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onsemi ESDL4151MX4T5G
- Part No.:
- ESDL4151MX4T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 0402 (1006 Metric)
- Datasheet:
-
ESDL4151MX4T5G.pdf
- Description:
- TVS DIODE 15VWM 26VC 2X3DFN
- Quantity:
- Payment:
- Shipping:
Inventory:5,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ESDL4151MX4T5G from onsemi is a bidirectional ESD protection diode designed for high-speed data lines, featuring 0.8 pF typical junction capacitance, 15 V working peak reverse voltage, and clamping voltage of 21.3 V at 8 A (IEC61000−4−2 Level 2 equivalent), optimized for USB 2.0/3.0 interface protection.
For engineers reviewing the ESDL4151MX4T5G datasheet, pinout, applications, or equivalent options, key selection criteria include low-capacitance signal integrity preservation, IEC61000−4−2 Level 4 (±30 kV contact) compliance, micro-packaged footprint constraints, and bidirectional transient clamping performance under 8/20 µs surge conditions.
Technical Context
The ESDL4151MX4T5G implements a silicon avalanche diode structure in a bidirectional configuration, enabling symmetrical clamping for both positive and negative transients on I/O pins referenced to GND. Its dynamic resistance of 0.43 Ω supports rapid voltage limiting during ESD events.
Designed for placement directly at connector interfaces, it operates with 1.0 mm × 0.6 mm X3DFN2 package, 0.23 mm body height, and achieves <1.0 pF capacitance at 1 MHz - critical for maintaining signal integrity in USB 2.0 (480 Mbps) and USB 3.0 (5 Gbps) channels without insertion loss degradation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance | 0.8 pF (typ) at 0 V, 1 MHz - preserves high-speed signal integrity in USB 2.0/3.0 and eSATA links |
| Working Voltage | 15 V peak reverse - compatible with 3.3 V and 5 V I/O rails without leakage-induced power loss |
| Clamping Voltage | 22.9 V at 16 A (IEC61000−4−2 Level 4 equivalent) - limits transient overvoltage to safe levels for downstream ICs |
| ESD Rating | ±30 kV contact discharge per IEC61000−4−2 Level 4 - exceeds industrial and consumer immunity requirements |
| Surge Rating | 53 V input / 11 A peak per IEC61000−4−5 (8/20 µs) - protects against lightning-induced surges on external ports |
| Leakage Current | 1.0 µA max at 15 V - avoids DC loading on sensitive analog or low-power digital inputs |
Pinout & Package
ESDL4151MX4T5G uses the X3DFN2 (Case 514AG) surface-mount package: 1.0 mm × 0.6 mm footprint, 0.23 mm height, two-terminal bidirectional configuration with no polarity marking required.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Connected to protected I/O line; symmetric conduction enables equal clamping for ± transients |
| Pin 2 | Anode/Cathode (bidirectional) | Connected to system ground; forms low-impedance path for ESD current diversion during events |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or differential high-speed lines without polarity concerns |
| 0.8 pF capacitance | Minimizes signal distortion and return loss in >480 Mbps data paths, validated via S(2,1) insertion loss testing |
| 15 V stand-off voltage | Supports operation on 3.3 V and 5 V logic rails while maintaining margin against normal-mode noise |
| ±30 kV ESD rating | Meets highest IEC61000−4−2 Level 4 requirement without derating, eliminating need for secondary protection stages |
| X3DFN2 micro-package | Reduces PCB area by >50% vs. SOD-323, enabling placement directly at USB/eSATA connectors with minimal trace inductance |
Applications
| USB 2.0 High-Speed Interface | eSATA Data Port Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of USB 2.0 host/device ports against ESD events during hot-plug connection. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between connector and USB transceiver PHY. Use Value: 0.8 pF capacitance prevents eye diagram closure; 22.9 V clamping ensures USB PHY I/O remains below absolute maximum ratings during ±30 kV contact discharge. |
Use Scenario: Shielding eSATA TX/RX differential pairs from electrostatic discharge when connecting external storage devices. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp mounted at board edge connector, before signal conditioning circuitry. Use Value: Symmetrical clamping maintains differential signal balance; 15 V working voltage aligns with eSATA's 500 mV common-mode offset tolerance. |
| MHL 2.0 Mobile Link | Mobile Display Interface |
Use Scenario: Safeguarding MHL 2.0 video/data lanes in smartphones and tablets during cable insertion/removal. IC Role / Device Role / Timing Role: Per-lane ESD protection device integrated into MHL receptacle routing, minimizing stub length. Use Value: Sub-1 pF capacitance avoids jitter accumulation in 2.25 Gbps MHL clock-forwarded signaling; 0.23 mm height accommodates ultra-thin bezel designs. |
Use Scenario: Protecting MIPI D-PHY or LVDS display interface lines in portable electronics subject to frequent handling. IC Role / Device Role / Timing Role: Point-of-entry ESD suppressor on display flex cable connector, reducing parasitic inductance via direct GND tie. Use Value: 1.0 mm × 0.6 mm footprint allows dual-lane protection within 2.5 mm² area; low leakage prevents DC bias shift in analog pixel drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.7 pF capacitance, 5.5 V working voltage, ±15 kV IEC61000−4−2 rating | Targeted for lower-voltage I/O (1.8–3.3 V); insufficient for 5 V tolerant USB 2.0 or eSATA | Select only for sub-5 V systems where lower clamping voltage is prioritized over surge robustness |
| SZ1.5SMC15AT3G | 1500 W peak power, 24.4 V clamping at 62.5 A, 100 pF capacitance | Designed for AC mains or power rail protection; too high capacitance for high-speed data lines | Use only for board-level surge suppression on non-signal paths; not suitable for USB/eSATA placement |
Compared with TPD2E001DRYR and SZ1.5SMC15AT3G, the ESDL4151MX4T5G uniquely balances ultra-low capacitance (0.8 pF), 15 V working voltage, and ±30 kV ESD immunity - making it the only viable option for compact, high-speed interface protection where signal fidelity and space constraints coexist.
