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onsemi ESDL3552PFCT5G
- Part No.:
- ESDL3552PFCT5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 3-XFDFN
- Datasheet:
-
ESDL3552PFCT5G.pdf
- Description:
- ESD PROTECTION
- Quantity:
- Payment:
- Shipping:
Inventory:9,671
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Product details
Overview
ESDL3552PFCT5G from onsemi is a bi-directional ultra-low-capacitance ESD protection diode in a 0201 DFN package (X4DFN3, 0.62 mm × 0.32 mm), designed for high-speed data line protection. It delivers 0.25 pF typical junction capacitance, 5.0 V stand-off voltage, <50 nA reverse leakage at 5.0 V, and clamps to 21.5 V at ±8 kV IEC 61000-4-2 contact discharge-ideal for USB 2.0/3.0/3.1 interface protection in space-constrained portable electronics.
For engineers reviewing the ESDL3552PFCT5G datasheet, pinout, applications, or equivalent options, key selection criteria include capacitance linearity over bias (±0.03 pF from 0–5 V), insertion loss (0.26 dB @ 5 GHz), dynamic resistance (<1.0 Ω), and IEC 61000-4-2 Level 4 compliance (±20 kV air/contact).
Technical Context
The ESDL3552PFCT5G is a three-terminal, bi-directional TVS diode array with Pin 1 and Pin 3 as I/O terminals and Pin 2 as common GND. Its low dynamic resistance (0.58 Ω typ) and fast TLP response enable effective clamping of sub-nanosecond ESD transients without signal distortion.
It operates across −40 °C to +85 °C with a 6.5–11.5 V breakdown range (IT = 10 mA), 14–18 V clamping under 8/20 µs lightning surge (IPP = 2 A), and maintains <0.30 pF max capacitance up to 5 V bias-critical for preserving signal integrity on >5 GHz differential data paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Junction Capacitance | 0.25 pF @ VR = 0 V, f = 1 MHz - enables minimal signal loading on USB 3.1 Gen 1 (5 Gbps) lines |
| Stand-off Voltage | 5.0 V - matches standard 3.3 V and 5 V I/O rail operating margins without false triggering |
| Clamping Voltage | 21.5 V @ IPP = 16 A (IEC 61000-4-2 Level 4) - limits transient stress below IC damage thresholds |
| Dynamic Resistance | 0.58 Ω - ensures rapid voltage collapse during ESD events, reducing energy delivered to protected IC |
| Insertion Loss | 0.26 dB @ 5 GHz - preserves eye diagram integrity and bit error rate in high-speed serial links |
| Capacitance Linearity | ±0.03 pF over 0–5 V bias - maintains consistent impedance matching across full I/O swing |
| ESD Rating | ±20 kV contact & air (IEC 61000-4-2 Level 4) - exceeds industrial and consumer immunity requirements |
Pinout & Package
ESDL3552PFCT5G uses the X4DFN3 (Case 718AB) 3-pin isolated DFN package: 0.62 mm × 0.32 mm footprint, 0.225 mm pitch, 0.10 mm nominal height. Mounting requires minimum pad dimensions per onsemi's recommended footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | I/O Terminal | Connects to protected high-speed signal line (e.g., USB D+); bidirectional conduction path to GND |
| Pin 2 | GND | Common cathode reference node; must be low-inductance connection to system ground plane |
| Pin 3 | I/O Terminal | Connects to second protected line (e.g., USB D−); symmetric clamping behavior with Pin 1 |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.25 pF typical - avoids RC delay degradation and return loss in >3 GHz data channels |
| Capacitance linearity | ±0.03 pF over 0–5 V - prevents harmonic distortion and amplitude modulation in AC-coupled interfaces |
| Low dynamic resistance | 0.58 Ω - minimizes voltage overshoot during 1 ns ESD rise time events |
| 0201 DFN footprint | 0.62 mm × 0.32 mm - saves >60% board area vs. legacy SOD-323 or SC-70 packages |
| Pb-free & RoHS compliant | Halogen-free/BFR-free construction - meets IPC-J-STD-609 Class 1 and EU RoHS Directive 2011/65/EU |
Applications
