STMicroelectronics ESDALC12-1T2
- Part No.:
- ESDALC12-1T2
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- SOD-882
- Datasheet:
-
ESDALC12-1T2.pdf
- Description:
- TVS DIODE 10VWM 20VC SOD882
- Quantity:
- Payment:

- Shipping:

Inventory:11,182
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ESDALC12-1T2 from STMicroelectronics is a unidirectional single-line Transil™ TVS diode designed for ESD and electrical overstress (EOS) protection of I/O lines in portable and miniaturized electronics. It features 12 V minimum breakdown voltage (VBR), 10 V stand-off voltage (VRM), 20 V clamping voltage at 1 A (VCL), 15 pF typical junction capacitance, and SOD882T ultra-thin 0.4 mm package - optimized for high-density PCBs in cellular handset interfaces.
For engineers reviewing the ESDALC12-1T2 datasheet, ESDALC12-1T2 pinout, ESDALC12-1T2 application, or ESDALC12-1T2 equivalent, key selection criteria include IEC 61000-4-2 Level 4 compliance (±15 kV air / ±8 kV contact discharge), low dynamic impedance (1.9 Ω), and sub-200 nA leakage at 10 V - critical for signal integrity in high-speed data lines.
Technical Context
The ESDALC12-1T2 operates as a clamping-type transient suppressor with avalanche breakdown triggered above 12 V, limiting transient energy to protected ICs via fast (<1 ns) response and low VCL/VBR ratio (1.67). Its unidirectional architecture supports DC-biased signal paths such as USB D+ or HDMI TMDS lines.
Designed for integration into space-constrained layouts, it leverages SOD882T's 1.0 × 0.6 mm footprint and 0.4 mm height, with cathode-bar marking for unambiguous polarity identification. Junction capacitance remains stable below 18 pF up to 5 V reverse bias, preserving signal rise time in >100 Mbps interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage (VBR) | 12 V min. @ 1 mA - ensures reliable triggering before damage to downstream 3.3 V or 5 V logic. |
| Stand-off Voltage (VRM) | 10 V - allows safe operation under normal 3.3 V/5 V I/O bias without leakage-induced power loss. |
| Clamping Voltage (VCL) | 20 V @ 1 A, 8/20 µs - limits transient peak to safe margin below absolute maximum ratings of protected ICs. |
| Junction Capacitance (CJ) | 15–18 pF @ 0 V, 1 MHz - enables use on USB 2.0, HDMI, and MIPI D-PHY without signal degradation. |
| Dynamic Impedance (Rd) | 1.9 Ω - reduces voltage overshoot during fast transients, improving clamping precision. |
| ESD Robustness | ±15 kV air / ±8 kV contact per IEC 61000-4-2 Level 4 - meets industrial and consumer end-equipment immunity requirements. |
| Leakage Current (IRM) | 200 nA max. @ 10 V - minimizes standby power draw in battery-powered devices. |
Pinout & Package
Supplied in SOD882T package: 1.00 × 0.60 mm body, 0.47 mm nominal height, cathode indicated by bar marking on Pin 1 side. Compatible with standard reflow profiles including ST's ECOPACK®-recommended 240–245 °C peak.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode | Connected to protected I/O line; forward-biased during positive transients. |
| Pin 2 | Cathode | Connected to ground reference; defines unidirectional clamping direction and polarity. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile packaging | 0.4 mm max height - enables placement beneath connectors and in stacked PCB assemblies. |
| Low clamping factor (VCL/VBR) | 1.67 - delivers tighter voltage control than typical TVS diodes (>1.8), reducing stress on protected ICs. |
| High-frequency signal integrity | 15–18 pF capacitance - maintains <10% signal distortion on 480 Mbps USB 2.0 differential pairs. |
| Lead-free and RoHS-compliant | ECOPACK® Grade 2 - satisfies global environmental regulations without compromising thermal performance. |
| Fast ESD response | <1 ns turn-on - intercepts ESD events before they propagate into sensitive analog or RF front-ends. |
Applications
| USB 2.0 Interface Protection | HDMI Source Port Protection |
|---|---|
Use Scenario: ESD suppression on D+ and D− lines of smartphone USB OTG ports exposed to frequent plug/unplug cycles. IC Role / Device Role / Timing Role: Unidirectional clamping TVS placed directly at connector entry point to shunt transients to chassis ground. Use Value: Prevents latch-up and gate oxide damage in USB PHY ICs while maintaining <100 ps signal skew between differential pairs. |
Use Scenario: Protecting HDMI transmitter pins (TMDS clock/data channels) in set-top boxes subjected to user-handling ESD. IC Role / Device Role / Timing Role: Low-capacitance TVS mounted adjacent to HDMI connector to minimize stub length and preserve 1.65 GHz bandwidth. Use Value: Ensures HDMI compliance testing passes IEC 61000-4-2 Level 4 without degrading eye diagram opening or jitter budget. |
| MIPI D-PHY Camera Interface | Cellular Antenna Switch Control Line |
Use Scenario: Guarding high-speed camera sensor interface lines (CLK/STB/DATA) in compact mobile modules. IC Role / Device Role / Timing Role: Single-line TVS on each D-PHY lane to absorb EOS from flex-cable mating and board-level handling. Use Value: Maintains 1.5 Gbps data rate integrity with <0.5 dB insertion loss at 750 MHz due to 15 pF capacitance. |
