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STMicroelectronics ESDALC8-1BF4
- Part No.:
- ESDALC8-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDALC8-1BF4.pdf
- Description:
- TVS DIODE 6VWM 16VC 0201
- Quantity:
- Payment:
- Shipping:
Inventory:6,675
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Product details
Overview
ESDALC8-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode designed for ESD protection of I/O lines in space-constrained portable electronics. It delivers 16 V clamping voltage at 8 kV contact discharge (IEC 61000-4-2), 38 pF line capacitance, and operates across –40 °C to +125 °C junction temperature - enabling robust protection in smartphone data lines and USB interfaces.
For engineers reviewing the ESDALC8-1BF4 datasheet, ESDALC8-1BF4 pinout, ESDALC8-1BF4 application, or ESDALC8-1BF4 equivalent, key selection criteria include low clamping voltage under fast transients, ultra-small 0201 footprint, sub-50 nA leakage at rated standoff, and verified ±15 kV air/±8 kV contact ESD immunity per IEC 61000-4-2.
Technical Context
This device functions as a low-capacitance, bidirectional transient voltage suppressor optimized for high-speed digital signal lines. Its symmetrical breakdown (7–9 V reverse, 11–13 V forward) and dynamic resistance < 0.5 Ω ensure rapid response to ±8 kV ESD events while preserving signal integrity.
The 0201 package integrates two terminals with no internal series impedance or control logic - operation relies solely on avalanche conduction triggered by overvoltage exceeding VBR. Clamping performance is validated at 30 ns, 60 ns, and 100 ns points during IEC 61000-4-2 testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBR (reverse) | 7–9 V @ 1 mA - defines minimum trigger threshold for negative ESD pulses on data lines |
| VBR (forward) | 11–13 V @ 1 mA - sets positive pulse conduction onset, ensuring symmetrical protection |
| VCL | 16 V @ 8 kV contact discharge (30 ns) - limits peak voltage seen by protected IC during ESD event |
| CLINE | 30–38 pF @ 1 MHz, 0 V - enables use on USB 2.0, HDMI, and MIPI D-PHY without signal degradation |
| IPP | 8.6 A @ 8/20 µs waveform - sustains high-energy surges without failure in VBUS or data line roles |
| IR | ≤50 nA @ 6–9 V - minimizes standby current draw and avoids loading of high-impedance I/O pins |
| PPP | 165 W @ 8/20 µs - supports repeated ESD strikes without parameter shift or thermal runaway |
Pinout & Package
The ESDALC8-1BF4 is housed in an industry-standard 0201 surface-mount package (0.60 × 0.30 × 0.33 mm), compliant with ECOPACK®2 environmental requirements and UL94 V0 epoxy. Marking includes "E" code rotated 90° or 180°; Pin 1 is identified by a bar.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode (reverse polarity reference) | Serves as cathode during positive transients; connects to protected signal line |
| Pin 2 | Cathode (forward polarity reference) | Serves as anode during negative transients; connects to protected signal line |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or differential lines without polarity constraints |
| Ultra-low PCB area | 0.18 mm² footprint saves space in multi-port mobile designs where board real estate is critical |
| Low dynamic resistance | <0.5 Ω ensures minimal voltage overshoot during fast-rising ESD pulses (tr ≤ 0.7 ns) |
| High ESD immunity | Rated for ±15 kV air / ±8 kV contact discharge - exceeds IEC 61000-4-2 Level 4 requirements |
| Lead-free & RoHS-compliant | Meets ECOPACK®2 specifications and global environmental directives without performance trade-offs |
Applications
| Smartphone Data Lines | USB 2.0 Interface Protection |
|---|---|
Use Scenario: Protecting micro-USB or USB-C D+/D− lines from user-handling ESD in handheld devices. IC Role / Device Role / Timing Role: Standalone bidirectional TVS placed directly at connector entry point before PHY IC. Use Value: 38 pF capacitance avoids signal rise-time degradation; 16 V clamping prevents PHY latch-up or damage. | Use Scenario: Safeguarding host/device USB 2.0 ports against electrostatic discharge during cable insertion/removal. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on differential pair, operating passively with no timing or bias dependencies. Use Value: Symmetrical VBR ensures equal protection for both signal polarities; 0201 size allows placement adjacent to connector pads. |
| Digital Camera Sensor Interfaces | MIPI D-PHY Lanes |