| USB 2.0/3.0 Interface Protection | High-Speed HDMI Data Lines |
|---|---|
Use Scenario: Protecting D+/D− differential pairs in smartphone USB-C ports against repeated ESD exposure during cable insertion. IC Role / Device Role / Timing Role: Bi-directional transient voltage suppressor placed directly at connector, before PHY IC input pins. Use Value: 0.25 pF capacitance prevents signal integrity loss at 480 Mbps (USB 2.0) and 5 Gbps (USB 3.0), while ±20 kV rating ensures long-term reliability. |
Use Scenario: Shielding TMDS clock and data channels in portable monitors from ESD-induced pixel corruption or link dropouts. IC Role / Device Role / Timing Role: Low-capacitance clamp on each TMDS pair, referenced to local ground to avoid common-mode noise coupling. Use Value: 0.26 dB insertion loss @ 5 GHz preserves HDMI 2.0 eye opening; 21.5 V clamping protects HDMI receiver inputs rated ≤24 V abs max. |
| PCIe Gen 3 Reference Clock Lines | MIPI D-PHY Differential Pairs |
Use Scenario: Guarding 100 MHz PCIe reference clock traces on compact laptop motherboards where layout space limits discrete filter options. IC Role / Device Role / Timing Role: ESD shunt on differential clock pair, maintaining tight phase matching between P/N paths via matched capacitance. Use Value: ±0.03 pF capacitance linearity ensures <0.1 ps skew variation across 0–3.3 V common-mode swing, preserving jitter budget. |
Use Scenario: Protecting camera sensor D-PHY lanes in automotive ADAS modules exposed to harsh ESD environments during assembly and field use. IC Role / Device Role / Timing Role: Per-lane ESD clamp at FPC connector entry point, minimizing added stub length to preserve 1.5 Gbps timing margins. Use Value: 0.62 mm × 0.32 mm footprint fits within 0.5 mm FPC pitch constraints; 5.0 V stand-off avoids interference with 1.2 V D-PHY supply rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP3203-01UTG | 0.35 pF capacitance, 3.3 V stand-off, SOD-323 package (1.7 mm × 1.25 mm) | Larger footprint; suited for lower-speed interfaces (≤1 Gbps) with less stringent size constraints | Select when board space allows larger package and 3.3 V rail compatibility is required |
| TPD2E001DRYR | 0.8 pF capacitance, 5.5 V stand-off, X2SON package (0.8 mm × 0.8 mm) | Higher capacitance limits use to ≤1.5 Gbps; larger area than ESDL3552PFCT5G but easier handling | Prefer for cost-sensitive designs where 0.8 pF is acceptable and automated placement yield is prioritized |
Compared with SP3203-01UTG and TPD2E001DRYR, ESDL3552PFCT5G offers the smallest footprint and lowest capacitance-enabling direct integration into next-generation USB4 and PCIe Gen 5 interposers where trace length and parasitic loading are critical.
Availability
ESDL3552PFCT5G is available at Aetrix Electronics and suitable for USB 3.1 interface protection, high-speed MIPI D-PHY implementations, and compact HDMI 2.0 routing requiring stable component supply and guaranteed long-term sourcing.
Supply support for ESDL3552PFCT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESDL3552PFCT5G belongs to onsemi's Ultra-Low Capacitance ESD Protection Diodes product line, engineered specifically for preserving signal fidelity in multi-gigabit serial interfaces while meeting stringent IEC 61000-4-2 Level 4 immunity requirements.
FAQ
What is the maximum operating temperature range for the ESDL3552PFCT5G?
The ESDL3552PFCT5G is specified for operation from −40 °C to +85 °C ambient temperature, with junction temperature rated up to +150 °C. This range supports deployment in consumer handhelds, automotive infotainment displays, and industrial edge sensors where thermal cycling and localized heating occur. The ESDL3552PFCT5G maintains its 0.25 pF capacitance and 21.5 V clamping performance across this full range, as validated in onsemi's Electrical Characteristics table.