Use Scenario: Protecting GPIO-controlled antenna switch enable/disable signals in LTE/5G handsets. IC Role / Device Role / Timing Role: Clamping diode on 1.8 V control line to prevent false switching or latch-up during SIM card insertion ESD. Use Value: Enables robust 100 kΩ pull-up/pull-down compatibility with <200 nA leakage, avoiding unintended state transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD9B3.3ST5G (ON Semiconductor) | 3.3 V breakdown, bidirectional, 12 pF capacitance, SOD-923 package | Better suited for low-voltage (1.8–3.3 V) I/O rails; not rated for 12 V systems | Select when protecting 3.3 V logic with tighter capacitance budget but lower standoff requirement. |
| TPD2E001DRYR (Texas Instruments) | 5.5 V breakdown, bidirectional, dual-channel, 10 pF/channel, X2SON package | Offers dual-line protection in same footprint; higher leakage (1 µA @ 5.5 V) | Choose for space-constrained dual-signal protection (e.g., I²C SDA/SCL) where 10 pF is mandatory. |
Compared with ESD9B3.3ST5G and TPD2E001DRYR, the ESDALC12-1T2 provides higher standoff (10 V) and superior clamping precision (1.9 Ω Rd) for 5 V–12 V biased interfaces, making it optimal for USB, HDMI, and MIPI D-PHY where voltage margin and signal fidelity are critical.
Availability
ESDALC12-1T2 is available at Aetrix Electronics and suitable for cellular handset design, USB peripheral development, and HDMI-enabled consumer electronics requiring stable component supply across long production lifecycles.
Supply support for ESDALC12-1T2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering silicon solutions for automotive, industrial, and consumer markets since 1987.
The ESDALC series targets ESD-sensitive portable electronics, with the ESDALC12-1T2 specifically engineered for miniaturized data-line protection where low capacitance, thin profile, and IEC 61000-4-2 Level 4 compliance are non-negotiable.
FAQ
What is the maximum operating temperature range for ESDALC12-1T2?
The ESDALC12-1T2 supports junction temperatures from –40 °C to +125 °C, enabling deployment in automotive infotainment displays and industrial handheld terminals where ambient temperatures exceed 85 °C. Thermal derating begins above 25 °C ambient, with peak pulse power dropping linearly to 30 W at 125 °C junction temperature.
Can ESDALC12-1T2 be used on bidirectional data lines like I²C?
No - ESDALC12-1T2 is unidirectional and only protects against transients flowing from anode to cathode. For bidirectional buses such as I²C or UART, a bidirectional TVS (e.g., ESDALC6-1M2) or back-to-back diode configuration is required to clamp both positive and negative excursions.
How does the 1.9 Ω dynamic impedance affect clamping performance?
The 1.9 Ω dynamic impedance directly determines voltage overshoot during transient events: for a 1 A surge, additional drop beyond VBR is just 1.9 V, yielding total clamping of ~13.9 V - significantly tighter than generic TVS diodes with >5 Ω Rd. This reduces stress on 12 V-tolerant receivers and improves system-level ESD pass rates.
Is SOD882T compatible with standard 0201 pick-and-place equipment?
Yes - the SOD882T package (1.0 × 0.6 mm) falls within the capability envelope of modern vision-guided placement systems. ST recommends ±0.05 mm placement tolerance, 3.5 N placement force, and bottom-side optical alignment to ensure accurate cathode-bar orientation and avoid tombstoning during reflow.
ESDALC12-1T2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- SOD-882
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 10V
- Voltage - Breakdown (Min):
- 12V
- Voltage - Clamping (Max) @ Ipp:
- 20V
- Current - Peak Pulse (10/1000µs):
- 2A (8/20µs)
- Power - Peak Pulse:
- 50W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 15pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-882T
ESDALC12-1T2 FAQ
1.How can I place an order for ESDALC12-1T2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDALC12-1T2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDALC12-1T2 reliable?
The price and inventory of ESDALC12-1T2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDALC12-1T2 is usually 5 days.
3.What payment methods are accepted for ESDALC12-1T2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDALC12-1T2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDALC12-1T2?
ESDALC12-1T2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDALC12-1T2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDALC12-1T2?
For technical support, including ESDALC12-1T2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDALC12-1T2 requirements.
6.How does Aetrix verify that ESDALC12-1T2 is sourced from the original manufacturer or authorized distributors?
All ESDALC12-1T2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDALC12-1T2 meets industry standards.
7.What is the process for return or replacement of ESDALC12-1T2?
All ESDALC12-1T2 units undergo pre-shipment inspection (PSI). If there is an issue with ESDALC12-1T2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDALC12-1T2 part is unused and in its original packaging.
Return procedure for ESDALC12-1T2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDALC12-1T2 Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

