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onsemi ESDM2032MX4T5G
- Part No.:
- ESDM2032MX4T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDM2032MX4T5G.pdf
- Description:
- TVS DIODE 3.3VWM 5.2VC 2DFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,046
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Product details
Overview
ESDM2032MX4T5G from onsemi is a bidirectional ESD protection diode in a 0.60 mm × 0.30 mm X4DFN-2 package, rated for 3.3 V working voltage, 5.2 V clamping at 16 A (IEC 61000−4−2 Level 4), and 23 pF capacitance at 0 V bias - designed to safeguard SD card interfaces, audio lines, and GPIO pins in space-constrained portable electronics.
For engineers reviewing the ESDM2032MX4T5G datasheet, pinout, applications, or equivalent options, key selection criteria include IEC 61000−4−2 Level 4 compliance, sub-25 pF junction capacitance, bidirectional clamping behavior, low 500 nA leakage at 3.3 V, and 0.20 mm profile for ultra-thin PCB designs.
Technical Context
The ESDM2032MX4T5G implements a symmetric, bidirectional TVS structure optimized for low-capacitance signal line protection. Its clamping response is characterized under both TLP (100 ns pulse) and IEC 61000−4−2 waveforms, with verified 4.8 V clamping at 8 A and 5.2 V at 16 A - matching Level 4 contact discharge requirements.
It operates across −55 °C to +150 °C, features 0.05 Ω dynamic resistance under transient stress, and maintains ≤23 pF capacitance up to 100 MHz - enabling use on high-speed digital and analog I/O without signal integrity degradation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Voltage | 3.3 V - maximum continuous reverse voltage before leakage exceeds 500 nA; sets upper limit for protected I/O rail |
| Clamping Voltage | 5.2 V @ 16 A - peak voltage seen by downstream IC during IEC Level 4 ESD event; ensures safe margin below typical 5.5 V IO tolerance |
| Junction Capacitance | 23 pF @ 0 V, 1 MHz - preserves signal integrity on audio and SD card data lines without excessive attenuation or timing skew |
| ESD Rating | ±30 kV air/±30 kV contact per IEC 61000−4−2 - exceeds Level 4 requirement (±15 kV/±8 kV), providing design margin for field reliability |
| Package Size | 0.60 mm × 0.30 mm × 0.20 mm - fits 0201 footprint; enables placement directly at connector or IC pad for shortest possible protection path |
| Leakage Current | 500 nA @ 3.3 V - negligible power loss in battery-powered systems; avoids DC offset in precision analog paths |
| Breakdown Voltage | 3.7–6.7 V @ 1 mA - ensures reliable turn-on before protected circuit reaches damage threshold |
Pinout & Package
ESDM2032MX4T5G uses the X4DFN-2 (Case 152AX) surface-mount package: 2-terminal, bidirectional, no polarity marking. Body dimensions are 0.60 mm × 0.30 mm × 0.20 mm with 0.36 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Shared terminal for symmetrical clamping; connects to protected I/O line |
| Pin 2 | Anode/Cathode (bidirectional) | Shared terminal for symmetrical clamping; connects to GND reference plane |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional Clamping | Enables single-device protection of AC-coupled or floating I/O lines without polarity concerns |
| 0.20 mm Height | Supports ultra-low-profile assemblies in smartphones, wearables, and thin tablets |
| 18–23 pF Capacitance | Minimizes insertion loss on 10–100 MHz signals (e.g., SD clock, stereo audio) while retaining robust ESD immunity |
| 0.05 Ω Dynamic Resistance | Reduces voltage overshoot during fast transients, improving clamping consistency across pulse amplitudes |
| Pb-Free / RoHS Compliant | Meets global environmental compliance mandates without derating or process change |
Applications
| SD Card Interface Protection | Mobile Audio Line Protection |
|---|---|
Use Scenario: Protecting SDIO command, clock, and data lines in handheld devices exposed to user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between SD card connector and host controller. Use Value: 23 pF capacitance avoids SD clock jitter; 5.2 V clamping prevents latch-up in 3.3 V SD host controllers. | Use Scenario: Shielding headphone jack left/right channels and mic input from ESD during plug insertion/removal. IC Role / Device Role / Timing Role: Low-capacitance shunt clamp on analog audio paths between codec and jack. Use Value: Sub-25 pF loading preserves frequency response up to 20 kHz; 500 nA leakage avoids DC bias shift in amplifier inputs. |
| GPIO Protection in Wearables | USB OTG ID Pin Protection |
Use Scenario: Safeguarding exposed microcontroller GPIOs used for button sensing or sensor interrupts in compact wearables. IC Role / Device Role / Timing Role: Point-of-entry ESD clamp on each GPIO trace before routing to MCU. Use Value: 0.60 mm × 0.30 mm footprint allows placement within 2 mm of connector; ±30 kV rating covers worst-case handling events. | Use Scenario: Protecting USB OTG ID pin (used to detect accessory mode) from ESD during cable mating/unmating. IC Role / Device Role / Timing Role: Low-leakage bidirectional clamp referenced to system ground. Use Value: 500 nA leakage prevents false ID detection; 3.3 V VRWM matches USB 2.0 logic thresholds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | Single-channel, 1.5 pF typ capacitance, 3.6 V VRWM, SOT-5X3 package (1.0 mm × 0.6 mm) | Lower capacitance suits >100 MHz interfaces (e.g., USB 2.0 D+/D−); larger footprint limits ultra-dense layouts | Select when <2 pF loading is critical and board area permits larger package |
| SP1001-01UTG | Unidirectional, 5.5 V VRWM, 0.65 mm × 0.35 mm UDFN package, 12 pF capacitance | Requires correct polarity orientation; better suited for DC-biased rails like VBUS; lower capacitance than ESDM2032MX4T5G | Choose for unidirectional, higher-voltage rails where polarity is fixed and layout allows orientation control |
Compared with TPD2E001DRYR and SP1001-01UTG, the ESDM2032MX4T5G offers the smallest footprint (0.60 × 0.30 mm) and true bidirectionality without polarity constraints - making it optimal for space-limited, AC-coupled, or floating I/O protection where layout flexibility and minimal board area are primary drivers.
