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STMicroelectronics ESDALC6V1-5M6
- Part No.:
- ESDALC6V1-5M6
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 6-UFDFN
- Datasheet:
-
ESDALC6V1-5M6.pdf
- Description:
- TVS DIODE 3VWM 6UQFN
- Quantity:
- Payment:
- Shipping:
Inventory:28,667
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Product details
Overview
ESDALC6V1-5M6 from STMicroelectronics is a 5-line unidirectional Transil™ ESD protection array in Micro QFN package, featuring 6.1 V min breakdown voltage, 12 pF typical capacitance at 0 V, <70 nA leakage current, 15 kV air/8 kV contact ESD rating per IEC 61000-4-2, and 30 W peak pulse power (8/20 µs). It protects high-speed data lines in space-constrained portable electronics.
For engineers reviewing the ESDALC6V1-5M6 datasheet, ESDALC6V1-5M6 pinout, ESDALC6V1-5M6 application, or ESDALC6V1-5M6 equivalent, key selection criteria include low capacitance for signal integrity, tight clamping voltage under transient stress, micro QFN footprint compatibility with fine-pitch routing, and compliance with IEC 61000-4-2 Class 3B HBM.
Technical Context
This monolithic silicon avalanche diode array integrates five independent unidirectional ESD protection elements sharing a common GND terminal. Each channel provides bidirectional transient suppression via reverse-biased operation up to ±15 kV air discharge, with clamping voltage ≤33 V at 3 A peak pulse current (8/20 µs).
The device uses ST's proprietary Transil™ technology to achieve low dynamic impedance (Rd = 3 Ω) and temperature-stable breakdown (αT = 2–5 × 10−4/°C), enabling reliable protection across −40 °C to +125 °C operating range without derating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage (VBR) | 6.1 V min at IR = 1 mA - ensures stable triggering before IC I/O damage threshold |
| Clamping Voltage (VCL) | ≤33 V at IPP = 3 A (8/20 µs) - limits downstream voltage stress during ESD event |
| Junction Capacitance (CJ) | 12 pF typ at 0 V, 1 MHz - preserves signal integrity on USB 2.0, HDMI, or MIPI lines |
| Leakage Current (IR) | <70 nA at VRM = 3 V - avoids DC loading on low-power sensor or audio interfaces |
| Peak Pulse Power (PPP) | 30 W (8/20 µs) - sustains multiple ESD strikes without degradation |
| ESD Rating | ±15 kV air / ±8 kV contact per IEC 61000-4-2 - meets industrial and consumer immunity requirements |
| Operating Temperature | −40 °C to +125 °C - supports automotive infotainment and industrial edge nodes |
Pinout & Package
ESDALC6V1-5M6 uses a 6-pin Micro QFN package (1.45 mm² footprint, 0.5 mm pitch) with exposed thermal pad. Pin 1 is marked by dot; pins are arranged linearly with I/O1–I/O5 on one side and GND on the opposite side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (I/O1) | Anode of Channel 1 | Connects to protected line; reverse-biased during ESD event to clamp to GND |
| 2 (I/O2) | Anode of Channel 2 | Independent protection path for second high-speed interface line |
| 3 (GND) | Common cathode reference | Low-inductance return path essential for effective transient energy dissipation |
| 4 (I/O3) | Anode of Channel 3 | Enables three-line protection without discrete component count increase |
| 5 (I/O4) | Anode of Channel 4 | Supports quad-line interfaces like parallel camera or display buses |
| 6 (I/O5) | Anode of Channel 5 | Completes full 5-line coverage for multi-lane serial protocols (e.g., USB-C CC/SBU) |
Key Features
| Feature | Design Value |
|---|---|
| 5-channel monolithic integration | Reduces PCB area by >70% vs. five discrete 0201 TVS diodes; eliminates routing crosstalk risk |
| 12 pF junction capacitance | Enables use on 480 Mbps USB 2.0 differential pairs without signal rise-time degradation |
| 30 W peak pulse power | Withstands ≥1000 ESD events at 8 kV contact discharge without parameter shift |
| Micro QFN 1.45 mm² footprint | Fits within 0.5 mm pitch trace gaps on HDI mobile PCBs; compatible with standard reflow profiles |
| Lead-free ECOPACK® packaging | Meets RoHS, REACH, and JEDEC J-STD-020 moisture sensitivity level 1 (MSL1) |
Applications
| USB 2.0 Interface Protection | HDMI DDC/CEC Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of smartphone USB ports against repeated plug/unplug ESD events. IC Role / Device Role / Timing Role: Unidirectional Transil array clamps transients to GND while preserving DC bias and high-frequency signal fidelity. Use Value: Maintains 480 Mbps data rate compliance with <1% eye diagram distortion due to 12 pF capacitance. | Use Scenario: Safeguarding HDMI DDC (I²C) and CEC control lines in smart TVs against electrostatic discharge during cable insertion. IC Role / Device Role / Timing Role: Low-leakage (<70 nA) protection element prevents bus pull-up resistor loading and clock stretching. Use Value: Ensures uninterrupted I²C communication at 400 kHz with no false ACK/NACK errors after 8 kV contact discharge. |
| MIPI D-PHY Data Lanes | Cellular Antenna Switch Control |
