STMicroelectronics ESDAVLC5-4BX4
- Part No.:
- ESDAVLC5-4BX4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 4-Micro-X
- Datasheet:
-
ESDAVLC5-4BX4.pdf
- Description:
- TVS DIODE 3VWM 18VC 4-MICRO-X
- Quantity:
- Payment:

- Shipping:

Inventory:2,776
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Product details
Overview
ESDAVLC5-4BX4 from STMicroelectronics is a 4-line bidirectional Transil™ ESD protection array with 5.5 V minimum breakdown voltage, 10 pF line capacitance, and 18 V clamping voltage at 1 A (8/20 µs), designed for high-density I/O protection in portable multimedia devices.
For engineers reviewing the ESDAVLC5-4BX4 datasheet, ESDAVLC5-4BX4 pinout, ESDAVLC5-4BX4 application, or ESDAVLC5-4BX4 equivalent, key selection criteria include low capacitance for high-speed signal integrity, ±15 kV air/±8 kV contact ESD immunity per IEC 61000-4-2 Level 4, and ultra-small 0.64 mm² micro package footprint.
Technical Context
This monolithic silicon avalanche diode array integrates four independent bidirectional ESD protection cells in a single GND-centered 4-terminal micro package. Each channel provides symmetrical clamping behavior with dynamic resistance of 0.53 Ω (I/O-to-GND) and 0.37 Ω (GND-to-I/O), enabling fast transient response under ±8 kV contact discharge.
It operates over –30 °C to +85 °C and maintains leakage current below 50 nA at 3 V reverse bias. The device complies with RoHS and UL94 V0 epoxy standards, and is optimized for USB 2.0, HDMI, audio jack, and SD card interface protection where signal fidelity and board space are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBR min | 5.5 V - Ensures reliable turn-on before system-level IC damage thresholds in 3.3 V or 5 V interfaces |
| VCL @ 1 A | 18 V - Limits transient voltage across protected lines to safe levels during IEC 61000-4-2 events |
| CLINE | 10 pF - Preserves signal integrity for data rates up to 480 Mbps (USB 2.0) without distortion |
| IPP max | 2 A - Sustains peak pulse current from 8/20 µs surges without degradation |
| Rd (I/O–GND) | 0.53 Ω - Minimizes voltage overshoot during fast ESD transients (<1 ns rise time) |
| Leakage @ 3 V | <50 nA - Prevents DC loading on sensitive analog or RF signal paths |
| Package size | 0.8 mm × 0.8 mm × 0.35 mm - Enables placement adjacent to connectors in space-constrained mobile PCBs |
Pinout & Package
The ESDAVLC5-4BX4 uses a 4-lead micro package with exposed GND pad (no thermal pad connection required). Pin 1 is marked by a dot; pins are arranged as IO1–IO2–IO3–IO4–GND in linear sequence with GND centered.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO1 | Bidirectional ESD protection input/output | Connects to first protected signal line (e.g., USB D+); conducts surge energy to GND in either polarity |
| IO2 | Bidirectional ESD protection input/output | Connects to second protected line (e.g., USB D−); shares same clamping characteristics as IO1 |
| IO3 | Bidirectional ESD protection input/output | Connects to third line (e.g., audio left channel); independent cell with matched VBR and CLINE |
| IO4 | Bidirectional ESD protection input/output | Connects to fourth line (e.g., audio right channel); fully decoupled from other channels |
| GND | Common reference and surge return path | Centered terminal minimizes inductance; must be connected to solid PCB ground plane for optimal clamping |
Key Features
| Feature | Design Value |
|---|---|
| 4-channel bidirectional protection | Single-package solution for differential or independent signal pairs without polarity constraints |
| 10 pF line capacitance | Enables use on high-speed digital interfaces (USB 2.0, SDIO, I²S) without signal attenuation |
| ±15 kV air / ±8 kV contact ESD rating | Fully satisfies IEC 61000-4-2 Level 4, eliminating need for external spark gaps or multi-stage protection |
| 0.64 mm² PCB area | Reduces layout area by >60% vs. discrete diode solutions, critical for thin mobile form factors |
| Lead-free & RoHS compliant | Meets global environmental regulations and supports Pb-free reflow profiles (260 °C, 10 s) |
Applications
| Mobile Phone Front Panel Interfaces | USB 2.0 OTG Ports |
|---|---|
Use Scenario: Protecting touchscreen controller I/O, camera flex cables, and headphone jack contacts from user-hand ESD events. IC Role / Device Role / Timing Role: Standby-mode ESD clamp; activates only during transient events with no impact on normal signal timing. Use Value: Prevents latch-up or gate oxide damage in baseband processors and PMICs while maintaining <10 pF loading on 10–20 MHz analog touch signals. | Use Scenario: Safeguarding USB D+/D− lines in dual-role OTG ports against repeated plug/unplug ESD stress. IC Role / Device Role / Timing Role: Passive bidirectional shunt protector; zero latency response preserves USB packet timing integrity. Use Value: Enables full-speed 480 Mbps operation without eye diagram degradation or bit error rate increase due to capacitive loading. |
| Portable Audio DAC Outputs | SD Card Interface Lines |