Use Scenario: Shielding high-speed image sensor data lanes (e.g., parallel RGB or LVDS) in compact camera modules. IC Role / Device Role / Timing Role: Passive ESD clamp on each data line, placed immediately after flex connector to minimize stub length. Use Value: Sub-50 nA leakage avoids DC offset errors; 165 W peak power rating handles multiple ESD events without derating. | Use Scenario: Protecting MIPI D-PHY clock and data lanes in smartphone display or camera subsystems. IC Role / Device Role / Timing Role: Ultra-low-capacitance TVS integrated into RF-shielded module PCBs with tight layout constraints. Use Value: 30–38 pF capacitance maintains D-PHY eye diagram integrity at 1.5 Gbps; 0201 footprint aligns with fine-pitch routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E05U06DPYR | Lower capacitance (0.6 pF), higher VBR (6.5 V typ), same 0201 package | Better suited for >1 GHz RF lines; less effective for ±8 kV surge handling (IPP = 3 A) | Select when ultra-low CLINE outweighs peak current capability |
| ESD9X5.0ST5G | Higher VCL (25 V), larger SOD-523 package (1.2 × 0.8 mm), 5.0 V VBR | Used in cost-sensitive industrial controls; not suitable for space-constrained mobile PCBs | Choose only if 0201 footprint is not required and lower clamping voltage is secondary |
Compared with TPD1E05U06DPYR and ESD9X5.0ST5G, the ESDALC8-1BF4 uniquely balances 16 V clamping, 8.6 A IPP, and 0201 size - making it optimal for consumer mobile I/O protection where both surge robustness and layout density are critical.
Availability
ESDALC8-1BF4 is available at Aetrix Electronics and suitable for smartphones, USB 2.0 interfaces, and MIPI D-PHY lanes requiring stable component supply in high-volume portable electronics manufacturing.
Supply support for ESDALC8-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer markets.
The ESDALC series targets ultra-compact, high-efficiency ESD protection for portable electronics - emphasizing low capacitance, precise clamping, and full IEC 61000-4-2 compliance in miniature packages.
FAQ
What is the maximum operating temperature for ESDALC8-1BF4?
The ESDALC8-1BF4 has a specified operating junction temperature range of –40 °C to +125 °C. This allows reliable deployment in mobile devices exposed to ambient extremes, including battery-heated enclosures and outdoor-use accessories. Thermal derating is not required within this range, and the device maintains full IEC 61000-4-2 performance up to Tj = 125 °C.
Does ESDALC8-1BF4 require external bias or control signals?
No - the ESDALC8-1BF4 is a passive, two-terminal TVS diode with no bias, enable, or configuration pins. It operates solely via avalanche breakdown when line voltage exceeds VBR in either polarity. No PCB traces for control logic, decoupling, or feedback are needed, simplifying layout and reducing BOM count.
Can ESDALC8-1BF4 be used for VBUS line protection in USB applications?
Yes - its 8.6 A IPP and 165 W peak pulse power rating allow safe use on 5 V VBUS lines subject to ESD, provided current-limiting fuses or switches are upstream. ST's datasheet explicitly states suitability for VBUS protection due to strong IPP capability, though it is not rated for sustained overcurrent or short-circuit conditions.
How does the 0201 package affect soldering reliability?
The 0201 footprint requires precise stencil design (80 µm thickness, aspect ratio ≥1.5), halide-free ROL0 flux, and reflow profiles peaking at 240–245 °C. ST recommends optical bottom-side inspection and rigid PCB support during assembly to prevent tombstoning or misalignment - standard practices for high-density mobile PCBs.
ESDALC8-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESDA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 6V
- Voltage - Breakdown (Min):
- 7V
- Voltage - Clamping (Max) @ Ipp:
- 16V (Typ)
- Current - Peak Pulse (10/1000µs):
- 8.6A (8/20µs)
- Power - Peak Pulse:
- 165W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 30pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDALC8-1BF4 FAQ
1.How can I place an order for ESDALC8-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDALC8-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDALC8-1BF4 reliable?
The price and inventory of ESDALC8-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDALC8-1BF4 is usually 5 days.
3.What payment methods are accepted for ESDALC8-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDALC8-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDALC8-1BF4?
ESDALC8-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDALC8-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDALC8-1BF4?
For technical support, including ESDALC8-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDALC8-1BF4 requirements.
6.How does Aetrix verify that ESDALC8-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESDALC8-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDALC8-1BF4 meets industry standards.
7.What is the process for return or replacement of ESDALC8-1BF4?
All ESDALC8-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDALC8-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDALC8-1BF4 part is unused and in its original packaging.
Return procedure for ESDALC8-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDALC8-1BF4 Tags
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Diodes Incorporated
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