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STMicroelectronics ESDAXLC6-1BU2
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- Part No.:
- ESDAXLC6-1BU2
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDAXLC6-1BU2.pdf
- Description:
- TVS DIODE 3VWM 17VC ST0201
- Quantity:
- Payment:
- Shipping:
Inventory:55,829
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Product details
Overview
ESDAXLC6-1BU2 from STMicroelectronics is a bidirectional single-line TVS diode designed for ESD protection of high-speed data lines, featuring 0.4 pF typical line capacitance, 6 V minimum breakdown voltage, ±15 kV IEC 61000-4-2 air discharge rating, and 0201 SMD package. It targets space-constrained portable electronics where signal integrity and board area minimization are critical.
For engineers reviewing the ESDAXLC6-1BU2 datasheet, ESDAXLC6-1BU2 pinout, ESDAXLC6-1BU2 application, or ESDAXLC6-1BU2 equivalent, key selection criteria include ultra-low capacitance for USB 2.0/MIPI D-PHY interfaces, sub-1 mm² footprint, ±8 kV contact ESD clamping performance, and compatibility with fine-pitch 0201 assembly processes.
Technical Context
The device operates as a clamping-type transient voltage suppressor using silicon avalanche diode technology in a symmetric bidirectional configuration. Its low dynamic impedance ensures rapid response to ESD events while maintaining sub-17 V clamping at 1 A (8/20 µs), enabling robust protection without signal distortion.
Designed specifically for high-frequency I/O lines, it achieves 0.4–0.5 pF capacitance across 200–3000 MHz at 0 V bias, minimizing insertion loss and return loss degradation. The junction temperature range spans −40 °C to +150 °C, supporting operation in thermally demanding portable environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage | 6 V min @ 1 mA - ensures reliable conduction only above normal signal swing (e.g., USB 2.0 3.3 V nominal) |
| Line Capacitance | 0.4 pF typ @ 0 V, 200–3000 MHz - preserves signal integrity for >480 Mbps data rates |
| Clamping Voltage | 17 V max @ 1 A, 8/20 µs - limits transient overvoltage to safe levels for downstream IC I/O cells |
| ESD Rating | ±15 kV air / ±8 kV contact per IEC 61000-4-2 Level 4 - meets industrial and consumer immunity requirements |
| Leakage Current | 70 nA max @ 3 V - avoids DC loading on sensitive analog or reference lines |
| Package Size | 0201 (0.6 × 0.3 mm) - enables placement adjacent to connectors or IC pads without trace detours |
Pinout & Package
The ESDAXLC6-1BU2 is housed in an ultra-compact 0201 surface-mount package (ST0201) with two terminals. Pin 1 is marked by a bar on the bottom side; orientation must be verified optically during placement. The epoxy body meets UL94 V0 and RoHS/ECOPACK®2 requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Terminal 1 | Anode/Cathode (bidirectional) | Shared terminal for symmetrical ESD current path - no polarity assignment required in layout |
| Terminal 2 | Anode/Cathode (bidirectional) | Second terminal completing the bidirectional clamping path - interchangeable with Terminal 1 |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or differential lines (e.g., USB D+/D−) without polarity constraints |
| 0.4 pF line capacitance | Reduces capacitive loading enough to maintain <0.1 dB insertion loss at 480 MHz - critical for USB 2.0 eye diagram compliance |
| 0201 footprint (0.18 mm²) | Allows placement directly at connector entry points, minimizing unprotected trace length and inductance |
| ±15 kV air discharge rating | Exceeds IEC 61000-4-2 Level 4, providing margin for real-world handling and system-level ESD testing |
Applications
| Smartphone Data Lines | Tablet MIPI D-PHY Interfaces |
|---|---|
Use Scenario: Protecting USB 2.0 OTG and micro-USB data lines from user-handling ESD events during cable insertion/removal. IC Role / Device Role / Timing Role: Standalone ESD clamp placed between connector and SoC PHY, operating transparently during normal signaling. Use Value: 0.4 pF capacitance prevents signal rise-time degradation, preserving full 480 Mbps throughput without equalization. | Use Scenario: Shielding camera sensor interface traces on thin tablet PCBs where routing density prohibits larger protection devices. IC Role / Device Role / Timing Role: Bidirectional TVS on MIPI D-PHY clock and data lanes, absorbing ±8 kV contact discharges before reaching image sensor ASIC. Use Value: Sub-17 V clamping voltage ensures downstream receiver I/O remains below absolute maximum ratings during ESD transients. |
| Digital Camera HDMI Ports | Portable Media Player Audio Jacks |
Use Scenario: Guarding mini-HDMI output pins against ESD during hot-plug connection to displays or projectors. IC Role / Device Role / Timing Role: High-frequency transient suppressor on TMDS channels, placed immediately after connector pad to minimize loop inductance. Use Value: 0201 size allows integration within 0.5 mm of HDMI connector, reducing unprotected stub length to <1 mm. | Use Scenario: Securing 3.5 mm audio jack detection and microphone bias lines in noise-sensitive portable players. IC Role / Device Role / Timing Role: Low-leakage (70 nA) ESD protector on analog audio paths, preventing DC offset shift or pop-noise injection. Use Value: Ultra-low leakage avoids loading of high-impedance bias networks, maintaining accurate jack detection thresholds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.8 pF capacitance, 5.5 V breakdown, SOT-5X3 package (1.0 × 0.6 mm) | Larger footprint; higher capacitance limits use to ≤100 Mbps interfaces | Select when board space permits and lower clamping voltage (12 V) is prioritized over capacitance |
| ESD9X5.0ST5G | 0.6 pF capacitance, 5.0 V breakdown, SOD-923 package (1.0 × 0.6 mm) | Unidirectional; requires separate devices per signal line in AC-coupled systems | Choose for cost-sensitive designs where unidirectional protection suffices and 0.6 pF is acceptable |
Compared with TPD2E001DRYR and ESD9X5.0ST5G, the ESDAXLC6-1BU2 delivers the lowest capacitance (0.4 pF) in the smallest footprint (0.18 mm²), making it uniquely suitable for >480 Mbps high-speed interfaces where both space and signal fidelity are constrained.
