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STMicroelectronics ESDAULC45-1BF4
- Part No.:
- ESDAULC45-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDAULC45-1BF4.pdf
- Description:
- TVS DIODE 3VWM 13.5VC 0201
- Quantity:
- Payment:
- Shipping:
Inventory:8,234
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Product details
Overview
ESDAULC45-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode in ST0201 package (0.60 × 0.30 mm, 0.18 mm² PCB area) designed for ESD protection of high-speed data lines. It delivers 1.5 pF typical line capacitance, 13.5 V clamping voltage at 8 kV IEC 61000-4-2 contact discharge, and 0.3 Ω dynamic resistance-enabling robust protection in smartphones and USB 2.0 interfaces without signal integrity degradation.
For engineers reviewing the ESDAULC45-1BF4 datasheet, ESDAULC45-1BF4 pinout, ESDAULC45-1BF4 application, or ESDAULC45-1BF4 equivalent, key selection criteria include ultra-low capacitance (<3 pF), sub-14 V clamping under 8/20 µs transients, ST0201 footprint compatibility, ±30 kV IEC 61000-4-2 compliance, and ECOPACK2 environmental compliance.
Technical Context
This device implements a silicon avalanche structure optimized for fast transient response (sub-nanosecond turn-on) and minimal parasitic capacitance. Its bidirectional configuration protects both positive and negative ESD events on a single I/O line without requiring external biasing.
The ST0201 package integrates an anode-cathode-anode layout across two terminals, enabling symmetrical clamping behavior with matched VBR (5.8–8.5 V) and leakage <70 nA at 3 V, supporting low-power portable systems where standby current matters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Line capacitance | 1.5 pF typ. @ 1 MHz - preserves signal integrity on USB 2.0, HDMI, and MIPI D-PHY lines |
| Clamping voltage | 13.5 V @ 8 kV contact discharge - limits downstream IC stress below 15 V absolute max ratings |
| Dynamic resistance | 0.3 Ω typ. - reduces voltage overshoot during fast ESD pulses (tr < 1 ns) |
| ESD rating | ±30 kV air/contact per IEC 61000-4-2 level 4 - exceeds industrial immunity requirements |
| Breakdown voltage | 5.8 V min @ 1 mA - ensures reliable conduction before system-level damage thresholds |
| Leakage current | 70 nA max @ 3 V - avoids battery drain in always-on mobile sensor interfaces |
Pinout & Package
ESDAULC45-1BF4 uses the ST0201 package: 0.60 × 0.30 × 0.25 mm, 2-terminal surface-mount device with no polarity marking; terminals are symmetrically arranged for bidirectional operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Terminal 1 | Anode | Connects to protected I/O line; forms one side of bidirectional avalanche junction |
| Terminal 2 | Cathode | Connects to GND; completes ESD current path during both polarities of transient |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low line capacitance | 1.5 pF typ. - enables use on 480 Mbps USB 2.0 and 1.5 Gbps MIPI D-PHY without eye diagram degradation |
| Bidirectional clamping | Matched VBR = 5.8–8.5 V - eliminates need for dual-diode configurations or polarity-aware routing |
| ST0201 footprint | 0.18 mm² PCB area - saves >50% board space vs. standard 0201 packages in dense smartphone front-end layouts |
| ECOPACK2 compliance | Halogen-free, RoHS-compliant materials - meets EU Directive 2011/65/EU and IPC-1752A reporting requirements |
Applications
| Smartphone Front-Panel Interface | USB 2.0 Data Line Protection |
|---|---|
Use Scenario: Protecting touchscreen controller I²C lines and proximity sensor interrupts exposed on glass bezel edges. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed directly at connector entry point, operating passively with zero latency. Use Value: Prevents latch-up or gate oxide rupture in 28 nm CMOS controllers during ±15 kV human-body-model events. | Use Scenario: Shielding D+ and D− pins of micro-USB receptacles against repeated plug-in ESD events. IC Role / Device Role / Timing Role: Single-line TVS per data line, placed within 3 mm of connector to minimize inductance-induced overshoot. Use Value: Maintains USB 2.0 eye mask compliance (≤3 pF total loading) while surviving >10,000 contact discharges. |
| MIPI D-PHY Camera Interface | High-Density Tablet Touch Controller |