Availability
ESDL4151MX4T5G is available at Aetrix Electronics and suitable for USB 2.0/3.0 interface protection, eSATA port hardening, and MHL 2.0 mobile link designs requiring stable component supply across production lifecycles.
Supply support for ESDL4151MX4T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESDL4151MX4T5G belongs to onsemi's Micro-Packaged ESD Protection Diode family, engineered specifically for high-frequency data interface protection where minimal capacitance, precise clamping, and ultra-small footprint are mandatory design requirements.
FAQ
What is the maximum operating temperature range for the ESDL4151MX4T5G?
The ESDL4151MX4T5G supports a junction and storage temperature range of −55 °C to +150 °C, enabling reliable operation in extended industrial and automotive cabin environments. This wide thermal range ensures consistent ESD clamping performance across temperature extremes without parameter drift or leakage increase beyond specification limits.
Does the ESDL4151MX4T5G require external biasing or control signals?
No, the ESDL4151MX4T5G is a passive bidirectional TVS diode requiring no external bias, power, or control signals. It operates solely through avalanche breakdown during transient events, with zero quiescent current draw in normal operation - simplifying integration into USB, eSATA, and MHL signal paths without affecting system power budget.
Can the ESDL4151MX4T5G be used for both USB 2.0 and USB 3.0 applications?
Yes, the ESDL4151MX4T5G is qualified for both USB 2.0 and USB 3.0 applications due to its 0.8 pF capacitance and validated insertion loss performance up to 5 GHz. Its low dynamic resistance and fast response time ensure effective clamping without degrading high-speed eye diagrams or introducing jitter in either protocol's physical layer.
What is the lead-free status and RoHS compliance level of the ESDL4151MX4T5G?
The ESDL4151MX4T5G is Pb-free, halogen-free/BFR-free, and fully RoHS compliant per EU Directive 2011/65/EU. The "G" suffix in the part number explicitly denotes RoHS-compliant packaging, and the X3DFN2 package meets JEDEC J-STD-020 moisture sensitivity level 1 (MSL1) requirements for standard reflow processes.
How does the ESDL4151MX4T5G perform under IEC61000−4−5 (lightning surge) conditions?
The ESDL4151MX4T5G withstands 53 V input per IEC61000−4−5 (8/20 µs waveform), delivering 11 A peak pulse current with clamping voltage bounded between 23 V and 26 V. This performance provides robust secondary-level surge protection for externally exposed ports, complementing primary protection stages in full-system EMC designs.
ESDL4151MX4T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 0402 (1006 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 15V (Max)
- Voltage - Breakdown (Min):
- 15.5V
- Voltage - Clamping (Max) @ Ipp:
- 26V
- Current - Peak Pulse (10/1000µs):
- 47.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- USB 2.0, USB 3.0
- Capacitance @ Frequency:
- 0.8pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X3DFN (1x0.6)
ESDL4151MX4T5G FAQ
1.How can I place an order for ESDL4151MX4T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDL4151MX4T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDL4151MX4T5G reliable?
The price and inventory of ESDL4151MX4T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDL4151MX4T5G is usually 5 days.
3.What payment methods are accepted for ESDL4151MX4T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDL4151MX4T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDL4151MX4T5G?
ESDL4151MX4T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDL4151MX4T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDL4151MX4T5G?
For technical support, including ESDL4151MX4T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDL4151MX4T5G requirements.
6.How does Aetrix verify that ESDL4151MX4T5G is sourced from the original manufacturer or authorized distributors?
All ESDL4151MX4T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDL4151MX4T5G meets industry standards.
7.What is the process for return or replacement of ESDL4151MX4T5G?
All ESDL4151MX4T5G units undergo pre-shipment inspection (PSI). If there is an issue with ESDL4151MX4T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDL4151MX4T5G part is unused and in its original packaging.
Return procedure for ESDL4151MX4T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDL4151MX4T5G Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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