STMicroelectronics ESDAXLC6-1MY2

Overview

ESDAXLC6-1MY2 from STMicroelectronics is a unidirectional single-line Transil TVS diode designed for ESD protection of high-speed data lines in portable electronics. It delivers 8 kV IEC 61000-4-2 contact discharge immunity, 0.6 pF max junction capacitance (200 MHz–3 GHz), and 6 V breakdown voltage at 1 mA, enabling use on USB 2.0, HDMI, and audio interfaces without signal integrity degradation.

For engineers reviewing the ESDAXLC6-1MY2 datasheet, ESDAXLC6-1MY2 pinout, ESDAXLC6-1MY2 application, or ESDAXLC6-1MY2 equivalent, key selection criteria include ultra-low capacitance for RF-sensitive lines, SOD882 footprint compatibility with high-density PCBs, clamping performance under ±8 kV ESD transients, and thermal stability across –40 °C to +125 °C operating range.

Technical Context

This device operates as a reverse-biased avalanche diode, triggering at 6 V (V_BR) to clamp transient overvoltages before IC damage occurs. Its low leakage (<100 nA at 3 V) and fast response time ensure minimal standby power impact and effective suppression of sub-nanosecond ESD events.

The SOD882 (µQFN-2L) package integrates cathode identification via a bar mark and supports automated placement with 0.65 mm pitch, 0.55 mm max height, and lead-free reflow compatibility per JEDEC J-STD-020.

Key Specifications

Pinout & Package

Packaged in SOD882 (µQFN-2L), a 2-terminal surface-mount package with 0.65 mm pitch, 1.00 mm × 0.60 mm body, and 0.55 mm max height. Cathode identified by bar marking on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with TPD1E05U06DPYR and ESD9X5.0ST5G, ESDAXLC6-1MY2 offers higher V_BR margin for 3.3 V systems, superior high-frequency capacitance flatness, and explicit cathode marking for assembly traceability-making it optimal for production-grade portable designs requiring repeatable ESD validation.

Availability

ESDAXLC6-1MY2 is available at Aetrix Electronics and suitable for USB interface protection, HDMI signal conditioning, and smartphone audio circuit hardening requiring stable component supply and consistent parametric performance across manufacturing lots.

Supply support for ESDAXLC6-1MY2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, delivering silicon solutions for automotive, industrial, and consumer applications with emphasis on reliability and energy efficiency.

This device belongs to ST's ESDA Transil family, engineered specifically for ultra-low-capacitance transient protection in miniaturized portable electronics where PCB real estate and signal fidelity are constrained.

FAQ

What is the maximum allowable reverse standoff voltage for continuous operation?

The maximum reverse standoff voltage (V_RM) is 3 V, verified per Table 2 of DS6650 Rev 4. Operating above this voltage risks increased leakage current and premature breakdown, especially at elevated temperatures up to +125 °C. Designers must ensure system DC bias remains ≤3 V on protected lines.

Does ESDAXLC6-1MY2 support bidirectional ESD protection?

No - ESDAXLC6-1MY2 is strictly unidirectional, with anode (Pin 1) and cathode (Pin 2) terminals defined per Figure 10. It clamps only negative transients on the anode relative to cathode. For bidirectional protection, two devices in series-opposed configuration or a dedicated bidirectional part like ESDALC6-1M2 is required.

Can this device be used on 5 V logic lines?

No - its 6 V breakdown voltage and 3 V maximum standoff voltage make it unsuitable for direct 5 V rail protection. At 5 V DC bias, the device enters conduction, causing excessive leakage and potential thermal failure. It is intended for signal lines referenced to ≤3.3 V supplies, such as USB 2.0, HDMI, or audio interfaces.

What reflow profile parameters are validated for SOD882 mounting?

ST specifies a peak reflow temperature of 240–245 °C for 2–3 seconds, with ramp-up ≤3 °C/s and ramp-down ≤6 °C/s, per Figure 14 in DS6650 Rev 4. The package is qualified for lead-free soldering and complies with JEDEC J-STD-020 moisture sensitivity level 1 (unlimited floor life at ≤30 °C/85% RH).