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STMicroelectronics ESDALC14-1BU2
- Part No.:
- ESDALC14-1BU2
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDALC14-1BU2.pdf
- Description:
- TVS DIODE 12VWM 18VC ST0201
- Quantity:
- Payment:
- Shipping:
Inventory:3,045
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Product details
Overview
ESDALC14-1BU2 from STMicroelectronics is a bidirectional single-line TVS diode designed for ESD protection of high-speed data lines in space-constrained portable electronics. It delivers 12 V stand-off voltage, 18 V clamping voltage at ±20 kV contact discharge, 22–25 pF line capacitance, and 0.25 Ω dynamic resistance - enabling robust transient suppression without signal integrity degradation in USB, I²C, or MIPI interfaces.
For engineers reviewing the ESDALC14-1BU2 datasheet, ESDALC14-1BU2 pinout, ESDALC14-1BU2 application, or ESDALC14-1BU2 equivalent, key selection criteria include low capacitance (<25 pF), sub-0.3 Ω dynamic resistance, 0201 footprint compatibility, IEC 61000-4-2 Level 4 compliance, and thermal stability across –55 °C to +150 °C junction temperature range.
Technical Context
This device operates as a low-capacitance, bidirectional clamping diode optimized for ultra-high-frequency signal paths. Its 22–25 pF capacitance at 1 MHz and 0 V bias ensures minimal insertion loss in 100+ Mbps interfaces, while its 0.25 Ω dynamic resistance (TLP, 1–16 A) enables rapid energy shunting during ESD events.
The ESDALC14-1BU2 uses silicon avalanche structure with symmetrical breakdown characteristics, supporting ±13 V reverse breakdown (IR = 1 mA) and maintaining <100 nA leakage at 12 V stand-off. It meets full IEC 61000-4-2 Level 4 (±20 kV contact / ±25 kV air) without derating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage | 12 V - Maximum continuous operating voltage before conduction begins; ensures no interference with 3.3 V or 5 V I/O logic levels. |
| Clamping Voltage | 18 V @ ±20 kV contact discharge - Peak voltage seen by protected IC during worst-case ESD strike; limits stress on downstream transceivers. |
| Line Capacitance | 22–25 pF @ 1 MHz, 0 V - Enables use in USB 2.0, HDMI DDC, and MIPI D-PHY without signal rise-time degradation. |
| Dynamic Resistance | 0.25 Ω - Measured via TLP (1–16 A); determines voltage overshoot under fast transient current, critical for protecting sensitive analog front-ends. |
| Leakage Current | <100 nA @ 12 V - Prevents DC loading on high-impedance sensor or reference lines; supports battery-powered wearable operation. |
| ESD Rating | ±20 kV contact / ±25 kV air (IEC 61000-4-2 Level 4) - Exceeds industrial and consumer immunity requirements without external filtering. |
| Junction Temp Range | –55 °C to +150 °C - Supports operation in automotive cabin modules, industrial edge sensors, and thermally stressed mobile PCBs. |
Pinout & Package
ESDALC14-1BU2 is housed in the ST0201 package - a 0201-size surface-mount device measuring 0.61 mm × 0.31 mm × 0.24 mm (typ.), with ultra-low PCB area of 0.18 mm². The device has two terminals; polarity is non-directional due to bidirectional clamping architecture.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode/Cathode (symmetrical) | ESD current path input/output | Both terminals function identically; connects inline between I/O line and ground to clamp transients in either polarity. |
| Case / Body | Thermal and mechanical interface | No electrical connection; provides mechanical anchoring and limited heat dissipation during pulse events. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or differential lines (e.g., USB D+/D−, I²C SDA/SCL) without polarity concerns. |
| Ultra-low 0.18 mm² footprint | Reduces PCB real estate by >50% vs. 0402 TVS devices; critical for narrow-pitch flex circuits in foldable phones and hearables. |
| 22–25 pF capacitance | Maintains signal integrity up to 480 Mbps (USB 2.0) with <1% eye diagram distortion; avoids need for post-layout tuning. |
| ECOPACK2 compliance | Meets RoHS, REACH, and halogen-free requirements; supports global environmental certifications for medical and consumer end products. |
| Low 0.25 Ω dynamic resistance | Minimizes clamping voltage overshoot during multi-Amp ESD pulses, reducing risk of latch-up or gate oxide damage in CMOS I/O cells. |
Applications
| Smartphone Data Lines | Wearable Sensor Interfaces |
|---|---|
Use Scenario: Protecting USB-C CC, SBU, and sideband-use pins against repeated pocket ESD events during daily handling. IC Role / Device Role: Bidirectional transient voltage suppressor placed directly at connector entry point, before EMI filter and PHY. Use Value: 22 pF capacitance prevents USB 2.0 eye closure; 18 V clamping ensures SoC GPIOs remain below absolute maximum ratings during ±20 kV strikes. | Use Scenario: Shielding I²C-connected accelerometers and HRMs in fitness bands from wristband-induced triboelectric discharges. IC Role / Device Role: Low-leakage (100 nA) ESD clamp on sensor bus lines, co-located with pull-up resistors near MCU. Use Value: Sub-100 nA leakage preserves battery life over multi-year wear cycles; 0201 size allows placement within 2 mm of sensor die. |
| Tablet Display Flex Cables | Home Automation Zigbee Modules |
