STMicroelectronics ESDALC5-1BM2

Overview

ESDALC5-1BM2 from STMicroelectronics is a bidirectional single-line TVS diode designed for ESD protection of high-speed data lines, featuring 5.8 V minimum breakdown voltage, 26 pF capacitance at 0 V, ±30 kV IEC 61000-4-2 contact/air discharge rating, and SOD882 package. It delivers low-leakage (<60 nA), monolithic reliability, and minimal PCB footprint (0.6 mm²) in USB, HDMI, and cellular handset I/O interfaces.

For engineers reviewing the ESDALC5-1BM2 datasheet, ESDALC5-1BM2 pinout, ESDALC5-1BM2 application, or ESDALC5-1BM2 equivalent, key selection criteria include line capacitance impact on signal integrity, clamping voltage under 8/20 µs transients, bidirectional ESD robustness, and SOD882 thermal and mechanical compatibility with fine-pitch PCB layouts.

Technical Context

This device operates as a transient voltage suppressor using avalanche breakdown to clamp ESD events while maintaining sub-30 pF capacitance across the protected line. Its symmetrical bidirectional structure ensures identical protection behavior from either polarity, with dynamic resistance below 0.25 Ω enabling fast response to 100 ns pulses.

The SOD882 package supports reflow soldering per JEDEC J-STD-020, with peak junction temperature rated to +150 °C and storage range from –65 °C to +150 °C. Clamping voltage is specified at 16 V (I/O1→I/O2) and 11 V (I/O2→I/O1) under 8 kV contact discharge after 30 ns.

Key Specifications

Pinout & Package

The ESDALC5-1BM2 uses the SOD882 surface-mount package (0.95 × 0.55 mm, 0.47 mm height), optimized for automated placement and high-density PCB layouts. It features two terminals in a compact, lead-free, ECOPACK2-compliant construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with ESD5Z5.0T1G and TPD2E001DRYR, the ESDALC5-1BM2 uniquely balances ultra-low capacitance (26 pF), symmetrical bidirectional clamping (11/16 V), and industry-standard SOD882 manufacturability-making it optimal for single-line, high-speed, space-constrained I/O protection where signal fidelity and assembly yield are jointly prioritized.

Availability

ESDALC5-1BM2 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI hot-plug detection, and MIPI CSI-2 camera modules requiring stable component supply, consistent ECOPACK2 compliance, and verified IEC 61000-4-2 Level 4+ performance.

Supply support for ESDALC5-1BM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering intelligent power, sensing, and control solutions across automotive, industrial, and consumer markets.

The ESDALC series targets high-speed digital interface protection, emphasizing low capacitance, precise clamping, and robust ESD immunity-designed specifically for next-generation portable and connectivity devices where signal integrity and miniaturization are non-negotiable.

FAQ

What is the maximum operating junction temperature for ESDALC5-1BM2?

The ESDALC5-1BM2 has a rated junction temperature range of –55 °C to +150 °C. Its absolute maximum junction temperature is +150 °C, validated under continuous DC bias and pulsed transient conditions per DS6658 Rev 7. Operation beyond this limit risks permanent parametric shift or catastrophic failure.

Does ESDALC5-1BM2 require external biasing or control signals?

No. The ESDALC5-1BM2 is a passive, unidirectional/bidirectional TVS diode that operates without bias, power, or control inputs. It remains in high-impedance standby until a transient exceeds its breakdown voltage, then automatically clamps via avalanche conduction-fully autonomous and compatible with all logic families.

How does the SOD882 package affect thermal performance during repetitive ESD events?

The SOD882's 0.47 mm height and copper-leadframe construction provide low thermal resistance (R_θJA ≈ 320 °C/W typical). Under repetitive 8/20 µs pulses at 1 Hz, junction temperature rise stays below 25 °C per pulse, enabling sustained operation without thermal runaway-confirmed in Figure 2 of DS6658.

Can ESDALC5-1BM2 be used on 3.3 V or 5 V I/O rails without risk of premature conduction?

Yes. With a minimum breakdown voltage of 5.8 V and leakage <60 nA at 5 V, the device remains fully non-conductive under normal 3.3 V or 5 V rail operation. Its V_BR margin ensures no DC current flow or signal distortion, even with worst-case process and temperature variation across the qualified lot.