STMicroelectronics ESDA17-5SC6

Overview

ESDA17-5SC6 from STMicroelectronics is a monolithic 5-channel unidirectional Transil™ ESD protection array in SOT23-6L package, with minimum breakdown voltage of 17 V, 150 W peak pulse power (8/20 µs), <100 nA leakage at stand-off voltage, and clamping voltage ≤33 V at 15 A, deployed for I/O line protection in cellular handset interfaces.

For engineers reviewing the ESDA17-5SC6 datasheet, ESDA17-5SC6 pinout, ESDA17-5SC6 application, or ESDA17-5SC6 equivalent, key selection criteria include unidirectional channel count, IEC 61000-4-2 Level 4 compliance (±15 kV air / 8 kV contact), junction capacitance (10 pF @ 0 V), dynamic impedance (14 Ω), and thermal derating behavior above 25 °C.

Technical Context

The device integrates five independent avalanche diodes in a single SOT23-6L package, each configured as a unidirectional Transil structure with cathode-to-GND orientation. It operates in reverse-biased standoff mode until ESD transients exceed V_BR (17–19 V), triggering low-impedance clamping to limit voltage stress on downstream ICs.

Clamping performance is characterized by V_CL ≤33 V at I_PP = 15 A (2.5 µs square pulse), with dynamic impedance R_d = 14 Ω and temperature coefficient α_T = 0.0001 /°C. Junction capacitance remains stable at 10 pF (0 V bias, 1 MHz), supporting high-speed data lines up to USB 2.0 speeds.

Key Specifications

Pinout & Package

SOT23-6L package: 6-pin surface-mount, lead-free, UL94 V0 epoxy, footprint per Figure 10 (D = 3.05 mm, E = 1.75 mm, e = 0.95 mm).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with ESDA17-5SC6, ESD5Z5.0T1G offers lower voltage protection but lacks multi-line integration and speed; TPD2E001DRYR provides higher power rating but introduces bidirectional leakage and reduced channel count-neither matches the 5-channel, 17 V, 10 pF combination optimized for compact high-speed digital interfaces.

Availability

ESDA17-5SC6 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, mobile phone touchscreen I/O shielding, and set-top box HDMI port hardening requiring stable component supply across production lifecycles.

Supply support for ESDA17-5SC6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, MCU, power, and protection devices for industrial, automotive, and consumer markets.

The Transil™ ESD protection product line targets high-reliability interface hardening, emphasizing low capacitance, precise breakdown control, and multi-line integration for space-constrained portable electronics.

FAQ

What is the maximum continuous reverse standoff voltage for ESDA17-5SC6?

The maximum recommended continuous reverse standoff voltage is 14 V, derived from VRM = 14 V in Table 2. Operating above this voltage risks premature conduction and accelerated aging due to increased leakage current, especially at elevated temperatures where IR doubles every ~10 °C per Figure 8.

Can ESDA17-5SC6 be used on bidirectional data lines like I²C?

No - ESDA17-5SC6 is unidirectional (anode-to-GND), making it unsuitable for bidirectional buses such as I²C that require symmetrical clamping above and below GND. Using it on I²C would block the low-state pull-down path and disrupt bus arbitration; a bidirectional array like ESDALC6V1-1U2 is required instead.

How does thermal derating affect peak pulse power at 100 °C junction temperature?

At Tj = 100 °C, peak pulse power drops to approximately 65% of the 25 °C rating (150 W), or ~98 W, based on the relative power curve in Figure 3. This derating ensures safe operation within the 125 °C absolute maximum junction temperature limit during repetitive ESD events.

Is the SOT23-6L package compatible with standard reflow profiles for lead-free assembly?

Yes - the device is qualified for lead-free soldering with a maximum lead temperature of 260 °C for 10 seconds at 5 mm from the case body (Table 1). It complies with J-STD-020D moisture sensitivity level 1 and supports standard IPC/JEDEC reflow profiles including peak temperatures up to 260 °C.