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STMicroelectronics ESDALC5-1BF4
- Part No.:
- ESDALC5-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDALC5-1BF4.pdf
- Description:
- TVS DIODE 5VWM 0201
- Quantity:
- Payment:
- Shipping:
Inventory:68,977
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Product details
Overview
ESDALC5-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode for ESD protection of high-speed data lines, featuring 12 pF typical junction capacitance, ±15 kV air/±8 kV contact IEC 61000-4-2 compliance, and 5.8 V breakdown voltage at 1 mA - deployed in smartphones, wearables, and portable multimedia I/O interfaces.
For engineers reviewing the ESDALC5-1BF4 datasheet, ESDALC5-1BF4 pinout, ESDALC5-1BF4 application, or ESDALC5-1BF4 equivalent, key selection criteria include low clamping voltage (12 V @ 30 ns), ultra-small 0201 footprint (0.18 mm²), and sub-100 nA leakage at 5 V - critical for preserving signal integrity in space-constrained, high-frequency interfaces.
Technical Context
This device operates as a passive, bidirectional transient voltage suppressor optimized for electrostatic discharge events on unidirectional or bidirectional signal paths. Its silicon avalanche structure delivers fast response (<1 ns) and clamps transients to ≤14 V (peak) under ±8 kV contact discharge, with minimal parasitic capacitance to avoid signal distortion.
The 0201 package integrates two terminals with no internal polarity marking - Pin 1 and Pin 2 are symmetrically functional - and relies on bar-marked orientation for placement. It requires halide-free, no-clean solder paste and strict reflow profile control to prevent tombstoning or solder joint voiding.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage (VBR) | 5.8 V at 1 mA - defines minimum trigger threshold for ESD clamping without false triggering during normal 5 V I/O operation |
| Junction Capacitance (CLINE) | 12 pF at 1 MHz, 0 V bias - enables use on USB 2.0, HDMI, MIPI D-PHY, and other >100 MHz signal lines without measurable insertion loss |
| Clamping Voltage (VCL) | 12 V at 30 ns, 2.5 A peak pulse - limits transient overvoltage seen by protected ICs to safe levels during IEC 61000-4-2 contact discharge |
| Leakage Current (IRM) | 100 nA at 5 V reverse - ensures negligible DC loading on battery-powered sensor or audio I/O circuits |
| ESD Withstand (IEC 61000-4-2) | ±8 kV contact / ±15 kV air - exceeds Level 4 industrial immunity requirements for handheld consumer electronics |
| Package Size | 0201 (0.60 × 0.30 mm) - occupies only 0.18 mm² PCB area, enabling placement directly at connector or SoC I/O pad |
Pinout & Package
ESDALC5-1BF4 uses a 2-terminal 0201 surface-mount package with symmetrical pin configuration: Pin 1 and Pin 2 are electrically identical and interchangeable. Orientation is defined by a bar mark indicating Pin 1; rotation of marking codes (90°/180°) serves only assembly location differentiation and must not be used for PCB orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Common terminal for ESD current path; no polarity - connects to protected line (e.g., USB D+) |
| Pin 2 | Anode/Cathode (bidirectional) | Reference terminal; connects to system ground or common return path for transient dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 12 pF typical - preserves signal rise/fall times and eye diagram integrity on 480 Mbps USB 2.0 and MIPI D-PHY lanes |
| Bidirectional clamping | Symmetric V-I curve - protects AC-coupled or true bidirectional lines (e.g., I²C, UART) without polarity constraints |
| Low clamping voltage | 12 V peak at 30 ns - keeps downstream logic inputs below absolute maximum ratings during ESD events |
| 0201 footprint | 0.18 mm² board area - allows placement within 2 mm of connector or SoC pad, minimizing inductance in ESD current path |
Applications
| Smartphone Front-Panel Touch Interface | Wearable Heart-Rate Sensor I/O |
|---|---|
Use Scenario: ESD protection for capacitive touch controller I²C bus exposed on glass-covered front panel subject to repeated finger discharge. IC Role / Device Role: Bidirectional TVS diode placed inline on SDA/SCL lines between touch IC and AP, referenced to chassis ground. Use Value: 12 pF capacitance avoids timing skew on 400 kHz I²C; 12 V clamping prevents latch-up in 1.8 V touch controller IO cells. | Use Scenario: Protecting analog front-end ADC input of optical PPG sensor against ESD from user skin contact during wear. IC Role / Device Role: Single-line TVS on photodiode bias line and ADC input, grounded to isolated sensor ground plane. Use Value: 100 nA leakage avoids DC offset error in µV-level photodiode current measurement; 0201 size fits tight flex PCB routing. |
| USB-C Accessory Data Lane | Wireless Earbud Charging Case UART |
