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STMicroelectronics ESDA6V1U1
- Part No.:
- ESDA6V1U1
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ESDA6V1U1.pdf
- Description:
- TVS DIODE 5VWM 8-SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:8,983
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Product details
Overview
ESDA6V1U1 from STMicroelectronics is a monolithic 6-channel unidirectional Transil array designed for ESD protection of data and transmission lines in logic-level interfaces. It features 6.1 V minimum breakdown voltage (VBR), 200 W peak pulse power (8/20 µs), <2 µA max leakage current at VRM, clamping voltage ≤12 V at 25 A, and SO-8 package-used in parallel port, GSM handset, and car radio interface protection.
For engineers reviewing the ESDA6V1U1 datasheet, ESDA6V1U1 pinout, ESDA6V1U1 application, or ESDA6V1U1 equivalent, key selection criteria include clamping voltage under 25 A surge, dynamic resistance (Rd = 0.5 Ω typ), low capacitance (6 pF @ 0 V), IEC61000-4-2 Level 4 compliance, and SO-8 thermal performance up to 125 °C junction temperature.
Technical Context
The ESDA6V1U1 integrates six identical unidirectional TVS diodes in a single SO-8 package, each with independent anode-cathode paths referenced to ground. Its clamping behavior follows VCL = VBR + Rd × IPP, where Rd = 0.5 Ω (typ) enables precise transient voltage prediction for 2.5 µs rectangular surges.
Designed specifically for fast ESD events (not sustained overvoltage), it operates with stand-off voltage VRM = 6 V, breakdown VBR = 6.1–7.2 V, and clamps negative transients to ~0.7 V below ground via forward conduction-ensuring logic-level compatibility without latch-up risk in 3.3 V/5 V systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBR (min) | 6.1 V - Ensures reliable turn-on above 3.3 V/5 V logic supply rails without false triggering |
| VCL @ IPP = 25 A | ≤12 V - Limits voltage seen by protected IC during IEC61000-4-2 contact discharge |
| Rd (typ) | 0.5 Ω - Enables accurate clamping voltage calculation (VCL = VBR + Rd × IPP) for layout-aware design |
| C @ 0 V | 6 pF - Minimizes signal distortion on high-speed data lines (e.g., parallel port, UART) |
| IPP (8/20 µs) | 25 A - Supports full IEC61000-4-2 Level 4 (±8 kV contact / ±15 kV air) immunity |
| IR @ VRM | <2 µA - Prevents DC loading on sensitive input buffers in battery-powered devices |
| Tj (max) | 125 °C - Allows operation in automotive cabin and industrial control enclosures |
Pinout & Package
SO-8 plastic surface-mount package (tape-and-reel, 0.08 g), 1.27 mm pitch, 5.0 × 6.2 mm body, 1.75 mm height. Pin 1 marked with notch or dot.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode of Channel 1 | Connects to protected I/O line; cathode tied to VCC or ground depending on polarity configuration |
| 2 | Cathode of Channel 1 | Typically connected to VCC for positive transient clamping or GND for negative-only protection |
| 3 | Anode of Channel 2 | Dedicated I/O protection path; electrically isolated from other channels |
| 4 | Cathode of Channel 2 | Shared cathode node option available per application circuit; not internally bonded to Pin 2 |
| 5 | GND | Common reference for all six channels; must be low-inductance connection to system ground plane |
| 6 | Anode of Channel 3 | Third independent protection path; supports multi-line interface protection (e.g., DB25 parallel port) |
| 7 | Cathode of Channel 3 | Configurable as VCC or GND return; determines clamping polarity for associated anode |
| 8 | No Connect | Internally unused; left floating or grounded per PCB layout best practice to reduce parasitic coupling |
Key Features
| Feature | Design Value |
|---|---|
| 6-channel unidirectional ESD protection | Enables full parallel port (8-bit + strobe/ack) or multi-signal interface protection in one SO-8 footprint |
| Dynamic resistance (Rd = 0.5 Ω typ) | Allows precise clamping voltage modeling for PCB trace impedance matching and signal integrity validation |
| IEC61000-4-2 Level 4 compliance | Guarantees ≥±8 kV contact / ≥±15 kV air discharge immunity without external components |
| Low capacitance (6 pF @ 0 V) | Preserves rise/fall times on signals up to ~100 Mbps (e.g., legacy printer handshaking, UART) |
| SO-8 thermal rating (Tj max = 125 °C) | Supports continuous operation in automotive infotainment head units and industrial HMI panels |
Applications
| Parallel Port Protection | GSM Handset Interface |
|---|---|
Use Scenario: Protecting DB25 parallel port pins (DATA0–DATA7, BUSY, ACK, STROBE) against ESD during cable insertion/removal in office printers. IC Role / Device Role / Timing Role: Unidirectional clamping device placed between connector and host controller GPIO, with cathodes tied to 5 V rail. Use Value: Limits transient voltage to ≤12 V during ±15 kV air discharge, preventing latch-up or gate oxide damage in MCU I/O cells. | Use Scenario: Shielding SIM card slot, keypad, and audio jack connections in GSM handsets from user-hand ESD events. IC Role / Device Role / Timing Role: Ground-referenced unidirectional TVS array suppressing negative transients to 0.7 V and positive to 12 V on low-voltage (2.8–3.3 V) rails. Use Value: Maintains <2 µA leakage to extend battery life while passing IEC61000-4-2 Level 4 testing across all interface points. |
| Car Radio Front Panel | Industrial Control I/O Module |
