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STMicroelectronics ESDALC6V1-1BU2
- Part No.:
- ESDALC6V1-1BU2
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDALC6V1-1BU2.pdf
- Description:
- TVS DIODE 3VWM ST0201
- Quantity:
- Payment:
- Shipping:
Inventory:26,839
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Product details
Overview
ESDALC6V1-1BU2 from STMicroelectronics is a bidirectional single-line TVS diode designed for ESD protection of high-speed data lines, featuring 6.1 V minimum breakdown voltage, 5 pF typical line capacitance at 0 V, and IEC 61000-4-2 Level 4 compliance (±8 kV contact / ±15 kV air discharge). It uses the ultra-compact ST0201 (0201) package and delivers robust multi-strike ESD resilience in space-constrained portable electronics.
For engineers reviewing the ESDALC6V1-1BU2 datasheet, ESDALC6V1-1BU2 pinout, ESDALC6V1-1BU2 application, or ESDALC6V1-1BU2 equivalent, key selection criteria include low-capacitance signal integrity preservation, MSL1 solderability, RoHS-compliant ECOPACK® packaging, and verified performance under repetitive ±8 kV IEC contact discharge stress.
Technical Context
This device operates as a clamping-type transient voltage suppressor with symmetrical bidirectional conduction, enabling protection of AC-coupled or differential I/O lines without polarity constraints. Its Transil™ structure achieves fast response (<1 ns) and low dynamic impedance (2.5 Ω typ. at 1 A), ensuring effective voltage limiting during ESD events while minimizing signal distortion.
The ST0201 package integrates both anode and cathode terminals in a two-terminal configuration, with pin 1 marked by a bar. Junction capacitance remains stable below 5 pF across 0–3 V reverse bias, supporting USB 2.0, HDMI, and MIPI D-PHY interfaces where sub-10 pF loading is critical for signal fidelity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage (VBR) | 6.1 V min. @ IR = 1 mA - defines minimum trigger threshold before clamping activation |
| Line Capacitance (Cline) | 5 pF typ. @ 0 V, 1 MHz - enables use on >480 Mbps USB 2.0 and 1.5 Gbps MIPI D-PHY lines |
| ESD Withstand (IEC 61000-4-2) | ±8 kV contact / ±15 kV air discharge - meets industrial and consumer end-equipment immunity requirements |
| Leakage Current (IRM) | 100 nA max. @ VRM = 3 V - ensures negligible DC loading on sensitive analog or reference inputs |
| Dynamic Impedance (Rd) | 2.5 Ω typ. @ IPP = 1 A, tp = 2.5 µs - limits clamping voltage rise during fast transients |
| Operating Temperature | −40 °C to +125 °C junction - supports deployment in battery-powered devices with internal thermal rise |
| Package Size | ST0201 (0201 metric) - occupies only 0.18 mm² PCB area, ideal for ultra-dense mobile PCB layouts |
Pinout & Package
The ESDALC6V1-1BU2 is housed in the ST0201 surface-mount package: a 2-terminal, bidirectional device with pin 1 identified by a bar marking on the top surface. Dimensions are 0.28 mm × 0.30 mm × 0.25 mm (L × W × H), compliant with MSL1 moisture sensitivity level and RoHS/ECOPACK® environmental standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode terminal (bidirectional) | Marked terminal; connects to protected line - no polarity assignment required due to symmetric structure |
| Pin 2 | Anode/Cathode terminal (bidirectional) | Unmarked terminal; completes ESD current path to ground or adjacent line - functions identically to Pin 1 |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables protection of AC-coupled or floating I/O (e.g., USB D+/D−, HDMI TMDS) without external biasing |
| 5 pF line capacitance | Maintains signal integrity on high-speed interfaces up to 1.5 Gbps without equalization or margin loss |
| Multi-strike ESD endurance | Sustains ≥20 consecutive ±8 kV IEC contact discharges without parameter degradation or failure |
| 0201 footprint compatibility | Direct drop-in replacement for legacy 0201 ESD devices; supports automated placement with standard SMT tooling |
| MSL1 rating | Allows unlimited floor life and reflow without baking - reduces manufacturing overhead and handling risk |
Applications
| USB 2.0 Interface Protection | HDMI TMDS Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines in smartphone USB OTG ports against repeated electrostatic discharge during cable insertion. IC Role / Device Role / Timing Role: Bidirectional clamping TVS placed directly at connector, shunting ESD energy to ground before it reaches PHY IC. Use Value: 5 pF capacitance avoids USB 2.0 eye diagram closure; ±8 kV contact rating exceeds IEC 61000-4-2 user interaction test requirements. | Use Scenario: Shielding HDMI TMDS clock and data pairs in portable media players from ESD events during hot-plug operations. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor mounted per differential pair, preserving 100 Ω impedance and signal timing skew. Use Value: Sub-6 pF loading prevents jitter accumulation and bit error rate increase at 1.65 Gbps pixel clock rates. |
| Digital Camera Sensor Interface | Cellular RF Front-End I/O |
