STMicroelectronics ESDAVLC6V1-1BM2

Overview

ESDAVLC6V1-1BM2 from STMicroelectronics is a single-line, bidirectional ESD protection diode designed for high-speed serial interfaces including USB 2.0, display, and camera links. It features a minimum breakdown voltage of 6.1 V, typical junction capacitance of 6 pF at 3 V, peak pulse power dissipation of 30 W (8/20 µs), and clamping voltage ≤15 V at 2.5 A peak pulse current. It is housed in a compact SOD882 package (0.6 mm² footprint) and complies with IEC 61000-4-2 Level 4 (±15 kV air / ±8 kV contact discharge).

For engineers reviewing the ESDAVLC6V1-1BM2 datasheet, ESDAVLC6V1-1BM2 pinout, ESDAVLC6V1-1BM2 application, or ESDAVLC6V1-1BM2 equivalent, key selection criteria include low-capacitance transient suppression for signal integrity preservation, PCB space constraints in portable electronics, ESD robustness per MIL-STD-883G Class 3B, and compatibility with high-speed differential pairs requiring sub-7 pF loading.

Technical Context

This monolithic Transil™ device operates as a voltage-clamped bidirectional TVS diode, leveraging silicon avalanche structure to respond within <1 ns to ESD transients. Its low dynamic resistance (1.6 Ω typ.) ensures minimal voltage overshoot during fast-rising events, while its temperature coefficient of breakdown voltage (2.5 × 10⁻⁴ /°C) supports stable operation across –40 °C to +125 °C.

The device is optimized for placement directly at interface connectors or IC pins, where parasitic inductance must be minimized. Its 6 pF capacitance at 3 V reverse bias enables use on 480 Mbps USB 2.0 data lines without measurable signal degradation, as confirmed by S21 attenuation measurements showing <–20 dB insertion loss up to 1 GHz.

Key Specifications

Pinout & Package

The ESDAVLC6V1-1BM2 is supplied in the SOD882 surface-mount package: a 2-pin, ultra-compact, lead-free, RoHS-compliant case measuring 1.0 × 0.6 × 0.5 mm (L × W × H), with pin 1 marked by an index area on the top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with TPD1E05U06DPYR and ESD9X5.0ST5G, the ESDAVLC6V1-1BM2 uniquely balances 6 pF capacitance, 30 W surge rating, and full IEC 61000-4-2 Level 4 compliance-making it optimal for USB 2.0 and MIPI interfaces where both speed and ruggedness are non-negotiable.

Availability

ESDAVLC6V1-1BM2 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, mobile camera module safeguarding, and display link ESD guarding requiring stable component supply and long-term lifecycle support.

Supply support for ESDAVLC6V1-1BM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensing solutions for automotive, industrial, and consumer markets.

The ESDAVLC6V1-1BM2 belongs to ST's Transil™ ESD protection portfolio, engineered specifically for high-speed data line protection where sub-7 pF capacitance and IEC 61000-4-2 Level 4 immunity are mandatory design requirements.

FAQ

What is the maximum operating temperature range for ESDAVLC6V1-1BM2?

The ESDAVLC6V1-1BM2 is rated for continuous operation from –40 °C to +125 °C ambient temperature. Its junction temperature must not exceed 125 °C under surge conditions, and thermal derating curves show peak pulse power drops to ~70% at 100 °C initial junction temperature-critical for thermally constrained mobile PCB layouts.

Does ESDAVLC6V1-1BM2 require external biasing or control signals?

No. The ESDAVLC6V1-1BM2 is a passive, bidirectional TVS diode that requires no external power, bias, or control. It remains in high-impedance standby (leakage <100 nA at 3 V) until an ESD event exceeds its 6.1 V breakdown threshold, at which point it clamps automatically via avalanche conduction.

Can ESDAVLC6V1-1BM2 protect differential pairs without skewing signal timing?

Yes. With matched 6 pF capacitance on both pins and <1 ns response symmetry, it introduces negligible inter-pair skew (<0.05 ps) on differential lines like USB D+/D−. Its monolithic construction eliminates bond-wire mismatch, and S21 data confirms flat attenuation response up to 1 GHz-preserving eye opening and jitter budgets.

How does the SOD882 package affect solder joint reliability during reflow?

The SOD882 package uses a standard 0201-compatible footprint with 0.65 mm pitch and 0.45 mm lead length. ST recommends a 100 µm stencil thickness, 60–65% aperture-to-pad ratio, and peak reflow temperature of 255 °C (max 260 °C) for reliable void-free joints-validated per J-STD-020 moisture sensitivity level 1 handling.