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STMicroelectronics ESDALC12-1T2

Part No.:
ESDALC12-1T2
Manufacturer:
STMicroelectronics
Category:
TVS Diodes
Package:
SOD-882
Datasheet:
AetrixESDALC12-1T2.pdf
Description:
TVS DIODE 10VWM 20VC SOD882
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:11,182

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Product details

Overview

ESDALC12-1T2 from STMicroelectronics is a unidirectional single-line Transil™ TVS diode designed for ESD and electrical overstress (EOS) protection of I/O lines in portable and miniaturized electronics. It features 12 V minimum breakdown voltage (VBR), 10 V stand-off voltage (VRM), 20 V clamping voltage at 1 A (VCL), 15 pF typical junction capacitance, and SOD882T ultra-thin 0.4 mm package - optimized for high-density PCBs in cellular handset interfaces.

For engineers reviewing the ESDALC12-1T2 datasheet, ESDALC12-1T2 pinout, ESDALC12-1T2 application, or ESDALC12-1T2 equivalent, key selection criteria include IEC 61000-4-2 Level 4 compliance (±15 kV air / ±8 kV contact discharge), low dynamic impedance (1.9 Ω), and sub-200 nA leakage at 10 V - critical for signal integrity in high-speed data lines.

Technical Context

The ESDALC12-1T2 operates as a clamping-type transient suppressor with avalanche breakdown triggered above 12 V, limiting transient energy to protected ICs via fast (<1 ns) response and low VCL/VBR ratio (1.67). Its unidirectional architecture supports DC-biased signal paths such as USB D+ or HDMI TMDS lines.

Designed for integration into space-constrained layouts, it leverages SOD882T's 1.0 × 0.6 mm footprint and 0.4 mm height, with cathode-bar marking for unambiguous polarity identification. Junction capacitance remains stable below 18 pF up to 5 V reverse bias, preserving signal rise time in >100 Mbps interfaces.

Key Specifications

Parameter Value and Actual Design Meaning
Breakdown Voltage (VBR) 12 V min. @ 1 mA - ensures reliable triggering before damage to downstream 3.3 V or 5 V logic.
Stand-off Voltage (VRM) 10 V - allows safe operation under normal 3.3 V/5 V I/O bias without leakage-induced power loss.
Clamping Voltage (VCL) 20 V @ 1 A, 8/20 µs - limits transient peak to safe margin below absolute maximum ratings of protected ICs.
Junction Capacitance (CJ) 15–18 pF @ 0 V, 1 MHz - enables use on USB 2.0, HDMI, and MIPI D-PHY without signal degradation.
Dynamic Impedance (Rd) 1.9 Ω - reduces voltage overshoot during fast transients, improving clamping precision.
ESD Robustness ±15 kV air / ±8 kV contact per IEC 61000-4-2 Level 4 - meets industrial and consumer end-equipment immunity requirements.
Leakage Current (IRM) 200 nA max. @ 10 V - minimizes standby power draw in battery-powered devices.

Pinout & Package

Supplied in SOD882T package: 1.00 × 0.60 mm body, 0.47 mm nominal height, cathode indicated by bar marking on Pin 1 side. Compatible with standard reflow profiles including ST's ECOPACK®-recommended 240–245 °C peak.

Pin/Terminal Circuit Role Design Meaning
Pin 1 Anode Connected to protected I/O line; forward-biased during positive transients.
Pin 2 Cathode Connected to ground reference; defines unidirectional clamping direction and polarity.

Key Features

Feature Design Value
Ultra-low profile packaging 0.4 mm max height - enables placement beneath connectors and in stacked PCB assemblies.
Low clamping factor (VCL/VBR) 1.67 - delivers tighter voltage control than typical TVS diodes (>1.8), reducing stress on protected ICs.
High-frequency signal integrity 15–18 pF capacitance - maintains <10% signal distortion on 480 Mbps USB 2.0 differential pairs.
Lead-free and RoHS-compliant ECOPACK® Grade 2 - satisfies global environmental regulations without compromising thermal performance.
Fast ESD response <1 ns turn-on - intercepts ESD events before they propagate into sensitive analog or RF front-ends.

Applications

USB 2.0 Interface Protection HDMI Source Port Protection

Use Scenario: ESD suppression on D+ and D− lines of smartphone USB OTG ports exposed to frequent plug/unplug cycles.

IC Role / Device Role / Timing Role: Unidirectional clamping TVS placed directly at connector entry point to shunt transients to chassis ground.

Use Value: Prevents latch-up and gate oxide damage in USB PHY ICs while maintaining <100 ps signal skew between differential pairs.

Use Scenario: Protecting HDMI transmitter pins (TMDS clock/data channels) in set-top boxes subjected to user-handling ESD.

IC Role / Device Role / Timing Role: Low-capacitance TVS mounted adjacent to HDMI connector to minimize stub length and preserve 1.65 GHz bandwidth.

Use Value: Ensures HDMI compliance testing passes IEC 61000-4-2 Level 4 without degrading eye diagram opening or jitter budget.

MIPI D-PHY Camera Interface Cellular Antenna Switch Control Line

Use Scenario: Guarding high-speed camera sensor interface lines (CLK/STB/DATA) in compact mobile modules.