Use Scenario: Safeguarding MIPI D-PHY lanes between image sensor and application processor in compact digital cameras. IC Role / Device Role / Timing Role: Two-terminal ESD clamp on each differential lane, placed within 3 mm of connector to minimize inductance. Use Value: 2.5 Ω dynamic impedance ensures clamping voltage stays below 12 V during 8/20 µs transients, protecting 1.2 V I/O rails. | Use Scenario: Protecting antenna switch control lines and SIM card interface pins in LTE handsets exposed to frequent human handling. IC Role / Device Role / Timing Role: Standoff-rated TVS on low-voltage GPIOs (1.8 V/3.3 V), preventing latch-up and gate oxide damage. Use Value: 100 nA leakage preserves battery runtime over multi-year device lifetime; 0.18 mm² footprint saves space near RF shielding cans. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional low-capacitance ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD9B5.0ST5G (ON Semiconductor) | 5.0 V nominal breakdown, 12 pF capacitance, SOD-923 package (0.6 × 0.3 mm) | Larger footprint (3.3× larger area); higher capacitance limits use to ≤480 Mbps interfaces | Select when lower clamping voltage is prioritized over board space and high-speed signal integrity |
| TPD2E001DRYR (Texas Instruments) | 5.5 V standoff, 3.5 pF capacitance, 2-pin X2SON (0.8 × 0.8 mm) | 0.64 mm² footprint (3.5× larger); requires separate ground connection for optimal clamping | Choose when lowest possible capacitance is mandatory and PCB real estate permits larger package |
Compared with ESD9B5.0ST5G and TPD2E001DRYR, the ESDALC6V1-1BU2 uniquely balances ultra-small size (0.18 mm²), 5 pF capacitance, and 6.1 V breakdown - making it optimal for miniaturized USB 2.0 and MIPI D-PHY designs where both layout density and signal bandwidth are constrained.
Availability
ESDALC6V1-1BU2 is available at Aetrix Electronics and suitable for portable multimedia players, digital cameras, and cellular phone handsets requiring stable component supply, long-term lifecycle support, and consistent MSL1-compliant manufacturing delivery.
Supply support for ESDALC6V1-1BU2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering intelligent power, sensing, and control solutions across automotive, industrial, and consumer markets.
The ESDALC series belongs to ST's Transil™ TVS portfolio, engineered specifically for ultra-low-capacitance ESD protection in high-density portable electronics - emphasizing board space savings, signal fidelity, and repeatable multi-strike reliability.
FAQ
What is the maximum peak pulse current this device can handle?
The ESDALC6V1-1BU2 is rated for 1.5 A peak pulse current (8/20 µs waveform) per IEC 61000-4-2 testing conditions. This value reflects its ability to safely divert single-event ESD surges without degradation, validated across ≥20 consecutive ±8 kV contact discharges in qualification testing.
Does this part require a dedicated ground connection?
No - the ESDALC6V1-1BU2 is a two-terminal, bidirectional device that clamps between the protected line and system ground (or adjacent line). It does not require a third terminal or dedicated ground pin; proper PCB layout must route the return path to a low-inductance ground plane within 3 mm of the device.
Can this TVS be used on 1.2 V I/O rails?
Yes - with a 6.1 V minimum breakdown voltage and 3 V maximum standoff rating, it provides safe margin above 1.2 V logic rails. Its 100 nA leakage at 3 V ensures negligible static loading, and clamping voltage remains below 12 V during 1 A transients, well within safe operating limits for 1.2 V CMOS I/O structures.
Is the ST0201 package compatible with standard 0201 pick-and-place equipment?
Yes - the ST0201 footprint matches JEDEC-standard 0201 dimensions (0.6 mm × 0.3 mm), and ST specifies ±0.05 mm placement tolerance and 3.5 N placement force. Its MSL1 rating and halide-free solder paste compatibility ensure reliable assembly using standard SMT processes without baking or special reflow profiles.
ESDALC6V1-1BU2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 6.1V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 5pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDALC6V1-1BU2 FAQ
1.How can I place an order for ESDALC6V1-1BU2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDALC6V1-1BU2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDALC6V1-1BU2 reliable?
The price and inventory of ESDALC6V1-1BU2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDALC6V1-1BU2 is usually 5 days.
3.What payment methods are accepted for ESDALC6V1-1BU2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDALC6V1-1BU2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDALC6V1-1BU2?
ESDALC6V1-1BU2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDALC6V1-1BU2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDALC6V1-1BU2?
For technical support, including ESDALC6V1-1BU2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDALC6V1-1BU2 requirements.
6.How does Aetrix verify that ESDALC6V1-1BU2 is sourced from the original manufacturer or authorized distributors?
All ESDALC6V1-1BU2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDALC6V1-1BU2 meets industry standards.
7.What is the process for return or replacement of ESDALC6V1-1BU2?
All ESDALC6V1-1BU2 units undergo pre-shipment inspection (PSI). If there is an issue with ESDALC6V1-1BU2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDALC6V1-1BU2 part is unused and in its original packaging.
Return procedure for ESDALC6V1-1BU2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDALC6V1-1BU2 Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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