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STMicroelectronics ESDA5-1BF4
- Part No.:
- ESDA5-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDA5-1BF4.pdf
- Description:
- TVS DIODE 5VWM 11VC 0201
- Quantity:
- Payment:
- Shipping:
Inventory:28,417
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Product details
Overview
ESDA5-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode for ESD protection of I/O lines, featuring 11 V clamping voltage (IEC 61000-4-2, ±8 kV contact), 45 pF line capacitance, and 0201 package occupying only 0.18 mm² PCB area - deployed in smartphone data ports and USB interfaces.
For engineers reviewing the ESDA5-1BF4 datasheet, ESDA5-1BF4 pinout, ESDA5-1BF4 application, or ESDA5-1BF4 equivalent, key selection criteria include low clamping voltage under 8 kV contact discharge, sub-100 nA leakage at 5 V, and compatibility with high-density portable PCB layouts requiring minimal parasitic capacitance.
Technical Context
The ESDA5-1BF4 implements a silicon avalanche diode structure optimized for fast transient response to ±15 kV air and ±8 kV contact ESD events per IEC 61000-4-2. Its bidirectional symmetry enables protection of AC-coupled or differential signal lines without polarity constraints.
Clamping occurs at 11 V within 30 ns of 8 kV contact discharge, with dynamic resistance below 1 Ω ensuring minimal voltage overshoot. Junction capacitance remains stable at 45 pF (1 MHz, 0 V bias), supporting high-speed interfaces up to ~300 Mbps without signal integrity degradation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Clamping Voltage (VCL) | 11 V at 8 kV contact discharge - limits transient voltage seen by protected IC to safe level during ESD event |
| Breakdown Voltage (VBR) | 5.8 V min at 1 mA - ensures reliable turn-on before system-level damage threshold |
| Leakage Current (IRM) | 100 nA max at 5 V - avoids signal distortion or power drain in battery-powered devices |
| Line Capacitance (CLINE) | 45 pF at 0 V, 1 MHz - supports USB 2.0 and MIPI D-PHY interfaces without bandwidth loss |
| ESD Rating | ±15 kV air / ±8 kV contact per IEC 61000-4-2 - meets industrial and consumer immunity requirements |
| Package Size | 0201 (0.6 × 0.3 mm) - enables placement adjacent to connectors or IC pads in space-constrained designs |
Pinout & Package
ESDA5-1BF4 is a two-terminal bidirectional device in a 0201 surface-mount package (JEDEC MS-013 variant). No polarity marking; terminals are functionally identical and interchangeable.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode/Cathode (1) | ESD current path input | Accepts transient surge from either direction; connects to protected signal line |
| Anode/Cathode (2) | ESD current path return | Routes clamped current to ground plane; requires low-inductance PCB ground connection |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low PCB footprint | 0.18 mm² - fits within tight spacing near micro-B/USB-C connectors or camera module flex cables |
| Bidirectional clamping | Identical 11 V clamping for +8 kV and –8 kV contact discharge - eliminates need for polarity-aware layout |
| ECOPACK®2 compliance | Lead-free, halogen-free, RoHS-compliant - satisfies global environmental regulations without derating |
| Low dynamic resistance | <1 Ω - minimizes voltage overshoot during fast-rising ESD transients (30 ns rise time) |
Applications
| Smartphone Data Port Protection | USB 2.0 Interface Protection |
|---|---|
Use Scenario: Protecting micro-USB or USB-C D+/D− lines against user-handling ESD in handheld devices. IC Role / Device Role / Timing Role: Standalone TVS placed directly at connector entry point, shunting ESD energy to ground before reaching PHY IC. Use Value: 45 pF capacitance avoids signal rise-time degradation on 480 Mbps USB 2.0 links; 11 V clamping prevents PHY latch-up. | Use Scenario: Safeguarding host/device USB 2.0 transceivers in tablets and accessories during cable insertion/removal. IC Role / Device Role / Timing Role: Bidirectional transient suppressor mounted between connector and USB PHY, referenced to local ground plane. Use Value: Symmetrical ±8 kV contact rating ensures robustness regardless of plug orientation; 0201 size allows placement <1 mm from connector pad. |
| Digital Camera Sensor Interface | MIPI D-PHY Lane Protection |
