My Inquiry
My Account
STMicroelectronics ESDAXLC6-1BU2K
- Part No.:
- ESDAXLC6-1BU2K
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDAXLC6-1BU2K.pdf
- Description:
- TVS DIODE 3VWM 19VC ST0201
- Quantity:
- Payment:
- Shipping:
Inventory:5,560
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ESDAXLC6-1BU2K from STMicroelectronics is a bidirectional single-line TVS diode for ESD protection of high-speed data lines, featuring 0.25 pF typical line capacitance, ±15 kV air/±8 kV contact IEC 61000-4-2 compliance, 6 V breakdown voltage, and 0201 SMD package occupying only 0.18 mm² PCB area-used in smartphone USB/MIPI interfaces and portable multimedia I/O ports.
For engineers reviewing the ESDAXLC6-1BU2K datasheet, ESDAXLC6-1BU2K pinout, ESDAXLC6-1BU2K application, or ESDAXLC6-1BU2K equivalent, key selection criteria include ultra-low capacitance (<0.35 pF), sub-2 Ω dynamic resistance, clamping voltage ≤19 V at 1 A, RoHS/ECOPACK®2 compliance, and 0201 footprint compatibility with high-density mobile PCB layouts.
Technical Context
This device implements a silicon avalanche diode structure optimized for transient suppression on signal lines without degrading high-frequency integrity. Its bidirectional symmetry enables protection against both positive and negative ESD events without polarity constraints on I/O routing.
Designed specifically for <1 GHz digital interfaces, it achieves low parasitic capacitance via minimized junction area and optimized doping profile, while maintaining robust 30 W peak pulse power handling (8/20 µs) and thermal stability across –40 °C to +150 °C operating range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage | 6 V min @ 1 mA - ensures reliable conduction before damage to downstream 3.3 V or 5 V logic circuits |
| Line Capacitance | 0.24–0.35 pF @ 0 V, 200–3000 MHz - preserves signal integrity up to 3 GHz without measurable insertion loss |
| Clamping Voltage | 19 V max @ 1 A, 8/20 µs - limits transient overvoltage to safe levels for sensitive transceivers |
| ESD Rating | ±15 kV air / ±8 kV contact per IEC 61000-4-2 Level 4 - meets industrial and consumer handheld ESD immunity requirements |
| Dynamic Resistance | 2.35–2.38 Ω - minimizes voltage overshoot during fast ESD pulses by reducing IR drop |
| Leakage Current | 1–70 nA @ 3 V - avoids DC loading or battery drain in always-on portable I/O paths |
Pinout & Package
ESDAXLC6-1BU2K uses the ST0201 (0201 metric) package: 0.28 mm × 0.30 mm × 0.23 mm body, 0.35 mm pitch, lead-free, UL94 V0 epoxy. Pin 1 is marked by a bar on the bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O | Protected signal line terminal | Bidirectional path for high-speed data (e.g., USB D+, MIPI DSI/CSI) with symmetric ESD clamping |
| GND | Reference and discharge return path | Low-inductance connection to system ground plane required to achieve specified clamping performance |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.25 pF typ. - enables use on >1 Gbps differential interfaces without signal distortion |
| 0201 footprint | 0.18 mm² PCB area - supports miniaturization in smartphones, wearables, and compact IoT sensors |
| Bidirectional protection | Symmetric VBR = 6 V - eliminates need for polarity-aware layout or external biasing networks |
| ECOPACK®2 compliance | Lead-free, halogen-free, RoHS-compliant - satisfies global environmental regulations for consumer electronics |
Applications
| Smartphone Data Interfaces | Tablet Touch & Display Links |
|---|---|
|
Use Scenario: Protecting MIPI D-PHY lanes between application processor and display/touch controller in slim bezel smartphones. IC Role / Device Role / Timing Role: Bidirectional ESD clamp on high-speed differential pairs, placed within 3 mm of connector to minimize inductance. Use Value: Prevents latch-up or gate oxide damage during assembly handling and end-user ESD events while preserving 1.5 Gbps eye diagram integrity. |
Use Scenario: Shielding capacitive touch I²C/SPI lines and eDP/LVDS video buses in 7–10 inch tablets. IC Role / Device Role / Timing Role: Single-line TVS on each signal trace, leveraging 0.25 pF capacitance to avoid timing skew or jitter accumulation. Use Value: Enables direct integration into fine-pitch BGA fanout zones without requiring additional decoupling or impedance tuning. |
| Digital Camera Sensor Interfaces | Wireless Audio Accessories |
|
Use Scenario: Safeguarding high-resolution image sensor data outputs (e.g., Sony IMX series) in action cameras and drones. IC Role / Device Role / Timing Role: ESD guard on CSI-2 serial lanes operating at 2.5 Gbps, mounted adjacent to FPC connectors. Use Value: Maintains pixel clock stability and reduces bit error rate under repeated ±8 kV contact discharge stress during field deployment. |