Use Scenario: Safeguarding 1.5 Gbps differential clock and data lanes between image sensor and SoC in slim tablet designs. IC Role / Device Role / Timing Role: Ultra-low-capacitance TVS mounted adjacent to sensor flex connector, preserving signal rise/fall times. Use Value: Limits added jitter to <0.5 UI and avoids bit-error-rate degradation above 10⁻¹² threshold. | Use Scenario: Protecting 16-channel capacitive touch sense inputs on glass-covered front panel with tight spacing. IC Role / Device Role / Timing Role: Discrete TVS per analog input line, leveraging ST0201 size to avoid trace crowding near edge connectors. Use Value: Reduces required keep-out area by 65% versus 0402 alternatives, enabling higher channel count in same footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.9 pF typ. capacitance, 12.5 V clamping, SOT-5X3 (1.0 × 0.6 mm) | Larger footprint (3.3× larger PCB area), lower clamping but higher cost | Preferred when <1 pF is mandatory and board space allows 0.6 mm length |
| ESD5Z3.3T5G | 3.3 V standoff, 10.5 V clamping, SOD-523 (1.3 × 0.8 mm) | Lower voltage rating limits use to 3.3 V I/O only; 4× larger footprint | Suitable for legacy 3.3 V logic rails where tighter voltage margin is acceptable |
Compared with TPD2E001DRYR and ESD5Z3.3T5G, ESDAULC45-1BF4 uniquely balances 1.5 pF capacitance, 13.5 V clamping, and 0.18 mm² area-making it optimal for space-constrained, high-speed interfaces where both bandwidth and ESD margin must coexist.
Availability
ESDAULC45-1BF4 is available at Aetrix Electronics and suitable for smartphone front-panel interfaces, USB 2.0 data line protection, MIPI D-PHY camera links, and high-density tablet touch controllers requiring stable component supply across production ramps.
Supply support for ESDAULC45-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and protection ICs for automotive, industrial, and consumer markets.
ESDAULC45-1BF4 belongs to ST's Ultra Low Capacitance (ULC) ESD protection product line, engineered specifically for high-speed digital interfaces where signal fidelity and board-space efficiency are non-negotiable.
FAQ
What is the maximum peak pulse current ESDAULC45-1BF4 can handle?
The device supports 10 A peak pulse current under IEC 61000-4-2 8/20 µs waveform conditions. This rating is validated per the absolute maximum ratings table in DS10172 Rev 2, and reflects sustained clamping performance without thermal runaway up to 140 W peak power dissipation.
Does ESDAULC45-1BF4 require external biasing or control signals?
No. ESDAULC45-1BF4 is a passive, bidirectional TVS diode with no control pins or bias requirements. It operates solely via avalanche breakdown triggered by overvoltage transients, making it compatible with any DC-coupled I/O line operating between –0.3 V and 5.5 V.
Can ESDAULC45-1BF4 be used on 5 V logic interfaces?
Yes. With a minimum breakdown voltage of 5.8 V and 3 V stand-off rating, it safely protects 5 V tolerant I/Os such as USB PHYs and SD card interfaces. Its 13.5 V clamping ensures downstream components remain below their 16 V absolute maximum ratings during ESD events.
How does the ST0201 package affect reflow soldering yield?
The ST0201 footprint requires precise stencil aperture design (75 µm thickness, 0.230 mm opening) and placement force ≤1.0 N to prevent solder paste squeeze-out. ST recommends closed vias, symmetrical pad layout, and strict reflow profile adherence (peak 240–245 °C, 60–90 s above 210 °C) to achieve >99.5% first-pass yield.
ESDAULC45-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESDA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 5.8V
- Voltage - Clamping (Max) @ Ipp:
- 13.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 10A (8/20µs)
- Power - Peak Pulse:
- 140W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDAULC45-1BF4 FAQ
1.How can I place an order for ESDAULC45-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDAULC45-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDAULC45-1BF4 reliable?
The price and inventory of ESDAULC45-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDAULC45-1BF4 is usually 5 days.
3.What payment methods are accepted for ESDAULC45-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDAULC45-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDAULC45-1BF4?
ESDAULC45-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDAULC45-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDAULC45-1BF4?
For technical support, including ESDAULC45-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDAULC45-1BF4 requirements.
6.How does Aetrix verify that ESDAULC45-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESDAULC45-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDAULC45-1BF4 meets industry standards.
7.What is the process for return or replacement of ESDAULC45-1BF4?
All ESDAULC45-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDAULC45-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDAULC45-1BF4 part is unused and in its original packaging.
Return procedure for ESDAULC45-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDAULC45-1BF4 Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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