STMicroelectronics ESDAVLC8-1BM2
- Part No.:
- ESDAVLC8-1BM2
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- SOD-882
- Datasheet:
-
ESDAVLC8-1BM2.pdf
- Description:
- TVS DIODE 3VWM SOD882
- Quantity:
- Payment:

- Shipping:

Inventory:2,841
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Product details
Overview
ESDAVLC8-1BM2 from STMicroelectronics is a single-line, bidirectional transient voltage suppressor (TVS) diode designed for ESD protection of high-speed data lines. It features a minimum breakdown voltage of 8.5 V, 4.5 pF capacitance at 0 V, <50 nA reverse leakage at 3 V, and meets IEC 61000-4-2 Level 4 (±17 kV contact/air discharge) in compact SOD882 package. It is deployed in USB 2.0, HDMI, and cellular handset I/O ports where signal integrity and board space are critical.
For engineers reviewing the ESDAVLC8-1BM2 datasheet, ESDAVLC8-1BM2 pinout, ESDAVLC8-1BM2 application, or ESDAVLC8-1BM2 equivalent, key selection criteria include low-line capacitance (<5 pF), bidirectional clamping performance, IEC-compliant ESD robustness, and SOD882 footprint compatibility with high-density PCB layouts.
Technical Context
This TVS diode uses monolithic silicon avalanche structure to provide symmetrical clamping in both polarities without external biasing. Its low dynamic resistance (2 Ω typical at 1 A pulse) ensures rapid voltage suppression during sub-nanosecond ESD events while maintaining minimal signal distortion on protected lines.
Designed specifically for unidirectional line protection with no DC path, it operates across –55 °C to +150 °C junction temperature and delivers 30 W peak pulse power (8/20 µs waveform) with clamping voltage ≤17 V at 1.3 A peak current - enabling reliable protection of 3.3 V and 5 V interface circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage (VBR) | 8.5 V min (direct), 14.5 V min (reverse); ensures triggering before damage to 3.3 V/5 V I/O structures |
| Junction Capacitance (CLINE) | 4.5 pF at 0 V; preserves signal rise time & bandwidth in >100 MHz interfaces like USB 2.0 |
| Peak Pulse Power (PPP) | 30 W (8/20 µs); sustains multiple ESD strikes without degradation in handheld device use cases |
| Clamping Voltage (VCL) | ≤17 V at 1.3 A IPP; limits transient overvoltage to safe levels for downstream logic inputs |
| Leakage Current (IRM) | <50 nA at 3 V; avoids loading of high-impedance analog or reference lines |
| ESD Rating | ±17 kV contact & air (IEC 61000-4-2 Level 4); exceeds industrial and consumer immunity requirements |
| Package | SOD882 (0.6 mm² footprint); enables placement adjacent to connectors without trace stubs |
Pinout & Package
The ESDAVLC8-1BM2 is housed in a 2-pin SOD882 surface-mount package with exposed pad not electrically connected. Pin 1 and Pin 2 serve as bidirectional I/O terminals with no polarity marking required for ESD protection function.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | I/O Line Terminal (Anode/Cathode) | Bidirectional connection point; symmetric avalanche structure allows either terminal to act as anode or cathode depending on transient polarity |
| Pin 2 | I/O Line Terminal (Cathode/Anode) | Second terminal of differential pair; forms low-inductance path to ground via PCB layout for effective ESD shunting |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD Clamping | Enables single-device protection of AC-coupled or floating data lines without polarity constraints |
| Ultra-Low 4.5 pF Capacitance | Minimizes insertion loss and reflection in high-speed serial links up to 480 Mbps (USB 2.0) |
| Monolithic Silicon Construction | Eliminates bond wire inductance and inter-die mismatch, improving response time consistency |
| ECOPACK®2 Compliance | Meets RoHS and halogen-free requirements without compromising surge handling capability |
Applications
| USB 2.0 Data Lines | HDMI DDC/CEC Channels |
|---|---|
Use Scenario: Protecting differential USB 2.0 D+/D– lines from user-handling ESD in portable docking stations. IC Role / Device Role / Timing Role: Bidirectional TVS placed immediately after connector to clamp transients before reaching PHY IC. Use Value: 4.5 pF capacitance prevents signal integrity degradation at 480 Mbps while meeting ±15 kV IEC 61000-4-2. | Use Scenario: Safeguarding HDMI DDC (I²C) and CEC control lines against ESD during cable hot-plug events. IC Role / Device Role / Timing Role: Low-leakage (50 nA) TVS ensuring I²C pull-up networks remain functional post-ESD event. Use Value: Sub-50 nA leakage avoids bus contention or false ACK/NACK under 3.3 V operation. |
| Smartphone Audio Jacks | Industrial Sensor Interface Ports |
Use Scenario: Shielding 3.5 mm TRRS audio jack contacts from human-body ESD during headphone insertion. IC Role / Device Role / Timing Role: Single-line TVS per conductor (left/right/mic/ground) minimizing BOM count and board area. Use Value: 0.6 mm² SOD882 footprint fits within tight spacing constraints of modern smartphone PCBs. | Use Scenario: Protecting RS-485 or CAN FD transceiver I/O pins in factory-floor PLC modules exposed to maintenance personnel ESD. IC Role / Device Role / Timing Role: Robust 30 W pulse handling withstands repeated surges in harsh industrial environments. Use Value: –55 °C to +150 °C operating range supports deployment in uncontrolled ambient enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD9B5.0ST5G (ON Semi) | 5.0 V nominal breakdown; 15 pF capacitance; SOD-923 package | Higher capacitance limits use to lower-speed interfaces (<10 MHz) | Select when lower clamping voltage is prioritized over bandwidth preservation |
