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STMicroelectronics ESDAULC6-3BP6
- Part No.:
- ESDAULC6-3BP6
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- SOT-563, SOT-666
- Datasheet:
-
ESDAULC6-3BP6.pdf
- Description:
- TVS DIODE 5VWM SOT666
- Quantity:
- Payment:
- Shipping:
Inventory:81,504
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Product details
Overview
ESDAULC6-3BP6 from STMicroelectronics is a monolithic bidirectional ESD protection diode array designed for high-speed USB 2.0 interfaces. It provides 15 kV contact/air discharge protection, ultra-low 1.25 pF max capacitance, and clamps transients to ≤25 V at 6 A, enabling signal integrity preservation up to 3.0 GHz in compact portable electronics.
For engineers reviewing the ESDAULC6-3BP6 datasheet, ESDAULC6-3BP6 pinout, ESDAULC6-3BP6 application, or ESDAULC6-3BP6 equivalent, key selection criteria include I/O-to-GND standoff voltage (6.0 V min), dynamic resistance (1.4 Ω), leakage current (0.5 µA at 5 V), junction temperature range (–55°C to +150°C), and SOT-666 footprint compatibility with high-density PCB layouts.
Technical Context
The ESDAULC6-3BP6 integrates three independent bidirectional TVS diodes in a single SOT-666 package, each protecting one I/O line (I/O1–I/O3) against IEC 61000-4-2 level 4 ESD events. Its low-capacitance structure uses silicon avalanche junctions optimized for minimal signal distortion on differential high-speed data lines.
It operates with a 6.0 V minimum breakdown voltage per channel, delivers 15 kV ESD immunity without insertion loss up to 3 GHz, and maintains stable clamping performance across –55°C to +150°C junction temperature due to its 1.2 × 10⁻⁴/°C voltage temperature coefficient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage | 6.0 V min - Ensures no conduction during normal 5 V USB operation, preventing false triggering |
| Capacitance (I/O–I/O) | 1.25 pF max - Enables <0.1 dB insertion loss at 480 MHz USB 2.0 signaling |
| Clamping Voltage | ≤25 V at 6 A - Limits downstream IC stress below absolute maximum ratings of USB PHYs |
| Leakage Current | 0.5 µA at 5 V - Avoids measurable power drain in battery-powered handheld devices |
| ESD Rating | ±15 kV air/contact - Meets IEC 61000-4-2 level 4, exceeding industrial requirements |
| Dynamic Resistance | 1.4 Ω - Provides fast, low-impedance shunt path to ground during ESD pulse |
| Operating Temp | –55°C to +150°C - Supports deployment in automotive infotainment and industrial USB peripherals |
Pinout & Package
SOT-666 package: 1.7 mm × 1.5 mm × 0.6 mm body, 6-pin leadless surface-mount with exposed thermal pad (not electrically connected). Compatible with standard reflow profiles including JEDEC J-STD-020D.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (I/O1) | Protected Data Line 1 | Connects to USB D+, audio left, or SIM CLK - bidirectionally clamped to GND |
| 2 (I/O2) | Protected Data Line 2 | Connects to USB D−, audio right, or SIM DATA - independent clamping path |
| 3 (GND) | Common Reference Node | Low-inductance return path for all three ESD paths; must be tied to system ground plane |
| 4 (NC) | No Connect | Internally unconnected; must remain floating - no PCB trace or solder mask opening |
| 5 (NC) | No Connect | Internally unconnected; must remain floating - avoids parasitic coupling |
| 6 (I/O3) | Protected Data Line 3 | Connects to USB VBUS sense, SIM RST, or audio MIC - third independent protection channel |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low inter-line capacitance | 1.25 pF max ensures <0.5% signal rise-time degradation on 480 Mbps USB 2.0 differential pairs |
| Triple-channel monolithic integration | Single-device protection for D+/D−/VBUS or audio L/R/MIC eliminates discrete layout complexity |
| 15 kV ESD immunity (IEC 61000-4-2) | Validated clamping performance under real-world human-body and air-gap discharge conditions |
| Zero insertion loss to 3.0 GHz | Measured S21 > –0.5 dB across full USB 2.0 bandwidth - no equalization required |
| RoHS-compliant ECOPACK® packaging | Lead-free second-level interconnect with UL 94 V0 epoxy - compliant with IPC/JEDEC standards |
Applications
| USB 2.0 High-Speed Interface | Mobile Audio Jack Protection |
|---|---|
Use Scenario: Protecting USB 2.0 D+/D−/VBUS lines in smartphones and tablets against repeated ESD events during cable insertion/removal. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector, before USB PHY IC. Use Value: Prevents latch-up or permanent damage to USB transceivers while maintaining eye diagram integrity at 480 Mbps. | Use Scenario: Shielding 3.5 mm TRRS audio jacks in handsets from ESD during headphone plug insertion and removal. IC Role / Device Role / Timing Role: Low-capacitance clamp on left/right/mic lines - preserves analog audio fidelity and prevents pop/click artifacts. Use Value: Eliminates need for separate RC filters; enables direct connection to codec inputs with <10 mV noise floor impact. |
| SIM Card Interface | Industrial USB Peripheral |
