ 12 V - avoids loading low-power sensor or battery-backed circuits |
| Dynamic Impedance | 3.2 Ω typ - enables fast response and low-voltage overshoot during ESD events |
Pinout & Package
ESDA14V2-4BF3 uses a 5-bump flip-chip package (0.935 mm × 0.935 mm, 400 µm pitch) with solder bumps on the active side. The bump-side layout supports direct die attach to PCB pads, minimizing trace inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Line 1 Anode/Cathode | Bidirectional ESD path for first signal line - symmetric conduction in both polarities |
| A3 | Line 2 Anode/Cathode | Bidirectional ESD path for second signal line - independent clamping channel |
| B2 | GND | Common ground reference for all four channels - low-inductance return path |
| C1 | Line 3 Anode/Cathode | Bidirectional ESD path for third signal line - isolated from adjacent lines |
| C3 | Line 4 Anode/Cathode | Bidirectional ESD path for fourth signal line - enables full quad-line protection |
Key Features
| Feature | Design Value |
|---|---|
| Quad bidirectional Transil structure | Four independent, symmetrical ESD paths in one die - eliminates need for eight discrete diodes |
| Low 15 pF capacitance @ 0 V | Preserves rise time and bandwidth for high-speed interfaces up to 100 MHz |
| 3.2 Ω dynamic impedance | Reduces clamping overshoot and improves energy diversion efficiency during fast transients |
| Flip-chip 400 µm pitch | Enables placement directly beneath connectors or ICs - reduces PCB area by >70% vs. SOT-23 arrays |
| ECOPACK® lead-free construction | Complies with RoHS and halogen-free standards - suitable for green manufacturing |
Applications
| USB 2.0 Data Lines | HDMI TMDS Channels |
|---|---|
Use Scenario: Protecting D+ and D− pins of USB 2.0 transceivers from ESD events during hot-plug insertion. IC Role / Device Role / Timing Role: Bidirectional clamping device placed between connector and PHY, operating transparently during 480 Mbps signaling. Use Value: 15 pF capacitance avoids signal degradation; 3 V clamping prevents PHY latch-up or damage at ±8 kV contact discharge. | Use Scenario: Shielding three TMDS data pairs and one clock pair in HDMI source devices against cable-discharge events. IC Role / Device Role / Timing Role: Quad-channel ESD suppressor mounted adjacent to HDMI connector, clamping transients before reaching serializer IC. Use Value: Symmetrical 14.2 V breakdown matches HDMI common-mode range; 50 W pulse rating handles multi-kV surges without degradation. |
| Smartphone Audio Jacks | Industrial RS-485 Nodes |
Use Scenario: Safeguarding stereo headphone/mic lines (L/R/GND/MIC) in portable devices exposed to human-body ESD. IC Role / Device Role / Timing Role: Compact quad array replacing four 0201 TVS diodes, routed under 3.5 mm jack footprint. Use Value: 0.5 µA leakage prevents battery drain; 12 V stand-off accommodates bias voltages in analog audio paths. | Use Scenario: Protecting half-duplex RS-485 transceiver A/B lines and DE/RE control lines in factory automation nodes. IC Role / Device Role / Timing Role: Bidirectional clamp on differential bus lines and unidirectional control lines sharing common GND terminal. Use Value: 25 kV HBM rating exceeds industrial immunity requirements; 3.2 Ω Rd ensures fast response to fast-rising EFT bursts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESDALC6V1-4M3 | Lower 6.1 V breakdown, 12 pF capacitance, SOT-323 package | Better suited for 3.3 V logic; larger footprint than flip-chip | Select when lower clamping voltage is required and board space permits SMT placement |
| TPD4E05U06DQAR | 6 V breakdown, 0.5 pF capacitance, 1.6 mm × 1.6 mm DQA package | Ultra-low capacitance ideal for USB 3.0/PCIe; higher cost and different pinout | Choose for high-speed serial links where sub-1 pF loading is mandatory |
Compared with ESDALC6V1-4M3 and TPD4E05U06DQAR, the ESDA14V2-4BF3 offers superior pulse power handling (50 W vs. 24–30 W) and smallest footprint (0.88 mm²), making it optimal for space-constrained 12 V interface protection where moderate capacitance is acceptable.
Availability
ESDA14V2-4BF3 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI port hardening, and smartphone audio jack ESD suppression requiring stable component supply across high-mix consumer electronics production.
Supply support for ESDA14V2-4BF3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power ICs, sensors, and protection devices for automotive, industrial, and consumer markets.
The Transil™ ESD protection product line delivers monolithic, low-capacitance, high-surge-rated arrays specifically engineered for board-level I/O hardening in space-constrained portable and communication equipment.
FAQ
What is the maximum operating temperature for ESDA14V2-4BF3?
The device operates reliably from –40 °C to +125 °C ambient temperature. Its junction temperature must not exceed 125 °C during surge events, and thermal derating applies above 85 °C ambient per the absolute ratings table. The flip-chip construction provides efficient heat transfer to the PCB ground plane.
Does ESDA14V2-4BF3 require external biasing or control signals?
No. ESDA14V2-4BF3 is a passive, voltage-triggered avalanche diode array with no external connections beyond its five bumps. It operates automatically when transient voltage exceeds 14.2 V, requiring no power supply, enable pin, or configuration - fully transparent during normal signal operation.
How is the GND bump (B2) used in layout?
Bump B2 serves as the common cathode/anode reference for all four bidirectional channels. It must be connected to a low-impedance PCB ground plane with short, wide traces - ideally via multiple vias - to minimize inductance and ensure effective clamping. Separating B2 from signal return paths degrades ESD performance.
Can ESDA14V2-4BF3 replace discrete 0201 TVS diodes in existing designs?
Yes, but layout revision is required: the 5-bump flip-chip demands precise stencil design (300 µm pad opening), reflow profile optimization for bump collapse, and alignment verification. Electrical replacement is direct - same clamping behavior - but mechanical integration differs significantly from discrete SMT components.
ESDA14V2-4BF3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 5-WFBGA, FCBGA
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 12V
- Voltage - Breakdown (Min):
- 14.2V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 50W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-FlipChip (0.94x0.94)
ESDA14V2-4BF3 FAQ
1.How can I place an order for ESDA14V2-4BF3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDA14V2-4BF3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDA14V2-4BF3 reliable?
The price and inventory of ESDA14V2-4BF3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDA14V2-4BF3 is usually 5 days.
3.What payment methods are accepted for ESDA14V2-4BF3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDA14V2-4BF3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDA14V2-4BF3?
ESDA14V2-4BF3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDA14V2-4BF3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDA14V2-4BF3?
For technical support, including ESDA14V2-4BF3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDA14V2-4BF3 requirements.
6.How does Aetrix verify that ESDA14V2-4BF3 is sourced from the original manufacturer or authorized distributors?
All ESDA14V2-4BF3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDA14V2-4BF3 meets industry standards.
7.What is the process for return or replacement of ESDA14V2-4BF3?
All ESDA14V2-4BF3 units undergo pre-shipment inspection (PSI). If there is an issue with ESDA14V2-4BF3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDA14V2-4BF3 part is unused and in its original packaging.
Return procedure for ESDA14V2-4BF3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDA14V2-4BF3 Tags
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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