STMicroelectronics ESDA6V1-5P6

Overview

ESDA6V1-5P6 from STMicroelectronics is a 5-line unidirectional ESD protection diode array in SOT666 package, designed for IEC 61000-4-2 Level 4 compliance (±20 kV contact / ±25 kV air discharge), with 6.1 V breakdown voltage, 150 W peak pulse power (8/20 µs), and 70 pF line capacitance at 0 V - used to safeguard USB, HDMI, and industrial I/O interfaces against electrostatic discharge.

For engineers reviewing the ESDA6V1-5P6 datasheet, ESDA6V1-5P6 pinout, ESDA6V1-5P6 application, or ESDA6V1-5P6 equivalent, key selection criteria include clamping voltage under 20 V at 10 A, junction temperature range of –40 °C to +150 °C, bidirectional configuration flexibility via GND pin assignment, and SOT666 footprint compatibility with IPC7531 standards.

Technical Context

This device implements five monolithically integrated avalanche diodes in a single SOT666 die, each configured as a cathode-to-GND unidirectional clamp. It operates within a –40 °C to +150 °C junction temperature range and supports reflow soldering up to 260 °C for 10 s.

The ESDA6V1-5P6 achieves 150 W peak pulse power dissipation (8/20 µs waveform) at 25 °C initial junction temperature, with clamping voltage ≤20 V at 10 A peak current and leakage current ≤0.5 µA at 3 V reverse bias - enabling robust protection without signal integrity degradation in high-speed data lines.

Key Specifications

Pinout & Package

SOT666 6-pin plastic package (JEDEC MO-220 variant), 1.6 mm × 1.6 mm × 0.6 mm body, matte tin lead finish, MSL Level 1, compliant with IPC7531 footprint and JEDEC registered outline.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with ESDA6V1P6, the ESDA6V1-5P6 offers identical protection performance in a standard SOT666 (not IP) variant optimized for legacy assembly lines; versus ESDA14V2BP6, it delivers lower clamping voltage and higher pulse power for 3.3 V/5 V interfaces but with higher line capacitance.

Availability

ESDA6V1-5P6 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI 1.4 port hardening, and industrial I/O module design requiring stable component supply across production lifecycles.

Supply support for ESDA6V1-5P6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and protection devices for industrial, automotive, and consumer markets.

The ESDAxxxP6 series belongs to ST's ESD protection portfolio, engineered specifically for multi-line I/O hardening in space-constrained applications where IEC 61000-4-2 Level 4 compliance and low capacitance are mandatory.

FAQ

What is the maximum continuous reverse working voltage (V_RWM) for ESDA6V1-5P6?

The ESDA6V1-5P6 has a maximum continuous reverse working voltage of 3 V, derived from its 6.1 V minimum breakdown voltage and typical 3 V clamping threshold at low currents. This rating ensures safe operation on 3.3 V logic lines while maintaining sufficient margin above nominal rail voltage to prevent premature conduction during normal operation.

Can ESDA6V1-5P6 be used to protect bidirectional data lines like I²C?

Yes - ESDA6V1-5P6 can protect bidirectional lines such as I²C by assigning one I/O pin (e.g., I/O5) as a local ground reference, allowing the remaining four anodes to clamp both positive and negative transients relative to that node. This configuration leverages the device's unidirectional architecture to emulate bidirectional behavior without external components.

Does ESDA6V1-5P6 meet automotive AEC-Q200 requirements?

No - ESDA6V1-5P6 is not qualified to AEC-Q200. It is rated for industrial and consumer applications with operating junction temperature up to +150 °C and storage temperature from –55 °C to +150 °C, but lacks the extended temperature cycling, humidity bias, and mechanical shock testing required for automotive qualification.

What is the recommended PCB layout practice for minimizing inductance in ESDA6V1-5P6 installations?

Place ESDA6V1-5P6 within 3 mm of the protected connector, route protected traces directly to I/O pins without vias, use solid ground plane beneath the device, and connect the GND pin to the system ground plane with ≥2 thermal vias (0.3 mm diameter). Avoid stubs or neck-downs in the GND path to maintain low-inductance return paths for ESD current.