IC Role / Device Role / Timing Role: Single-line TVS on each D-PHY lane to absorb EOS from flex-cable mating and board-level handling.

Use Value: Maintains 1.5 Gbps data rate integrity with <0.5 dB insertion loss at 750 MHz due to 15 pF capacitance.

Use Scenario: Protecting GPIO-controlled antenna switch enable/disable signals in LTE/5G handsets.

IC Role / Device Role / Timing Role: Clamping diode on 1.8 V control line to prevent false switching or latch-up during SIM card insertion ESD.

Use Value: Enables robust 100 kΩ pull-up/pull-down compatibility with <200 nA leakage, avoiding unintended state transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar transient suppression applications.

Alternative Part Technical Difference Application Difference Selection Advice
ESD9B3.3ST5G (ON Semiconductor) 3.3 V breakdown, bidirectional, 12 pF capacitance, SOD-923 package Better suited for low-voltage (1.8–3.3 V) I/O rails; not rated for 12 V systems Select when protecting 3.3 V logic with tighter capacitance budget but lower standoff requirement.
TPD2E001DRYR (Texas Instruments) 5.5 V breakdown, bidirectional, dual-channel, 10 pF/channel, X2SON package Offers dual-line protection in same footprint; higher leakage (1 µA @ 5.5 V) Choose for space-constrained dual-signal protection (e.g., I²C SDA/SCL) where 10 pF is mandatory.

Compared with ESD9B3.3ST5G and TPD2E001DRYR, the ESDALC12-1T2 provides higher standoff (10 V) and superior clamping precision (1.9 Ω Rd) for 5 V–12 V biased interfaces, making it optimal for USB, HDMI, and MIPI D-PHY where voltage margin and signal fidelity are critical.

Availability

ESDALC12-1T2 is available at Aetrix Electronics and suitable for cellular handset design, USB peripheral development, and HDMI-enabled consumer electronics requiring stable component supply across long production lifecycles.

Supply support for ESDALC12-1T2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering silicon solutions for automotive, industrial, and consumer markets since 1987.

The ESDALC series targets ESD-sensitive portable electronics, with the ESDALC12-1T2 specifically engineered for miniaturized data-line protection where low capacitance, thin profile, and IEC 61000-4-2 Level 4 compliance are non-negotiable.

FAQ

What is the maximum operating temperature range for ESDALC12-1T2?

The ESDALC12-1T2 supports junction temperatures from –40 °C to +125 °C, enabling deployment in automotive infotainment displays and industrial handheld terminals where ambient temperatures exceed 85 °C. Thermal derating begins above 25 °C ambient, with peak pulse power dropping linearly to 30 W at 125 °C junction temperature.

Can ESDALC12-1T2 be used on bidirectional data lines like I²C?

No - ESDALC12-1T2 is unidirectional and only protects against transients flowing from anode to cathode. For bidirectional buses such as I²C or UART, a bidirectional TVS (e.g., ESDALC6-1M2) or back-to-back diode configuration is required to clamp both positive and negative excursions.

How does the 1.9 Ω dynamic impedance affect clamping performance?

The 1.9 Ω dynamic impedance directly determines voltage overshoot during transient events: for a 1 A surge, additional drop beyond VBR is just 1.9 V, yielding total clamping of ~13.9 V - significantly tighter than generic TVS diodes with >5 Ω Rd. This reduces stress on 12 V-tolerant receivers and improves system-level ESD pass rates.

Is SOD882T compatible with standard 0201 pick-and-place equipment?

Yes - the SOD882T package (1.0 × 0.6 mm) falls within the capability envelope of modern vision-guided placement systems. ST recommends ±0.05 mm placement tolerance, 3.5 N placement force, and bottom-side optical alignment to ensure accurate cathode-bar orientation and avoid tombstoning during reflow.

ESDALC12-1T2 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
SOD-882
Series:
ESDA, TRANSIL™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
10V
Voltage - Breakdown (Min):
12V
Voltage - Clamping (Max) @ Ipp:
20V
Current - Peak Pulse (10/1000µs):
2A (8/20µs)
Power - Peak Pulse:
50W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
15pF @ 1MHz
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOD-882T

ESDALC12-1T2 FAQ

1.How can I place an order for ESDALC12-1T2 through Aetrix?

Please submit a Request for Quotation (RFQ) for ESDALC12-1T2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ESDALC12-1T2 reliable?

The price and inventory of ESDALC12-1T2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDALC12-1T2 is usually 5 days.

3.What payment methods are accepted for ESDALC12-1T2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDALC12-1T2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ESDALC12-1T2?

ESDALC12-1T2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ESDALC12-1T2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ESDALC12-1T2?

For technical support, including ESDALC12-1T2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDALC12-1T2 requirements.

6.How does Aetrix verify that ESDALC12-1T2 is sourced from the original manufacturer or authorized distributors?

All ESDALC12-1T2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDALC12-1T2 meets industry standards.

7.What is the process for return or replacement of ESDALC12-1T2?

All ESDALC12-1T2 units undergo pre-shipment inspection (PSI). If there is an issue with ESDALC12-1T2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ESDALC12-1T2 part is unused and in its original packaging.

Return procedure for ESDALC12-1T2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

ESDALC12-1T2 Tags

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