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STMicroelectronics ESDAXLC18-1BF4
- Part No.:
- ESDAXLC18-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDAXLC18-1BF4.pdf
- Description:
- TVS DIODE 18VWM 20VC 0201
- Quantity:
- Payment:
- Shipping:
Inventory:29,900
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Product details
Overview
ESDAXLC18-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode designed for ESD protection of RF signal lines in NFC applications, featuring 0.45 pF typical line capacitance, ±10 kV IEC 61000-4-2 contact ESD rating, 29 V clamping voltage at 8 kV contact discharge, and 0201 package footprint of 0.18 mm².
For engineers reviewing the ESDAXLC18-1BF4 datasheet, ESDAXLC18-1BF4 pinout, ESDAXLC18-1BF4 application, or ESDAXLC18-1BF4 equivalent, key selection criteria include ultra-low capacitance for high-frequency signal integrity, sub-30 V clamping for sensitive RF front-end protection, 0201 SMT compatibility with dense PCB layouts, and ECOPACK®2 compliance for environmental manufacturing requirements.
Technical Context
This device operates as a transient voltage suppression diode with symmetrical bidirectional conduction, enabling protection against both positive and negative ESD events without polarity constraints. Its low dynamic resistance (5 Ω typ.) and ultra-low junction capacitance ensure minimal signal distortion on high-speed NFC and antenna matching networks.
The ESDAXLC18-1BF4 uses silicon avalanche technology to achieve fast response (<1 ns) and stable clamping performance across -40 °C to +150 °C junction temperature range. It is specifically characterized for IEC 61000-4-2 testing at 30 ns measurement point, delivering 29 V clamping under ±8 kV contact discharge conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Line Capacitance | 0.45 pF @ 1 MHz, 0 V - preserves signal integrity on 13.56 MHz NFC antennas and RF traces |
| Clamping Voltage | 29 V @ 8 kV contact discharge (30 ns), 20 V @ 1 A (8/20 µs) - limits voltage stress on NFC transceiver I/O pins |
| ESD Rating | ±10 kV contact / ±30 kV air per IEC 61000-4-2 - meets industrial-grade ESD immunity requirements |
| Leakage Current | <1 nA @ 18 V - avoids DC loading on bias-sensitive RF front ends |
| Package Size | 0201 (0.6 × 0.3 mm) - enables placement adjacent to NFC coil or IC bond pads with minimal parasitic inductance |
| Operating Temp | -40 °C to +150 °C - supports operation in thermally constrained mobile handset environments |
Pinout & Package
ESDAXLC18-1BF4 is housed in a standard 0201 surface-mount package (0.6 mm × 0.3 mm × 0.3 mm), compliant with ECOPACK®2 and lead-free soldering standards. The device has two terminals with no internal polarity distinction due to its bidirectional architecture.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Connects to protected RF line; symmetric terminal-no polarity marking required for function |
| Pin 2 | Anode/Cathode (bidirectional) | Connects to RF ground reference; forms low-inductance path for ESD current return |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.45 pF typical - maintains NFC antenna Q-factor and coupling efficiency above 13.56 MHz |
| Bidirectional ESD clamping | ±10 kV contact rating - protects AC-coupled RF paths without requiring orientation-aware layout |
| Low clamping voltage | 29 V @ 8 kV contact - stays below absolute maximum ratings of common NFC transceivers (e.g., ST25R3916) |
| 0201 footprint | 0.18 mm² board area - fits within tight spacing between NFC coil and IC pad, minimizing trace length |
Applications
| NFC Antenna Interface Protection | Smartphone Mainboard RF Line Guarding |
|---|---|
Use Scenario: Protecting the differential antenna feed line of an ISO14443-compliant NFC transceiver from user-hand ESD events during tap-to-pay interactions. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed directly across antenna port pins to shunt ESD energy before it reaches transceiver ESD structures. Use Value: 0.45 pF capacitance prevents detuning of 13.56 MHz resonant antenna; 29 V clamping ensures transceiver I/O remains within safe operating voltage. | Use Scenario: Shielding high-impedance RF receive paths (e.g., LNA input) on smartphone mainboards from ESD induced via flex cable connectors or button actuation. IC Role / Device Role / Timing Role: Single-line TVS placed inline on RF trace between antenna switch and transceiver, acting as first-stage transient suppressor. Use Value: Sub-1 nA leakage avoids DC offset in LNA bias network; 0201 size allows placement within 1 mm of IC pad to minimize stub inductance. |
| Wearable NFC Tag Reader Circuit | Tablet Integrated Smart Card Interface |