Availability
ESDM2032MX4T5G is available at Aetrix Electronics and suitable for SD card interfaces, mobile audio subsystems, wearable GPIO protection, and USB OTG ID line applications requiring stable component supply and long-term production continuity.
Supply support for ESDM2032MX4T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESDM2032MX4T5G belongs to onsemi's Micro-Packaged ESD Protection Diode family - engineered specifically for ultra-compact, high-reliability transient suppression on high-speed, low-voltage signal lines in portable and wearable electronics.
FAQ
What is the maximum operating temperature range for the ESDM2032MX4T5G?
The ESDM2032MX4T5G supports a junction and storage temperature range of −55 °C to +150 °C. This wide thermal envelope allows deployment in harsh environments such as automotive infotainment modules or industrial handhelds. The device maintains specified clamping performance and leakage current across this full range, and its 0.20 mm height aids thermal dissipation in thermally constrained PCB stacks. ESDM2032MX4T5G is qualified per industry-standard reliability tests including MSL1 moisture sensitivity.
Does the ESDM2032MX4T5G require orientation during PCB placement?
No - the ESDM2032MX4T5G is a symmetric, bidirectional device with identical electrical behavior between Pin 1 and Pin 2. It has no anode/cathode distinction and can be placed in either orientation on the PCB without affecting ESD performance or clamping voltage. This simplifies assembly and eliminates orientation-related rework. ESDM2032MX4T5G's marking diagram shows no polarity indicator, confirming its bidirectional design.
What is the IEC 61000−4−2 test configuration used to validate the ±30 kV rating of the ESDM2032MX4T5G?
The ±30 kV rating for ESDM2032MX4T5G is validated per IEC 61000−4−2 using both contact and air discharge methods on standard FR-5 test boards. The device withstands 30 kV contact discharge (direct probe-to-pin) and 30 kV air discharge (spark gap to pin) without parametric shift or functional failure. This exceeds Level 4 (±8 kV contact / ±15 kV air) and reflects onsemi's internal stress testing protocol, documented in Application Note AND8308/D.
How does the 23 pF junction capacitance of the ESDM2032MX4T5G impact high-speed SD card signaling?
The ESDM2032MX4T5G's 23 pF capacitance at 0 V bias introduces minimal loading on SD card data and clock lines operating up to 50 MHz (SDR104 mode). Measured insertion loss remains below −1 dB up to 100 MHz, preserving signal rise/fall times and eye opening. For UHS-II or eMMC 5.1 interfaces (>100 MHz), lower-capacitance alternatives may be preferred - but ESDM2032MX4T5G remains optimal for legacy SDIO and microSD implementations where board space is critical.
Is the ESDM2032MX4T5G compatible with lead-free reflow soldering processes?
Yes - the ESDM2032MX4T5G is Pb-free, halogen-free/BFR-free, and RoHS compliant. Its maximum lead solder temperature rating is 260 °C for 10 seconds, fully compatible with standard IPC/JEDEC J-STD-020D reflow profiles. The X4DFN-2 package exhibits no warpage or delamination under peak temperatures up to 260 °C, and the device passes post-reflow electrical verification per datasheet limits. ESDM2032MX4T5G is shipped in tape-and-reel format (10,000 units/reel) optimized for automated SMT placement.
ESDM2032MX4T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 3.7V
- Voltage - Clamping (Max) @ Ipp:
- 5.2V
- Current - Peak Pulse (10/1000µs):
- 16A
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 18pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-DFN (0.6x0.3)
ESDM2032MX4T5G FAQ
1.How can I place an order for ESDM2032MX4T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDM2032MX4T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDM2032MX4T5G reliable?
The price and inventory of ESDM2032MX4T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDM2032MX4T5G is usually 5 days.
3.What payment methods are accepted for ESDM2032MX4T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDM2032MX4T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDM2032MX4T5G?
ESDM2032MX4T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDM2032MX4T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDM2032MX4T5G?
For technical support, including ESDM2032MX4T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDM2032MX4T5G requirements.
6.How does Aetrix verify that ESDM2032MX4T5G is sourced from the original manufacturer or authorized distributors?
All ESDM2032MX4T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDM2032MX4T5G meets industry standards.
7.What is the process for return or replacement of ESDM2032MX4T5G?
All ESDM2032MX4T5G units undergo pre-shipment inspection (PSI). If there is an issue with ESDM2032MX4T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDM2032MX4T5G part is unused and in its original packaging.
Return procedure for ESDM2032MX4T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDM2032MX4T5G Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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