Use Scenario: Safeguarding push-button, rotary encoder, and display ribbon cable inputs in automotive head units exposed to dry-climate ESD. IC Role / Device Role / Timing Role: Six independent protection paths routed to microcontroller GPIOs, with shared GND (Pin 5) and localized decoupling. Use Value: Delivers 125 °C junction rating and 25 kV HBM robustness required for AEC-Q200-aligned designs without derating. | Use Scenario: Protecting RS-232/RS-485 transceiver enable lines and status outputs in programmable logic controllers (PLCs). IC Role / Device Role / Timing Role: Low-capacitance (6 pF), low-leakage (<2 µA) clamp ensuring signal fidelity on 115.2 kbps serial links. Use Value: Prevents false triggering of optocoupled isolation stages during factory-floor ESD events near metal enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESDALC6V1-1U2 | Lower capacitance (0.9 pF), same VBR (6.1 V), lower IPP (12 A), SOT-23-6 package | Better for >100 Mbps USB 1.1 or I²C; insufficient for parallel port 25 A surge handling | Select when board space is critical and peak current demand ≤12 A |
| SMA6J6.0A | Single-channel, higher VBR (6.67 V min), 600 W PPP, DO-214AC package | Requires six discrete devices; higher thermal mass but no channel crosstalk; unsuitable for dense routing | Select when discrete layout control is required and SO-8 footprint is unavailable |
Compared with ESDALC6V1-1U2 and SMA6J6.0A, the ESDA6V1U1 uniquely balances multi-channel integration, 25 A surge capability, and SO-8 manufacturability-making it optimal for cost-sensitive, high-density ESD protection where coordinated clamping across multiple lines is essential.
Availability
ESDA6V1U1 is available at Aetrix Electronics and suitable for parallel port protection, GSM handset interface hardening, and automotive car radio front-panel ESD mitigation requiring stable component supply and long-term lifecycle support.
Supply support for ESDA6V1U1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, MEMS, power, and microcontroller solutions for industrial, automotive, and consumer markets.
The ESDA family targets board-level ESD immunity in cost-constrained, high-volume applications-emphasizing predictable clamping, low capacitance, and standard package compatibility for rapid integration into legacy and new designs.
FAQ
What is the maximum clamping voltage of ESDA6V1U1 under IEC61000-4-2 Level 4 test conditions?
The ESDA6V1U1 clamps to ≤12 V at 25 A (8/20 µs waveform), which corresponds to the peak current generated during ±15 kV air discharge per IEC61000-4-2 Level 4. This value is derived from VCL = VBR + Rd × IPP using VBR = 6.1 V and Rd = 0.5 Ω, verified in Figure 3 of the official datasheet.
Can ESDA6V1U1 be used for bidirectional signal lines like USB D+ and D−?
No-ESDA6V1U1 is strictly unidirectional and lacks symmetrical breakdown for AC-coupled or differential lines. For USB 1.1/2.0, ST recommends ESDALC6V1-1U2 or ESDCAN03-2BW, which provide matched bidirectional clamping and sub-1 pF capacitance per line.
Is Pin 8 (NC) required to be grounded or left floating in PCB layout?
Pin 8 is internally unconnected and should be left floating per STMicroelectronics' layout guidance. However, grounding it to local ground plane reduces potential EMI coupling in high-noise environments-this does not affect electrical performance but improves EMC margin in certified designs.
How does the 2.5 µs test waveform relate to real-world ESD events?
The 2.5 µs rectangular pulse reflects the dominant energy content of human-body-model ESD (HBM), which has rise times <1 ns and durations ~100–200 ns. Using this shorter wave ensures Rd measurement accuracy and avoids thermal inertia artifacts seen with 8/20 µs tests-directly correlating to actual ESD stress on silicon.
ESDA6V1U1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 6.1V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 200W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
ESDA6V1U1 FAQ
1.How can I place an order for ESDA6V1U1 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDA6V1U1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDA6V1U1 reliable?
The price and inventory of ESDA6V1U1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDA6V1U1 is usually 5 days.
3.What payment methods are accepted for ESDA6V1U1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDA6V1U1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDA6V1U1?
ESDA6V1U1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDA6V1U1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDA6V1U1?
For technical support, including ESDA6V1U1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDA6V1U1 requirements.
6.How does Aetrix verify that ESDA6V1U1 is sourced from the original manufacturer or authorized distributors?
All ESDA6V1U1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDA6V1U1 meets industry standards.
7.What is the process for return or replacement of ESDA6V1U1?
All ESDA6V1U1 units undergo pre-shipment inspection (PSI). If there is an issue with ESDA6V1U1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDA6V1U1 part is unused and in its original packaging.
Return procedure for ESDA6V1U1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDA6V1U1 Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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