Availability
ESDAXLC6-1BU2 is available at Aetrix Electronics and suitable for smartphones, tablet PCs, and digital cameras requiring stable component supply with guaranteed long-term manufacturability and consistent ECOPACK®2 compliance.
Supply support for ESDAXLC6-1BU2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MEMS, power, and microcontroller products for industrial, automotive, and consumer markets.
The ESDAXLC6 series belongs to ST's XLC (Extra Low Capacitance) ESD protection portfolio, engineered specifically for high-speed digital interfaces including USB, HDMI, MIPI, and LVDS where sub-0.5 pF capacitance and minimal PCB area are mandatory.
FAQ
What is the maximum recommended reflow temperature profile for ESDAXLC6-1BU2?
The device is qualified per IPC/JEDEC J-STD-020 and supports peak reflow temperatures up to 245 °C for 20–30 seconds, with ramp rates limited to ±3 °C/s. ST recommends a maximum soldering profile with 60-second dwell time above 217 °C and controlled convection to prevent component displacement during reflow.
Does ESDAXLC6-1BU2 require orientation-specific placement on PCB?
Yes - Pin 1 is identified by a bar mark on the bottom side of the 0201 package, and optical recognition of this mark is required for correct orientation. Rotation by 180° may occur for assembly plant differentiation, but placement must always align the bar with the designated Pin 1 location on the PCB footprint.
Can ESDAXLC6-1BU2 protect against surge events beyond IEC 61000-4-2?
No - the device is rated exclusively for ESD transients per IEC 61000-4-2 (±8 kV contact / ±15 kV air). It is not designed for lightning-induced surges (IEC 61000-4-5) or repetitive switching transients. For such threats, a multi-stage protection scheme with higher-energy components is required upstream.
How does the 0.4 pF capacitance impact USB 2.0 signal integrity?
At 0.4 pF, the device introduces negligible capacitive loading on 90 Ω differential USB 2.0 traces, resulting in <0.05 dB insertion loss at 240 MHz and preserving eye diagram opening >70% at 480 Mbps. This enables direct placement at the connector without equalization or trace-length compensation.
ESDAXLC6-1BU2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESDA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 17V
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- 40W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.4pF @ 200MHz ~ 3GHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDAXLC6-1BU2 FAQ
1.How can I place an order for ESDAXLC6-1BU2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDAXLC6-1BU2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDAXLC6-1BU2 reliable?
The price and inventory of ESDAXLC6-1BU2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDAXLC6-1BU2 is usually 5 days.
3.What payment methods are accepted for ESDAXLC6-1BU2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDAXLC6-1BU2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDAXLC6-1BU2?
ESDAXLC6-1BU2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDAXLC6-1BU2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDAXLC6-1BU2?
For technical support, including ESDAXLC6-1BU2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDAXLC6-1BU2 requirements.
6.How does Aetrix verify that ESDAXLC6-1BU2 is sourced from the original manufacturer or authorized distributors?
All ESDAXLC6-1BU2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDAXLC6-1BU2 meets industry standards.
7.What is the process for return or replacement of ESDAXLC6-1BU2?
All ESDAXLC6-1BU2 units undergo pre-shipment inspection (PSI). If there is an issue with ESDAXLC6-1BU2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDAXLC6-1BU2 part is unused and in its original packaging.
Return procedure for ESDAXLC6-1BU2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDAXLC6-1BU2 Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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