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STMicroelectronics ESDAULC6-3BF2
- Part No.:
- ESDAULC6-3BF2
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 4-WFBGA, FCBGA
- Datasheet:
-
ESDAULC6-3BF2.pdf
- Description:
- TVS DIODE 5VWM 4FLIPCHIP
- Quantity:
- Payment:
- Shipping:
Inventory:4,992
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Product details
Overview
ESDAULC6-3BF2 from STMicroelectronics is a monolithic bidirectional ESD protection diode array designed for high-speed USB 2.0 interfaces, featuring ultra-low 1.25 pF max capacitance, 15 kV IEC 61000-4-2 contact/air discharge rating, and 6 V stand-off voltage in a compact Flip-Chip package. It protects three signal lines (I/O1–I/O3) with GND reference while maintaining signal integrity up to 3.0 GHz.
For engineers reviewing the ESDAULC6-3BF2 datasheet, ESDAULC6-3BF2 pinout, ESDAULC6-3BF2 application, or ESDAULC6-3BF2 equivalent, key selection criteria include sub-1.3 pF I/O-to-I/O capacitance at 1 MHz, clamping voltage ≤23 V at 6 A pulse, dynamic resistance of 1.4 Ω, and compatibility with high-density mobile PCB layouts requiring minimal footprint (1.7 mm²).
Technical Context
The ESDAULC6-3BF2 integrates six transient voltage suppression diodes in a single Flip-Chip die-three bidirectional I/O-to-GND paths-optimized for differential high-speed data lines. Its low junction capacitance and flat frequency response ensure no insertion loss below 3.0 GHz, validated by S21 measurements.
It operates across –55 °C to +150 °C junction temperature range and meets MIL-STD-883G Class 3B HBM (±8 kV), with clamping performance characterized under 2.5 µs square-wave and 8/20 µs exponential pulses. Leakage current remains ≤0.5 µA at 5 V reverse bias.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (I/O–I/O) | 1.25 pF max @ 1 MHz, 30 mV - preserves USB 2.0 eye diagram integrity |
| Stand-off Voltage (VRM) | 6.0 V min - blocks normal operating voltages up to 5.5 V without leakage |
| Clamping Voltage (VCL) | ≤23 V @ IPP = 6 A, 2.5 µs - limits downstream IC stress during ESD events |
| ESD Rating | ±15 kV contact & air discharge (IEC 61000-4-2 Level 4) - exceeds industrial immunity requirements |
| Dynamic Resistance (Rd) | 1.4 Ω typ - enables fast energy shunting with minimal voltage overshoot |
| Leakage Current (IRM) | 0.5 µA max @ VRM = 5 V - avoids signal degradation in battery-powered systems |
| Operating Temperature | –55 °C to +150 °C - supports automotive cabin and industrial ambient conditions |
Pinout & Package
ESDAULC6-3BF2 uses a 6-terminal Flip-Chip package (1.1 × 1.6 × 1.0 mm, ±50 µm tolerance) with solder bumps on copper pads (220 µm dia). No external leads; mounting requires controlled reflow onto matching PCB pads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O1 | Protected signal line 1 | Bidirectional ESD path between I/O1 and GND; shares internal diode pair |
| I/O2 | Protected signal line 2 | Bidirectional ESD path between I/O2 and GND; electrically isolated from I/O1 |
| I/O3 | Protected signal line 3 | Bidirectional ESD path between I/O3 and GND; independent clamping node |
| GND | Common reference terminal | Low-inductance return path for all three ESD current paths; must be solid plane-connected |
| NC | No-connect bump | Non-functional metallization; omitted in layout to avoid shorting risk |
| NC | No-connect bump | Non-functional metallization; omitted in layout to avoid shorting risk |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low I/O–I/O capacitance | 1.25 pF max ensures <0.1 dB insertion loss at 480 MHz USB 2.0 signaling |
| Three-channel bidirectional protection | Single device replaces three discrete TVS diodes, reducing BOM count and layout area |
| Flip-Chip footprint | 1.7 mm² board space - 30% smaller than SOT-666 variant (ESDAULC6-3BP6) |
| High-reliability monolithic structure | No wire bonds or lead frames - eliminates mechanical fatigue failure modes in vibration-prone devices |
| ECOPACK® compliance | Lead-free second-level interconnect per JEDEC JESD97; RoHS and REACH compliant |
Applications
| USB 2.0 High-Speed Interface | Mobile Audio Jack Protection |
|---|---|
Use Scenario: Protecting D+/D– and VBUS lines in smartphone USB OTG ports against repeated ESD events during cable insertion. IC Role / Device Role / Timing Role: Low-capacitance parallel clamp placed directly at connector, before series impedance matching. Use Value: Maintains 480 Mbps data integrity while suppressing >15 kV discharges without signal distortion or timing skew. | Use Scenario: Shielding 3.5 mm TRRS audio jack pins (MIC, L/R, GND) in wearables from user-hand ESD during plug insertion. IC Role / Device Role / Timing Role: Bidirectional transient suppressor on each analog audio path, referenced to shared ground. Use Value: Prevents pop-noise, amplifier latch-up, or ADC saturation caused by ±15 kV air discharge into sensitive analog inputs. |
| SIM Card Interface | High-Density Mobile Module I/O |