| TPD2E001DRYR (TI) | Dual-channel array; 10 pF per line; 0.65 mm × 0.65 mm DRY package | Offers dual-line protection in same footprint but higher capacitance per channel | Choose for space-constrained dual-line protection where 10 pF is acceptable |
Compared with ESD9B5.0ST5G and TPD2E001DRYR, the ESDAVLC8-1BM2 provides superior high-frequency performance due to its 4.5 pF capacitance and optimized monolithic structure, making it preferred for USB 2.0, HDMI, and other >100 MHz interfaces requiring minimal signal loading.
Availability
ESDAVLC8-1BM2 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI auxiliary channel safeguarding, and smartphone audio jack ESD hardening requiring stable component supply and long-term production continuity.
Supply support for ESDAVLC8-1BM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power discrete solutions with broad IP portfolio and manufacturing scale.
The ESDAVLC series belongs to ST's Transil™ TVS portfolio, engineered specifically for ultra-low-capacitance ESD protection of high-speed digital interfaces while maintaining robust surge immunity and small-form-factor integration.
FAQ
What is the maximum operating temperature for ESDAVLC8-1BM2?
The ESDAVLC8-1BM2 has a specified operating junction temperature range of –55 °C to +150 °C, validated per MIL-STD-883G Class 3 testing. This allows deployment in automotive under-hood modules, industrial motor drives, and outdoor telecom equipment without thermal derating in most PCB layouts.
Does ESDAVLC8-1BM2 require external biasing for bidirectional operation?
No. The device uses a symmetric monolithic avalanche structure with identical forward and reverse breakdown characteristics. It functions bidirectionally without any external DC bias or polarity orientation-Pin 1 and Pin 2 are electrically interchangeable in circuit layout.
How does the 4.5 pF capacitance impact USB 2.0 signal integrity?
At 4.5 pF, the device introduces negligible impedance mismatch on 90 Ω differential USB 2.0 traces, preserving eye diagram opening and jitter margin. Measured S21 attenuation remains below –0.5 dB up to 500 MHz, confirming suitability for full-speed (480 Mbps) operation without equalization.
Can ESDAVLC8-1BM2 be used in place of ESDAVLC8-1BT2?
Yes, with mechanical qualification. Both share identical electrical specs and SOD882/SOD882T are footprint-compatible variants-the "M2" uses standard SOD882, while "T2" uses thinner SOD882T. Thermal and electrical performance are equivalent; only reflow profile and stencil design differ slightly due to package height variation.
ESDAVLC8-1BM2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- SOD-882
- Series:
- ESDA, TRANSIL™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 8.5V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 30W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 4.5pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-882
ESDAVLC8-1BM2 FAQ
1.How can I place an order for ESDAVLC8-1BM2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDAVLC8-1BM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDAVLC8-1BM2 reliable?
The price and inventory of ESDAVLC8-1BM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDAVLC8-1BM2 is usually 5 days.
3.What payment methods are accepted for ESDAVLC8-1BM2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDAVLC8-1BM2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDAVLC8-1BM2?
ESDAVLC8-1BM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDAVLC8-1BM2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDAVLC8-1BM2?
For technical support, including ESDAVLC8-1BM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDAVLC8-1BM2 requirements.
6.How does Aetrix verify that ESDAVLC8-1BM2 is sourced from the original manufacturer or authorized distributors?
All ESDAVLC8-1BM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDAVLC8-1BM2 meets industry standards.
7.What is the process for return or replacement of ESDAVLC8-1BM2?
All ESDAVLC8-1BM2 units undergo pre-shipment inspection (PSI). If there is an issue with ESDAVLC8-1BM2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDAVLC8-1BM2 part is unused and in its original packaging.
Return procedure for ESDAVLC8-1BM2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDAVLC8-1BM2 Tags

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Diodes Incorporated

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Diodes Incorporated

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Diodes Incorporated

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Diodes Incorporated

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Diodes Incorporated

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Nexperia USA Inc.

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Toshiba Semiconductor and Storage

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Diodes Incorporated
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