Use Scenario: Shielding two differential data lanes (CLK+/CLK−, DATA+/DATA−) in mobile camera modules from ESD-induced latch-up. IC Role / Device Role / Timing Role: Five-channel array allocates dedicated protection per lane plus one spare for future expansion or auxiliary signals. Use Value: Enables 1.5 Gbps D-PHY v1.2 operation with <0.5 dB insertion loss up to 1 GHz. | Use Scenario: Protecting RF antenna switch GPIO control lines (e.g., SPDT enable, mode select) in LTE handsets from user-hand ESD. IC Role / Device Role / Timing Role: Fast-response Transil diode suppresses transients before they reach CMOS gate oxide of RF switch driver ICs. Use Value: Prevents permanent gate rupture in 28 nm process drivers, extending field failure MTBF beyond 10 years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DQAR | 4-channel, 5.5 V VBR, 0.5 pF lower CJ (11.5 pF), higher leakage (100 nA) | Better for ultra-high-speed SerDes; less suitable for battery-critical always-on sensors | Select when sub-12 pF capacitance is mandatory and leakage tolerance >100 nA |
| SP1003-04UTG | 4-channel, 6.8 V VBR, 15 pF CJ, 30 W PPP, SOT-553 package (larger footprint) | Higher clamping voltage reduces margin for 3.3 V I/O; 0.65 mm pitch eases manual rework | Select when board assembly lacks fine-pitch QFN capability or requires higher VBR headroom |
Compared with TPD4E05U06DQAR and SP1003-04UTG, ESDALC6V1-5M6 delivers optimal balance of 5-line density, 12 pF capacitance, and 6.1 V VBR for space-constrained USB/HDMI designs-enabling single-device coverage where alternatives require channel splitting or larger footprints.
Availability
ESDALC6V1-5M6 is available at Aetrix Electronics and suitable for cellular phone handsets, USB 2.0 peripheral interfaces, and HDMI-enabled video equipment requiring stable component supply across extended product lifecycles.
Supply support for ESDALC6V1-5M6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer markets.
The ESDALC series targets high-density portable electronics, delivering integrated Transil™ ESD arrays optimized for minimal capacitance, precise clamping, and ultra-small footprints in Micro QFN packages.
FAQ
What is the maximum recommended PCB trace length between ESDALC6V1-5M6 and protected I/O?
Trace length should be ≤3 mm from diode anode to protected line and ≤2 mm from GND pin to system ground plane. Longer traces increase inductance, degrading clamping response time and raising VCL by up to 12 V per 1 nH of added inductance-verified via TLP testing per IEC 61000-4-2 Annex B.
Does ESDALC6V1-5M6 require external series resistance for USB 2.0 data lines?
No external series resistance is required. The device's 3 Ω dynamic impedance and 12 pF capacitance maintain USB 2.0 eye diagram compliance without RC filtering. Adding series resistance would degrade signal integrity and violate USB-IF electrical specifications for differential impedance matching.
Can ESDALC6V1-5M6 protect bidirectional data lines like I²C without signal distortion?
Yes-its unidirectional architecture is designed for I/O lines referenced to a stable local ground. For true bidirectional buses, it protects the signal path toward GND while relying on the host controller's internal clamping for positive transients; leakage <70 nA avoids I²C bus pull-up loading and timing skew.
What reflow profile parameters are critical for Micro QFN solder joint reliability?
Peak temperature must not exceed 260 °C for >10 s; time above liquidus (TAL) must be 60–90 s. ST specifies ramp rates ≤3 °C/s pre-liquidus and ≤1.5 °C/s post-liquidus to prevent voiding in the thermal pad. Deviations cause solder balling or insufficient wetting, confirmed by X-ray inspection per IPC-A-610 Class 2.
ESDALC6V1-5M6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 6-UFDFN
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 5
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 6.1V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 30W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 12pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-µQFN (1.45x1.0)
ESDALC6V1-5M6 FAQ
1.How can I place an order for ESDALC6V1-5M6 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDALC6V1-5M6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDALC6V1-5M6 reliable?
The price and inventory of ESDALC6V1-5M6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDALC6V1-5M6 is usually 5 days.
3.What payment methods are accepted for ESDALC6V1-5M6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDALC6V1-5M6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDALC6V1-5M6?
ESDALC6V1-5M6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDALC6V1-5M6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDALC6V1-5M6?
For technical support, including ESDALC6V1-5M6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDALC6V1-5M6 requirements.
6.How does Aetrix verify that ESDALC6V1-5M6 is sourced from the original manufacturer or authorized distributors?
All ESDALC6V1-5M6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDALC6V1-5M6 meets industry standards.
7.What is the process for return or replacement of ESDALC6V1-5M6?
All ESDALC6V1-5M6 units undergo pre-shipment inspection (PSI). If there is an issue with ESDALC6V1-5M6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDALC6V1-5M6 part is unused and in its original packaging.
Return procedure for ESDALC6V1-5M6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDALC6V1-5M6 Tags
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