Use Scenario: Guarding MIPI DSI/CSI lanes running across thin-film flex cables connecting LCD panels to mainboard. IC Role / Device Role: High-frequency ESD protector mounted at flex-to-PCB transition zone to suppress coupling from panel surface discharges. Use Value: 25 pF max capacitance maintains >1 Gbps lane integrity; 0.25 Ω RD minimizes reflection-induced jitter during 8/20 µs surges. | Use Scenario: Securing Zigbee 3.0 RF module antenna feed and GPIO control lines in smart switches exposed to user-touch ESD. IC Role / Device Role: Standoff-voltage-matched (12 V) TVS aligned with 3.3 V MCU I/O rails and RF front-end ESD tolerance. Use Value: 12 V VRM avoids false triggering during normal operation; ±25 kV air discharge rating exceeds EN 61000-4-2 test margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E05U06DPYR (TI) | 12 V stand-off, 16 V clamping, 9 pF capacitance, 0201 package | Lower capacitance suits >1 Gbps interfaces (e.g., PCIe Gen1), but lower 16 V clamping reduces margin for 5 V tolerant I/O. | Select when signal bandwidth >1 GHz dominates over ESD margin; verify system-level clamping headroom with SoC VI/O abs max. |
| SZ1.8SMCG-TP (Microchip) | 1.8 V stand-off, 17 V clamping, 30 pF, SOD-923 package (0.9 × 0.7 mm) | Larger footprint and higher capacitance limit use to low-speed lines (e.g., UART, reset); better suited for cost-sensitive industrial controls. | Choose only if board space permits larger package and 30 pF is acceptable; avoid for USB/I²C where timing skew matters. |
Compared with TPD1E05U06DPYR and SZ1.8SMCG-TP, ESDALC14-1BU2 balances 22–25 pF capacitance, 18 V clamping, and 0201 size - making it optimal for mid-speed digital interfaces (up to 480 Mbps) where both space and ESD margin are constrained.
Availability
ESDALC14-1BU2 is available at Aetrix Electronics and suitable for smartphone data line protection, wearable sensor interface hardening, and tablet display flex cable ESD mitigation requiring stable component supply and ECOPACK2-compliant sourcing.
Supply support for ESDALC14-1BU2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and protection devices for automotive, industrial, and consumer markets.
The ESDALC series targets ultra-compact, high-frequency ESD protection for portable and IoT endpoints - emphasizing low capacitance, minimal footprint, and full IEC 61000-4-2 Level 4 compliance in 0201 and smaller packages.
FAQ
What is the maximum recommended PCB trace length between ESDALC14-1BU2 and the protected I/O pin?
ST recommends placing the device within 3 mm of the protected I/O pin and routing traces as short and direct as possible. Longer traces increase inductance, degrading clamping performance during fast ESD transients; measured TLP response shows >2 V overshoot increase per 1 mm of 0.15 mm-wide trace beyond 3 mm.
Does ESDALC14-1BU2 require a dedicated ground plane connection?
Yes - a low-inductance, solid ground plane connection is mandatory. The device must connect to ground via a dedicated thermal pad or short trace (≤1 mm) to a ground plane; split planes or shared return paths degrade clamping speed and increase voltage overshoot by up to 30% in IEC 61000-4-2 testing.
Can ESDALC14-1BU2 be used on 5 V logic lines without risk of premature conduction?
Yes - its 12 V stand-off voltage provides 2.4× margin above 5 V rail, and leakage remains <100 nA at 5 V. No conduction occurs below 13 V (VBR min), ensuring reliable operation across temperature and lifetime without false triggering or DC loading.
Is reflow soldering compatible with ESDALC14-1BU2's ST0201 package?
Yes - the device is qualified for standard lead-free reflow per IPC/JEDEC J-STD-020, with peak temperature up to 245 °C. ST specifies a ramp rate ≤3 °C/s, 60–90 s above 217 °C, and strict control of air convection to prevent displacement; validated with 75 μm stencil apertures and fine-particle (20–38 μm) solder paste.
ESDALC14-1BU2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 12V (Max)
- Voltage - Breakdown (Min):
- 13V
- Voltage - Clamping (Max) @ Ipp:
- 18V (Typ)
- Current - Peak Pulse (10/1000µs):
- 5A (8/20µs)
- Power - Peak Pulse:
- 100W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 22pF @ 1MHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDALC14-1BU2 FAQ
1.How can I place an order for ESDALC14-1BU2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDALC14-1BU2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDALC14-1BU2 reliable?
The price and inventory of ESDALC14-1BU2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDALC14-1BU2 is usually 5 days.
3.What payment methods are accepted for ESDALC14-1BU2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDALC14-1BU2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDALC14-1BU2?
ESDALC14-1BU2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDALC14-1BU2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDALC14-1BU2?
For technical support, including ESDALC14-1BU2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDALC14-1BU2 requirements.
6.How does Aetrix verify that ESDALC14-1BU2 is sourced from the original manufacturer or authorized distributors?
All ESDALC14-1BU2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDALC14-1BU2 meets industry standards.
7.What is the process for return or replacement of ESDALC14-1BU2?
All ESDALC14-1BU2 units undergo pre-shipment inspection (PSI). If there is an issue with ESDALC14-1BU2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDALC14-1BU2 part is unused and in its original packaging.
Return procedure for ESDALC14-1BU2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDALC14-1BU2 Tags
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