STMicroelectronics ESDALC6V1M6

Overview

ESDALC6V1M6 from STMicroelectronics is a 5-line unidirectional Transil™ ESD protection array in Micro QFN package, featuring 6.1 V min breakdown voltage, 12 pF typical capacitance at 0 V, <70 nA leakage current, 15 kV air/8 kV contact ESD immunity per IEC 61000-4-2, and 30 W peak pulse power (8/20 µs). It protects high-speed data lines in space-constrained portable electronics.

For engineers reviewing the ESDALC6V1M6 datasheet, ESDALC6V1M6 pinout, ESDALC6V1M6 application, or ESDALC6V1M6 equivalent, key selection criteria include low capacitance for signal integrity, tight clamping voltage under ESD stress, micro QFN footprint compatibility with fine-pitch PCB layouts, and compliance with IEC 61000-4-2 Class 3B HBM.

Technical Context

This monolithic silicon avalanche diode array integrates five independent unidirectional ESD protection elements sharing a common GND terminal. Each channel exhibits a sharp reverse breakdown at ≥6.1 V and clamps transients to ≤14 V at 3 A (8/20 µs), enabling robust protection of USB 2.0, HDMI, SDIO, and audio interfaces without signal distortion.

The device leverages ST's Transil™ technology to achieve sub-15 pF capacitance while sustaining >8 kV human body model (HBM) and full IEC 61000-4-2 compliance. Its 0.5 mm pitch, 1.45 mm² footprint supports high-density routing on thin-profile mobile PCBs where thermal dissipation and parasitic inductance must be minimized.

Key Specifications

Pinout & Package

ESDALC6V1M6 uses a 6-pin Micro QFN package (1.45 mm × 1.00 mm, 0.5 mm pitch) with wettable flanks and exposed thermal pad. Pin 1 is marked by a dot; the package is lead-free and RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with ESD5V3U2U and TPD4E001DPYR, ESDALC6V1M6 delivers optimal balance of 5-line integration, 12 pF capacitance, and 0.5 mm pitch in a qualified ECOPACK® package-making it preferred for next-gen smartphones and wearables requiring minimal PCB real estate and guaranteed IEC 61000-4-2 compliance.

Availability

ESDALC6V1M6 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI signal line safeguarding, and mobile audio jack ESD suppression requiring stable component supply across high-volume consumer electronics production.

Supply support for ESDALC6V1M6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing products for automotive, industrial, power, and digital consumer markets.

ESDALC6V1M6 belongs to ST's Transil™ ESD protection portfolio, engineered specifically for high-density portable electronics where low capacitance, small footprint, and certified IEC 61000-4-2 performance are mandatory.

FAQ

What is the maximum operating temperature for ESDALC6V1M6?

The ESDALC6V1M6 is rated for continuous operation from −40 °C to +125 °C junction temperature. Its thermal design supports placement near heat-generating components in mobile SoC platforms, provided the PCB thermal pad is properly connected to a solid ground plane per ST's recommended layout guidelines.

Does ESDALC6V1M6 support bidirectional signal lines like USB 2.0 differential pairs?

ESDALC6V1M6 provides unidirectional protection per channel, making it ideal for single-ended lines or individual legs of differential pairs. For full bidirectional protection of USB D+/D−, two devices may be used back-to-back-or a dedicated bidirectional array such as ESDALC6V1-5M6-B should be selected instead.

How does the 0.5 mm pitch affect PCB assembly yield?

The 0.5 mm pitch requires precise stencil design (90% opening ratio, 100 µm thickness) and optical alignment during placement. ST recommends bottom-side optical inspection and controlled reflow profiles to prevent bridging or tombstoning-achieving >99.95% first-pass yield in qualified SMT lines using their recommended process window.

Can ESDALC6V1M6 replace discrete 0402 TVS diodes in existing designs?

Yes-its 1.45 mm² footprint replaces five discrete 0402 diodes (total ~3.5 mm²), reducing PCB area by >60%. However, layout must be updated to route each protected line to its dedicated I/O pin and connect the exposed thermal pad to GND with ≥4 thermal vias to maintain thermal performance and ESD robustness.