Use Scenario: Shielding high-speed image sensor data lanes (e.g., OV5640 parallel interface) from ESD during lens or module handling. IC Role / Device Role / Timing Role: Single-line TVS per data line, placed immediately after flex-to-PCB transition point. Use Value: 100 nA leakage prevents DC offset drift in analog video signals; 0.18 mm² footprint avoids routing detours. | Use Scenario: Protecting MIPI D-PHY clock and data lanes in smartphone displays and camera modules. IC Role / Device Role / Timing Role: Per-lane ESD clamp located at display/camera flex connector, minimizing stub length to preserve 1.5 Gbps signal integrity. Use Value: 45 pF capacitance maintains D-PHY eye diagram margin; bidirectional operation matches AC-coupled differential signaling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E05U06DPYR (TI) | 6.5 V breakdown, 12 V clamping, 0.5 pF lower capacitance (44.5 pF) | Slightly tighter timing margin for >500 Mbps interfaces; same 0201 footprint | Prefer when lowest possible capacitance is critical and 0.5 V higher clamping is acceptable |
| ESD9X5.0ST5G (ON Semi) | 5.0 V breakdown, 13.5 V clamping, 55 pF capacitance, SOD-923 package (larger) | Higher clamping increases risk of downstream IC stress; larger package consumes 3× more board area | Select only if legacy SOD-923 assembly infrastructure exists and 45 pF is not achievable |
Compared with TPD1E05U06DPYR and ESD9X5.0ST5G, ESDA5-1BF4 delivers optimal balance of low clamping (11 V), moderate capacitance (45 pF), and minimal footprint (0.18 mm²), making it preferred for next-gen compact mobile interfaces where both ESD robustness and signal fidelity are constrained.
Availability
ESDA5-1BF4 is available at Aetrix Electronics and suitable for smartphone data port protection, USB 2.0 interface hardening, and MIPI D-PHY lane safeguarding requiring stable component supply across high-volume consumer electronics production.
Supply support for ESDA5-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, MCU, power, and protection devices for industrial, automotive, and consumer markets.
ESDA5-1BF4 belongs to ST's ECOPACK®2-compliant ESD protection portfolio, engineered specifically for ultra-compact, high-speed digital interfaces in battery-powered portable electronics.
FAQ
What is the maximum operating temperature for ESDA5-1BF4?
The ESDA5-1BF4 has a specified junction temperature range of –40 °C to +150 °C. This allows reliable operation in thermally demanding environments such as inside sealed smartphone chassis or near power amplifiers, provided PCB thermal design maintains junction temperature within limits during sustained ESD events.
Does ESDA5-1BF4 require a dedicated ground plane connection?
Yes - effective ESD clamping depends on a low-inductance path to a solid ground plane. The device must be placed within 2 mm of the protected signal's ground via, with a direct copper pour connecting both terminals to minimize loop inductance and prevent voltage overshoot during fast transients.
Can ESDA5-1BF4 protect against electrical fast transients (EFT) per IEC 61000-4-4?
No - ESDA5-1BF4 is characterized and rated exclusively for ESD per IEC 61000-4-2. While it may absorb some EFT energy, its 110 W peak pulse power rating is defined for 8/20 µs waveforms typical of ESD, not the 5/50 ns bursts of IEC 61000-4-4; dedicated EFT suppressors are required for that standard.
Is solder reflow profile information available for ESDA5-1BF4?
Yes - ST specifies a standard lead-free reflow profile with peak temperature of 260 °C for 10 seconds, compatible with ECOPACK®2-compliant assembly. Recommended stencil thickness is 80 µm, and Type 4 solder paste (20–48 µm particles) is required to ensure consistent wetting on the 0201 terminations.
ESDA5-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 5.8V
- Voltage - Clamping (Max) @ Ipp:
- 11V
- Current - Peak Pulse (10/1000µs):
- 10A (8/20µs)
- Power - Peak Pulse:
- 110W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 45pF @ 1MHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDA5-1BF4 FAQ
1.How can I place an order for ESDA5-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDA5-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDA5-1BF4 reliable?
The price and inventory of ESDA5-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDA5-1BF4 is usually 5 days.
3.What payment methods are accepted for ESDA5-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDA5-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDA5-1BF4?
ESDA5-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDA5-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDA5-1BF4?
For technical support, including ESDA5-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDA5-1BF4 requirements.
6.How does Aetrix verify that ESDA5-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESDA5-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDA5-1BF4 meets industry standards.
7.What is the process for return or replacement of ESDA5-1BF4?
All ESDA5-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDA5-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDA5-1BF4 part is unused and in its original packaging.
Return procedure for ESDA5-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDA5-1BF4 Tags
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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