Use Scenario: Securing compact NFC reader circuits in wristband-sized wearables where PCB space and thermal mass are severely limited. IC Role / Device Role / Timing Role: ESD guard on the antenna matching network's series capacitor node, exposed to frequent human touch. Use Value: 150 °C max junction temperature rating supports operation near battery cells; 0.18 mm² footprint preserves routing space for miniaturized coil geometry. | Use Scenario: Protecting dual-mode (ISO7816 + ISO14443) smart card interface circuitry in enterprise tablets used in field service environments. IC Role / Device Role / Timing Role: Bidirectional clamp on shared contactless signal line routed through hinge or flex interconnect. Use Value: ±30 kV air discharge rating withstands ESD from dry-air handling; ECOPACK®2 compliance satisfies RoHS/REACH requirements for medical/industrial deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E05U06DPYR | 0.5 pF typ., 27 V clamping @ 1 A, SOD-523 package (1.2 × 0.8 mm) | Larger footprint increases parasitic inductance; better suited for non-NFC RF lines with more layout margin | Select when board space permits larger package and lower clamping voltage is prioritized over capacitance |
| ESD9X5.0ST5G | 5.0 V standoff, 12 pF typ., SOD-523 package | Higher capacitance degrades NFC antenna performance; intended for general-purpose digital I/O, not RF | Avoid for NFC/RF use; only consider for low-speed data lines where capacitance is not critical |
Compared with TPD1E05U06DPYR and ESD9X5.0ST5G, ESDAXLC18-1BF4 uniquely balances sub-0.5 pF capacitance and <30 V clamping in a 0201 package-making it the only option validated for direct integration into NFC antenna matching networks without retuning.
Availability
ESDAXLC18-1BF4 is available at Aetrix Electronics and suitable for NFC-enabled smartphones, wearable payment devices, and industrial tablet RFID readers requiring stable component supply and long-term lifecycle support.
Supply support for ESDAXLC18-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MEMS, power, and microcontroller solutions for automotive, industrial, and consumer markets.
The ESDAXLC18-1BF4 belongs to ST's ESD protection portfolio targeting ultra-high-frequency signal integrity, developed specifically to meet the stringent capacitance and clamping demands of NFC, Bluetooth LE, and UWB antenna interfaces.
FAQ
What is the maximum recommended PCB trace length between ESDAXLC18-1BF4 and the protected NFC antenna node?
ST recommends placing the device within 1 mm of the antenna port pad to minimize parasitic inductance. Longer traces increase impedance seen by ESD transients, raising clamped voltage beyond the rated 29 V. Layout guidelines specify direct connection with no vias or stubs, using symmetric copper pours for ground return.
Does ESDAXLC18-1BF4 require external biasing or control signals?
No. The device is a passive, bidirectional TVS diode with no terminals requiring voltage bias, enable signals, or configuration. It operates solely based on voltage threshold conduction-clamping when reverse or forward voltage exceeds ~20 V-and draws zero static current at nominal operating voltages.
Can ESDAXLC18-1BF4 be used on differential NFC signal pairs (e.g., TXP/TXN)?
Yes-each line requires its own ESDAXLC18-1BF4 placed individually between signal and ground. ST validates this configuration in AN4822 for ST25R3916-based designs. Using one device across the differential pair is not supported and would compromise common-mode ESD rejection.
Is reflow soldering profile different for ESDAXLC18-1BF4 compared to standard 0201 passives?
Yes. ST specifies peak reflow temperature ≤260 °C for 10 s, with ramp-up rate ≤3 °C/s and cooling rate ≥1 °C/s. Use halide-free, "no-clean" Type 4 solder paste and 80 µm stencil thickness to avoid tombstoning-critical due to the device's low mass and asymmetric thermal pad exposure.
ESDAXLC18-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 18V
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 20V
- Current - Peak Pulse (10/1000µs):
- 2.2A
- Power - Peak Pulse:
- 50W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 1.6pF @ 1MHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDAXLC18-1BF4 FAQ
1.How can I place an order for ESDAXLC18-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDAXLC18-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDAXLC18-1BF4 reliable?
The price and inventory of ESDAXLC18-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDAXLC18-1BF4 is usually 5 days.
3.What payment methods are accepted for ESDAXLC18-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDAXLC18-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDAXLC18-1BF4?
ESDAXLC18-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDAXLC18-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDAXLC18-1BF4?
For technical support, including ESDAXLC18-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDAXLC18-1BF4 requirements.
6.How does Aetrix verify that ESDAXLC18-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESDAXLC18-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDAXLC18-1BF4 meets industry standards.
7.What is the process for return or replacement of ESDAXLC18-1BF4?
All ESDAXLC18-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDAXLC18-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDAXLC18-1BF4 part is unused and in its original packaging.
Return procedure for ESDAXLC18-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDAXLC18-1BF4 Tags
-
ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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