Does the ESDL3552PFCT5G support bi-directional ESD protection on differential pairs?
Yes, the ESDL3552PFCT5G provides true bi-directional clamping between each I/O pin (Pin 1 and Pin 3) and the common GND (Pin 2). Its symmetrical I-V curve-verified in Figures 3 and 4 of the datasheet-ensures identical positive and negative clamping behavior, making it suitable for protecting differential signals like USB D+/D− or MIPI D-PHY without polarity concerns. The ESDL3552PFCT5G achieves this with matched dynamic resistance (0.58 Ω) and breakdown voltage (6.5–11.5 V) on both paths.
How does the 0.25 pF junction capacitance of the ESDL3552PFCT5G impact USB 3.0 signal integrity?
The 0.25 pF typical junction capacitance of the ESDL3552PFCT5G introduces negligible loading on USB 3.0 SuperSpeed (5 Gbps) differential lanes, resulting in <0.26 dB insertion loss at 5 GHz and preserving >95% of the eye opening in compliance testing. This value is confirmed in the datasheet's Electrical Characteristics table and Figure 9 (Insertion Loss). Unlike higher-capacitance alternatives, the ESDL3552PFCT5G avoids resonant peaks near 5 GHz that degrade jitter and increase bit error rates-directly enabling pass-fail compliance with USB-IF electrical specifications.
Is the ESDL3552PFCT5G compatible with lead-free reflow soldering processes?
Yes, the ESDL3552PFCT5G is Pb-free, halogen-free, and BFR-free, qualified for standard lead-free reflow profiles with a peak temperature of 260 °C (10-second duration), as stated in the Maximum Ratings table. Its X4DFN3 package uses matte tin terminations and complies with J-STD-020 moisture sensitivity level (MSL) 1. The ESDL3552PFCT5G's thermal resistance (RJA = 400 °C/W) and 300 mW power dissipation rating ensure reliable performance under typical reflow thermal mass conditions.
What is the clamping voltage of the ESDL3552PFCT5G under IEC 61000-4-2 Level 4 ESD stress?
Under IEC 61000-4-2 Level 4 contact discharge (±8 kV), the ESDL3552PFCT5G clamps to 21.5 V, measured between either I/O pin (Pin 1 or Pin 3) and GND (Pin 2), as specified in the Electrical Characteristics table. This clamping level is verified using TLP testing and remains stable across temperature and process variation. The ESDL3552PFCT5G achieves this with <1.0 Ω dynamic resistance, limiting transient energy delivered to downstream USB PHY or controller ICs.
ESDL3552PFCT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 3-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 6.5V
- Voltage - Clamping (Max) @ Ipp:
- 21.5V
- Current - Peak Pulse (10/1000µs):
- 2A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- USB
- Capacitance @ Frequency:
- 0.25pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 3-X4DFN (0.62x0.32)
ESDL3552PFCT5G FAQ
1.How can I place an order for ESDL3552PFCT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDL3552PFCT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDL3552PFCT5G reliable?
The price and inventory of ESDL3552PFCT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDL3552PFCT5G is usually 5 days.
3.What payment methods are accepted for ESDL3552PFCT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDL3552PFCT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDL3552PFCT5G?
ESDL3552PFCT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDL3552PFCT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDL3552PFCT5G?
For technical support, including ESDL3552PFCT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDL3552PFCT5G requirements.
6.How does Aetrix verify that ESDL3552PFCT5G is sourced from the original manufacturer or authorized distributors?
All ESDL3552PFCT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDL3552PFCT5G meets industry standards.
7.What is the process for return or replacement of ESDL3552PFCT5G?
All ESDL3552PFCT5G units undergo pre-shipment inspection (PSI). If there is an issue with ESDL3552PFCT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDL3552PFCT5G part is unused and in its original packaging.
Return procedure for ESDL3552PFCT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDL3552PFCT5G Tags
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