Use Scenario: Safeguarding SIM card slot data (CLK, DATA, RST) and power (VCC) lines in LTE modules exposed to frequent hot-swap cycles. IC Role / Device Role / Timing Role: Standoff-rated clamp on each active line, with GND return routed beneath die to minimize loop inductance. Use Value: Enables reliable 5 V/10 MHz SIM communication without false resets or data corruption during field ESD exposure. | Use Scenario: Consolidating ESD protection for multiple high-speed sensor interfaces (I²C, SPI, MIPI) in compact IoT edge nodes. IC Role / Device Role / Timing Role: Multi-line array replacing discrete diodes to reduce routing congestion and improve layout symmetry. Use Value: Cuts PCB real estate by 40% vs. discrete solutions while delivering uniform clamping across all protected channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESDAULC6-3BP6 | SOT-666 package (2.5 mm² footprint); identical electrical specs except 1.25 pF max I/O–I/O capacitance same | Preferred where reflow compatibility with standard SMT pick-and-place is required over ultra-dense placement | Select when board assembly process lacks Flip-Chip capability or requires visual inspection of solder joints |
| TPD2E001DRYR | TI part: 1.0 pF typ I/O–I/O, 6.5 V stand-off, 12 V clamping @ 4 A - lower clamping but higher leakage (1 µA) | Better for ultra-low-noise analog sensors; less robust for 15 kV system-level ESD compliance | Choose when signal fidelity dominates over peak surge handling, e.g., precision audio front-ends |
Compared with ESDAULC6-3BF2, the SOT-666 variant offers easier manufacturability but larger area, while TPD2E001DRYR trades clamping robustness for marginally lower capacitance - making ESDAULC6-3BF2 optimal for space-constrained USB 2.0 designs demanding full IEC 61000-4-2 Level 4 compliance.
Availability
ESDAULC6-3BF2 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, mobile audio jack safeguarding, and SIM card interface hardening requiring stable component supply across high-volume consumer electronics production.
Supply support for ESDAULC6-3BF2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and protection devices for industrial, automotive, and consumer markets.
The ESDAULC6 family targets high-speed digital interface protection, specifically engineered to meet stringent ESD immunity requirements in space-constrained portable electronics without compromising signal fidelity.
FAQ
What is the maximum recommended PCB pad size for ESDAULC6-3BF2 Flip-Chip mounting?
The manufacturer specifies a copper pad diameter of 220 µm, with solder stencil opening of 330 µm and solder mask opening of 300 µm. Deviating beyond ±10% risks insufficient wetting or bridging. Pad layout must follow Figure 26 in the official datasheet, including precise 500 µm center-to-center bump pitch and alignment dot for Pin A1 identification.
Does ESDAULC6-3BF2 support hot-swap protection for USB 2.0 VBUS lines?
No - ESDAULC6-3BF2 is rated for signal-line protection only (I/O1–I/O3), not power rails. Its 6 V stand-off voltage and lack of overvoltage shutdown logic make it unsuitable for direct VBUS clamping. For VBUS, ST recommends dedicated load switches like STL130N4LF5 or discrete TVS diodes with ≥20 V breakdown.
Can ESDAULC6-3BF2 be used on MIPI D-PHY lanes operating at 1.5 Gbps?
Yes - its ≤1.25 pF capacitance and verified <0.1 dB insertion loss up to 3.0 GHz (per Figure 18) ensure compliance with MIPI D-PHY v2.1 eye diagram requirements at 1.5 Gbps. Layout must maintain 50 Ω differential impedance and minimize stub length between diode and connector.
Is the "3B" marking on ESDAULC6-3BF2 indicative of RoHS compliance?
Yes - "3B" denotes bidirectional configuration and Flip-Chip packaging; RoHS compliance is confirmed separately via ECOPACK® certification (lead-free second-level interconnect per JEDEC JESD97), documented in the inner box label and www.st.com/ecopack. The device also meets REACH SVHC thresholds.
ESDAULC6-3BF2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 4-WFBGA, FCBGA
- Series:
- ESDA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 3
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-FlipChip (1.6x1.1)
ESDAULC6-3BF2 FAQ
1.How can I place an order for ESDAULC6-3BF2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDAULC6-3BF2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDAULC6-3BF2 reliable?
The price and inventory of ESDAULC6-3BF2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDAULC6-3BF2 is usually 5 days.
3.What payment methods are accepted for ESDAULC6-3BF2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDAULC6-3BF2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDAULC6-3BF2?
ESDAULC6-3BF2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDAULC6-3BF2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDAULC6-3BF2?
For technical support, including ESDAULC6-3BF2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDAULC6-3BF2 requirements.
6.How does Aetrix verify that ESDAULC6-3BF2 is sourced from the original manufacturer or authorized distributors?
All ESDAULC6-3BF2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDAULC6-3BF2 meets industry standards.
7.What is the process for return or replacement of ESDAULC6-3BF2?
All ESDAULC6-3BF2 units undergo pre-shipment inspection (PSI). If there is an issue with ESDAULC6-3BF2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDAULC6-3BF2 part is unused and in its original packaging.
Return procedure for ESDAULC6-3BF2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDAULC6-3BF2 Tags
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