STMicroelectronics ESDALC6V1P3

Overview

ESDALC6V1P3 from STMicroelectronics is a low-capacitance, 4-channel unidirectional ESD protection diode array in SOT-665 package, designed to clamp transients to ≤7.2 V (V_CL at 1 A), with 7.5 pF capacitance at 3 V and <100 nA leakage at 3 V. It meets IEC 61000-4-2 Level 4 (±20 kV air / ±8 kV contact) and MIL-STD-883E Class 3 HBM (25 kV), protecting high-speed USB, HDMI, and Ethernet data lines.

For engineers reviewing the ESDALC6V1P3 datasheet, ESDALC6V1P3 pinout, ESDALC6V1P3 application, or ESDALC6V1P3 equivalent, key selection criteria include clamping voltage under 1-A pulse, sub-10-pF capacitance for signal integrity, unidirectional channel configuration, and SOT-665 footprint compatibility with high-density PCB layouts.

Technical Context

This device implements four independent Transil-type avalanche diodes integrated monolithically on a single silicon die. Each channel provides unidirectional protection with breakdown voltage ≥6.1 V and dynamic impedance ≤4.5 Ω, enabling fast response (<1 ns) to ESD events while maintaining low insertion loss on 50-Ω transmission lines.

The SOT-665 package supports reflow soldering per IPC/JEDEC J-STD-020, with lead temperature tolerance up to 260 °C for 10 s. Junction temperature range spans −40 °C to +150 °C, and storage temperature extends to −55 °C, supporting industrial and automotive infotainment environments.

Key Specifications

Pinout & Package

SOT-665 is a 5-pin, ultra-thin, surface-mount package with exposed thermal pad (no internal connection), measuring 1.6 mm × 1.3 mm × 0.62 mm (L × W × H). Pin pitch is 1.0 mm; terminals are gull-wing with 0.2 mm–0.34 mm width.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with ESDALC6V1P5 and ESDALC6V1P6, ESDALC6V1P3 offers identical protection performance in the smallest SOT-665 form factor, delivering optimal board space efficiency and thermal performance for high-density USB/HDMI designs without compromising clamping speed or capacitance.

Availability

ESDALC6V1P3 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI 1.4 data line safeguarding, and industrial sensor interface hardening requiring stable component supply across production lifecycles.

Supply support for ESDALC6V1P3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and protection devices for industrial, automotive, and consumer markets.

ESDALC6V1P3 belongs to ST's Transil™ ESD protection portfolio, engineered specifically for high-speed digital interfaces where sub-10-pF capacitance and nanosecond response time are mandatory for signal fidelity and system-level EMC compliance.

FAQ

What is the maximum peak pulse current (I_PP) the ESDALC6V1P3 can handle?

The ESDALC6V1P3 is rated for 30 W peak pulse power under 8/20 µs waveform at T_j = 25 °C. Using V_CL ≈ 7.2 V at 1 A, this corresponds to ~4.2 A maximum I_PP before exceeding the power limit. Derating applies above 25 °C per Figure 2 in DS4887.

Does ESDALC6V1P3 support bidirectional protection?

No - ESDALC6V1P3 is strictly unidirectional. Each channel conducts only during negative transients (anode-to-ground), clamping positive transients to V_BR + dynamic overshoot. For bidirectional protection, ST recommends ESDALC12V2P3 or ESDALC6V1-1U2.

Can ESDALC6V1P3 be used on 1.8 V I/O lines?

Yes, but with caution: its 6.1 V minimum breakdown voltage ensures no conduction during normal 1.8 V operation (<100 nA leakage confirmed at 3 V). However, clamping occurs at ≥7.2 V, so external series resistance may be needed to limit current into 1.8 V buffers during ESD events.

Is the SOT-665 package lead-free and RoHS-compliant?

Yes - ESDALC6V1P3 uses ST's ECOPACK®2-compliant SOT-665 package, certified RoHS-compliant (Pb-free terminations, halogen-free molding compound) and rated UL94 V0 for flammability. Full compliance documentation is available in ST's ECOPACK database.