Use Scenario: Protecting Bluetooth audio codec I/O (PCM, I²S, GPIO) in true wireless stereo earbuds with 30 mm³ form factor. IC Role / Device Role / Timing Role: Minimal-footprint TVS on low-voltage digital control lines sharing same PCB layer as RF antenna traces. Use Value: Avoids RF desense and audio pop artifacts caused by conventional higher-capacitance ESD devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR (TI) | 0.8 pF typical capacitance, 5.5 V breakdown, 2-pin SOT-5X3 | Larger footprint (0.65 mm²), higher capacitance limits use to ≤480 Mbps interfaces | Select when board space allows larger package and lower-cost procurement is prioritized over RF performance |
| UMK105CG020CV-F (Taiyo Yuden) | 0.25 pF, but multilayer ceramic varistor (MLCV); 6.8 V working voltage, 12 V clamping | Higher leakage (>100 nA), less predictable clamping behavior under fast transients vs. silicon diode | Prefer for cost-sensitive consumer accessories where exact clamping consistency is secondary to unit price |
Compared with TPD2E001DRYR and UMK105CG020CV-F, ESDAXLC6-1BU2K delivers superior high-frequency signal fidelity due to its lower capacitance and tighter clamping voltage tolerance, making it optimal for MIPI, USB 2.0, and other >1 Gbps interfaces where timing margin is constrained.
Availability
ESDAXLC6-1BU2K is available at Aetrix Electronics and suitable for smartphones, tablet PCs, and portable multimedia devices requiring stable component supply with full ECOPACK®2 and RoHS compliance.
Supply support for ESDAXLC6-1BU2K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and consumer ICs, with manufacturing in Europe and Asia.
ESDAXLC6-1BU2K belongs to ST's ESDA XLC ultra-low-capacitance TVS family, engineered specifically for ESD hardening of high-speed digital interfaces in space-constrained portable electronics.
FAQ
What is the maximum recommended PCB trace length between ESDAXLC6-1BU2K and the protected I/O pin?
ST recommends placing the device within 3 mm of the protected I/O pin and using a dedicated low-inductance ground via adjacent to the GND terminal. Longer traces increase loop inductance, raising clamping voltage during ESD events and degrading protection effectiveness beyond the rated ±8 kV contact level.
Can ESDAXLC6-1BU2K be used on 5 V tolerant I/O lines?
Yes - its 6 V minimum breakdown voltage provides sufficient margin above 5 V logic rails, and its 19 V clamping voltage remains below the absolute maximum rating of most 5 V interface ICs. However, verify downstream IC VI/O(max) exceeds 19 V under transient conditions per manufacturer datasheets.
Does this device require external biasing or direction selection?
No - ESDAXLC6-1BU2K is inherently bidirectional with symmetrical electrical characteristics. It requires no external components, bias voltage, or orientation awareness during placement, simplifying layout and eliminating risk of reverse installation errors.
How does the 0201 package impact reflow soldering yield?
The 0201 footprint demands precise stencil design (0.007–0.008 mm aperture), fine-particle solder paste (20–45 µm), and optical bottom-side alignment. ST specifies ±0.05 mm placement tolerance and 3.5 N placement force to prevent tombstoning or solder bridging while ensuring reliable joint formation on dense HDI boards.
ESDAXLC6-1BU2K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESDA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 19V
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- 30W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.24pF @ 200MHz ~ 3GHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
ESDAXLC6-1BU2K FAQ
1.How can I place an order for ESDAXLC6-1BU2K through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDAXLC6-1BU2K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDAXLC6-1BU2K reliable?
The price and inventory of ESDAXLC6-1BU2K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDAXLC6-1BU2K is usually 5 days.
3.What payment methods are accepted for ESDAXLC6-1BU2K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDAXLC6-1BU2K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDAXLC6-1BU2K?
ESDAXLC6-1BU2K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDAXLC6-1BU2K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDAXLC6-1BU2K?
For technical support, including ESDAXLC6-1BU2K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDAXLC6-1BU2K requirements.
6.How does Aetrix verify that ESDAXLC6-1BU2K is sourced from the original manufacturer or authorized distributors?
All ESDAXLC6-1BU2K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDAXLC6-1BU2K meets industry standards.
7.What is the process for return or replacement of ESDAXLC6-1BU2K?
All ESDAXLC6-1BU2K units undergo pre-shipment inspection (PSI). If there is an issue with ESDAXLC6-1BU2K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDAXLC6-1BU2K part is unused and in its original packaging.
Return procedure for ESDAXLC6-1BU2K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDAXLC6-1BU2K Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