Use Scenario: Shielding stereo line-out and microphone input traces in Bluetooth headphones and earbuds. IC Role / Device Role / Timing Role: Low-leakage (50 nA) voltage clamp; avoids DC offset or noise injection into audio paths. Use Value: Maintains SNR >100 dB and THD+N <0.005% in 24-bit/96 kHz playback by limiting capacitance to 10 pF per channel. | Use Scenario: Securing CMD, CLK, DAT0–DAT3 lines in embedded SD/MMC sockets used in tablets and IoT gateways. IC Role / Device Role / Timing Role: High-speed transient suppressor; clamps sub-100 ns ESD spikes before SD controller logic threshold violation. Use Value: Eliminates SD card initialization failures and CRC errors caused by ESD-induced bus glitches during hot insertion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E001DRYR | Higher capacitance (15 pF), lower VBR (4.5 V), same 4-channel bidirectional topology | Better suited for 1.8 V I/O rails; less ideal for 3.3 V USB due to earlier conduction | Select when protecting low-voltage logic with tighter VBR margin requirements |
| ESD5451N-2/TR | Unidirectional configuration, 5.5 V VBR, 12 pF, 1.2 mm × 1.0 mm package | Requires separate GND and VCC connections; unsuitable for AC-coupled or floating lines | Choose only for DC-biased signal paths where polarity is fixed and board area is less constrained |
Compared with TPD4E001DRYR and ESD5451N-2/TR, the ESDAVLC5-4BX4 offers superior high-speed signal compatibility via its 10 pF capacitance and symmetric bidirectional response-critical for differential, AC-coupled, or shared-bus interfaces where polarity reversal occurs.
Availability
ESDAVLC5-4BX4 is available at Aetrix Electronics and suitable for mobile phone front panels, USB 2.0 OTG ports, and portable audio DAC outputs requiring stable component supply and consistent ESD performance across production batches.
Supply support for ESDAVLC5-4BX4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering automotive, industrial, and consumer ICs with emphasis on power efficiency, reliability, and system integration.
The ESDAVLC5-4BX4 belongs to ST's Transil™ ESD protection product line, engineered specifically for ultra-low-capacitance, high-density I/O protection in battery-powered portable electronics where PCB real estate and signal integrity are primary constraints.
FAQ
What is the maximum operating temperature range for ESDAVLC5-4BX4?
The ESDAVLC5-4BX4 is rated for continuous operation from –30 °C to +85 °C ambient temperature. Its junction temperature remains within safe limits under typical PCB layouts with moderate copper pour, and it meets storage specifications up to +150 °C. Thermal derating is not required within this range.
Does ESDAVLC5-4BX4 require external biasing or control signals?
No. The ESDAVLC5-4BX4 is a passive, voltage-triggered device with no external power, enable pins, or control logic. It remains in high-impedance standby until transient voltage exceeds 5.5 V, then clamps automatically using internal avalanche breakdown-ideal for always-on protection without design overhead.
Can ESDAVLC5-4BX4 be used on high-speed differential pairs like HDMI or MIPI?
It is not recommended for HDMI or MIPI D-PHY due to insufficient bandwidth: its S21 attenuation reaches –3 dB near 1 GHz, limiting usable bandwidth to ~400 MHz. It is validated for USB 2.0 (480 Mbps) and audio interfaces but lacks the sub-1 pF capacitance needed for 1.5+ Gbps serial links.
How does the 0.53 Ω dynamic resistance affect system-level ESD performance?
The 0.53 Ω dynamic resistance (I/O-to-GND) directly determines clamping voltage rise during fast ESD events: VCL = VBR + IPP × Rd. At 1 A, it contributes ~0.5 V of additional voltage beyond breakdown, ensuring predictable, repeatable clamping behavior essential for compliance with IEC 61000-4-2 test repeatability requirements.
ESDAVLC5-4BX4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 4-Micro-X
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 18V
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- 30W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -30°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-Micro-X
ESDAVLC5-4BX4 FAQ
1.How can I place an order for ESDAVLC5-4BX4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDAVLC5-4BX4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDAVLC5-4BX4 reliable?
The price and inventory of ESDAVLC5-4BX4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDAVLC5-4BX4 is usually 5 days.
3.What payment methods are accepted for ESDAVLC5-4BX4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDAVLC5-4BX4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDAVLC5-4BX4?
ESDAVLC5-4BX4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDAVLC5-4BX4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDAVLC5-4BX4?
For technical support, including ESDAVLC5-4BX4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDAVLC5-4BX4 requirements.
6.How does Aetrix verify that ESDAVLC5-4BX4 is sourced from the original manufacturer or authorized distributors?
All ESDAVLC5-4BX4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDAVLC5-4BX4 meets industry standards.
7.What is the process for return or replacement of ESDAVLC5-4BX4?
All ESDAVLC5-4BX4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDAVLC5-4BX4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDAVLC5-4BX4 part is unused and in its original packaging.
Return procedure for ESDAVLC5-4BX4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDAVLC5-4BX4 Tags

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Toshiba Semiconductor and Storage

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