Use Scenario: ESD safeguard on USB 2.0 D+ line inside compact charging case where USB plug insertion causes frequent air-gap discharges. IC Role / Device Role: Bidirectional clamp between USB PHY and connector, with shortest possible trace to minimize inductive overshoot. Use Value: ±15 kV air discharge rating withstands real-world pocket insertion; 0.18 mm² footprint enables direct placement at USB-C receptacle. | Use Scenario: Transient suppression on UART TX/RX lines linking earbud MCU to charging case battery management IC. IC Role / Device Role: Two discrete ESDALC5-1BF4 units - one per line - referenced to local digital ground with minimal loop area. Use Value: Symmetric clamping handles both positive/negative ESD pulses from metal case contact; low leakage preserves UART idle state stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E05U06DPYR (TI) | 6.5 V breakdown, 9 pF capacitance, same 0201 package | Lower clamping (9.5 V @ 1 A) but lower ESD rating (±12 kV air) | Preferred when lower capacitance is prioritized over peak ESD level |
| UMK105CG120JV-F (Taiyo Yuden) | 12 V working voltage, 12 pF, 0201 MLCC-based ESD suppressor | Higher leakage (>1 µA), slower response (>10 ns), no IEC 61000-4-2 certification | Only suitable for non-critical, low-speed analog lines where cost outweighs reliability |
Compared with TPD1E05U06DPYR and UMK105CG120JV-F, ESDALC5-1BF4 delivers superior IEC 61000-4-2 robustness (±15 kV air) while maintaining competitive capacitance and leakage - making it optimal for certified consumer-grade USB, MIPI, and I²C interfaces.
Availability
ESDALC5-1BF4 is available at Aetrix Electronics and suitable for smartphone front-panel interfaces, wearable biometric sensors, and USB-C accessory designs requiring stable component supply and full production traceability.
Supply support for ESDALC5-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power ICs, sensors, and protection devices for automotive, industrial, and consumer markets.
ESDALC5-1BF4 belongs to ST's ESDALC family of ultra-low-capacitance TVS diodes - engineered specifically for high-speed digital interface protection in space-constrained portable electronics.
FAQ
What is the maximum recommended PCB trace length between ESDALC5-1BF4 and the protected I/O pin?
ST recommends ≤2 mm trace length from device to protected pin and direct grounding to minimize inductance. Longer traces increase clamping voltage due to L·di/dt effects - measured clamping rises ~2 V per additional mm beyond 2 mm under 2.5 A transient conditions.
Can ESDALC5-1BF4 be used on 3.3 V logic lines without risk of false triggering?
Yes. With 5.8 V breakdown at 1 mA and <100 nA leakage at 5 V, it remains fully inactive during 3.3 V operation - no DC conduction occurs, and the device only activates during ESD transients exceeding its breakdown threshold.
Is the 0201 package compatible with standard automated pick-and-place equipment?
Yes, but requires vision-guided placement with bottom-side optical recognition. ST specifies ±0.05 mm placement tolerance and 1.0 N force; manual placement is not recommended due to risk of misalignment or solder paste displacement.
Does ESDALC5-1BF4 require external series resistance for optimal performance?
No. It is designed for direct inline placement without series impedance. Adding resistance degrades clamping speed and increases voltage overshoot; layout best practice is low-inductance ground connection and minimized loop area between device and protected line.
ESDALC5-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESDA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 5.8V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 28W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 10pF @ 1MHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDALC5-1BF4 FAQ
1.How can I place an order for ESDALC5-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDALC5-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDALC5-1BF4 reliable?
The price and inventory of ESDALC5-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDALC5-1BF4 is usually 5 days.
3.What payment methods are accepted for ESDALC5-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDALC5-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDALC5-1BF4?
ESDALC5-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDALC5-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDALC5-1BF4?
For technical support, including ESDALC5-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDALC5-1BF4 requirements.
6.How does Aetrix verify that ESDALC5-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESDALC5-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDALC5-1BF4 meets industry standards.
7.What is the process for return or replacement of ESDALC5-1BF4?
All ESDALC5-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDALC5-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDALC5-1BF4 part is unused and in its original packaging.
Return procedure for ESDALC5-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDALC5-1BF4 Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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