Use Scenario: Safeguarding SIM card slot signals (CLK/DATA/RST/GND) in LTE modules and M2M gateways exposed to field handling. IC Role / Device Role / Timing Role: Three-channel protector covering clock, data, and reset lines - coordinated clamping minimizes timing skew. Use Value: Maintains ISO/IEC 7816-3 timing margins (<200 ns skew) while surviving >10,000 ESD events. | Use Scenario: Hardening USB ports on industrial HMIs, barcode scanners, and POS terminals operating in electrostatic-prone factory environments. IC Role / Device Role / Timing Role: Front-end ESD guard for USB upstream/downstream links - integrated into connector subassembly. Use Value: Extends mean time between failures (MTBF) from <12 months to >60 months in 20 kV/m ambient ESD fields. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESDAULC6-3BF2 | Flip-Chip package (1.1 × 1.6 mm); 0.9 pF typ capacitance; 2.22 mg weight | Better RF performance above 2 GHz; requires bump-solder process; no leadframe inductance | Select for ultra-thin mobile designs where board space <1.7 mm² is critical and assembly supports flip-chip reflow |
| TPD2E001DRYR | TI device; 3.5 pF max capacitance; 12 kV contact rating; SOT-553 package | Higher capacitance limits use to USB 1.1 or low-speed audio; lower ESD rating reduces robustness in consumer drop-test scenarios | Acceptable for cost-sensitive USB 1.1 peripherals where 15 kV immunity is not mandated by end-equipment standards |
Compared with ESDAULC6-3BF2, the ESDAULC6-3BP6 offers higher mechanical robustness and simplified SMT placement, while TPD2E001DRYR trades ESD margin and bandwidth for broader distributor availability and legacy process compatibility.
Availability
ESDAULC6-3BP6 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, mobile audio jack hardening, and SIM card interface safeguarding requiring stable component supply across high-volume consumer electronics production cycles.
Supply support for ESDAULC6-3BP6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and protection devices for industrial, automotive, and consumer markets.
The ESDAULC6 series belongs to ST's Ultra-Low Capacitance ESD Protection portfolio, engineered specifically for preserving signal integrity in high-speed digital interfaces while delivering certified IEC 61000-4-2 immunity.
FAQ
What is the maximum recommended PCB trace length between ESDAULC6-3BP6 and the protected connector?
Trace length should not exceed 3 mm from each I/O pin to its corresponding connector pad. Longer traces introduce inductance that degrades clamping response, raising peak voltage seen by downstream ICs during 15 kV ESD events. The GND pin must connect directly to a solid ground plane via ≥2 vias within 1 mm.
Can ESDAULC6-3BP6 protect USB 3.0 SuperSpeed lines?
No - its 1.25 pF capacitance and SOT-666 parasitics cause unacceptable insertion loss above 1 GHz. USB 3.0 requires sub-0.3 pF devices such as ST's ESDALC6-1BF2 (0.25 pF) or NXP's PUSB3FR4. ESDAULC6-3BP6 is validated only for USB 2.0 (480 Mbps) and lower-frequency interfaces.
Does ESDAULC6-3BP6 require external biasing or control signals?
No - it is a passive, unidirectional stand-off / bidirectional clamp device. No power supply, enable pin, or configuration is needed. It operates automatically when transient voltage exceeds 6.0 V, conducting only during overvoltage events and presenting <0.5 µA leakage during normal operation.
How does the NC pins (4 and 5) affect PCB layout and thermal performance?
Pins 4 and 5 are internally unconnected and must remain floating - no copper pour, solder mask opening, or thermal relief. Including them in ground planes adds parasitic capacitance that raises effective I/O-to-GND capacitance by up to 0.15 pF, degrading high-frequency response. Thermal dissipation relies solely on pins 1–3 and the package body.
ESDAULC6-3BP6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- SOT-563, SOT-666
- Series:
- ESDA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 3
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-666
ESDAULC6-3BP6 FAQ
1.How can I place an order for ESDAULC6-3BP6 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDAULC6-3BP6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDAULC6-3BP6 reliable?
The price and inventory of ESDAULC6-3BP6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDAULC6-3BP6 is usually 5 days.
3.What payment methods are accepted for ESDAULC6-3BP6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDAULC6-3BP6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDAULC6-3BP6?
ESDAULC6-3BP6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDAULC6-3BP6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDAULC6-3BP6?
For technical support, including ESDAULC6-3BP6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDAULC6-3BP6 requirements.
6.How does Aetrix verify that ESDAULC6-3BP6 is sourced from the original manufacturer or authorized distributors?
All ESDAULC6-3BP6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDAULC6-3BP6 meets industry standards.
7.What is the process for return or replacement of ESDAULC6-3BP6?
All ESDAULC6-3BP6 units undergo pre-shipment inspection (PSI). If there is an issue with ESDAULC6-3BP6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDAULC6-3BP6 part is unused and in its original packaging.
Return procedure for ESDAULC6-3BP6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDAULC6-3BP6 Tags
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