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onsemi ESDM2033MX4T5G
- Part No.:
- ESDM2033MX4T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDM2033MX4T5G.pdf
- Description:
- DIODE BIDIR ESD X4DFN2
- Quantity:
- Payment:
- Shipping:
Inventory:39,715
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Product details
Overview
ESDM2033MX4T5G from onsemi is a bidirectional ESD protection diode designed for I/O line protection in space-constrained portable electronics. It delivers 3.3 V reverse working voltage, ≤5.5 pF junction capacitance at 0 V, ±15 kV IEC 61000−4−2 contact/air ESD immunity, 5.5 V clamping voltage at 8 A TLP, and operates from −55 °C to +125 °C junction temperature - enabling robust signal integrity in high-speed USB, HDMI, and touch interface paths.
For engineers reviewing the ESDM2033MX4T5G datasheet, pinout, applications, or equivalent options, key selection criteria include low-capacitance transient suppression (≤5.5 pF), sub-0.6 mm × 0.3 mm DFN2 package compatibility with fine-pitch layouts, IEC Level 4 compliance, and verified clamping performance under 8 A/16 A TLP stress.
Technical Context
The ESDM2033MX4T5G integrates a single bidirectional TVS structure optimized for ultra-low capacitance and fast response (<1 ns) to electrostatic discharge events. Its silicon design targets sub-6 V clamping at 8 A TLP current while maintaining <0.1 µA reverse leakage at 3.3 V VRWM - critical for preserving signal fidelity in 1.8 V/3.3 V I/O rails.
It is rated per IEC 61000−4−2 Level 4 (±15 kV contact/air), validated using Transmission Line Pulse testing per ANSI/ESD STM5.5.1, and specified for operation across −55 °C to +125 °C junction temperature - supporting reliability in consumer wearables and industrial handhelds where thermal cycling and board-level ESD exposure coexist.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Working Voltage | 3.3 V - defines maximum continuous DC bias before leakage rises significantly; matches standard 3.3 V I/O supply rails. |
| Clamping Voltage (VC) | 5.5 V at 8 A TLP - ensures protected IC I/O pins stay below absolute maximum ratings during ESD transients. |
| Junction Capacitance | 5.5 pF max at 0 V, 1 MHz - enables use on >100 Mbps interfaces (e.g., USB 2.0, I²C) without signal distortion. |
| ESD Withstand | ±15 kV per IEC 61000−4−2 contact & air - exceeds Level 4 requirement for end-user accessible ports. |
| Operating Temperature | −55 °C to +125 °C TJ - supports deployment in automotive infotainment displays and outdoor IoT sensors. |
| Package Size | 0.6 mm × 0.3 mm footprint - fits within 0201 land patterns, minimizing PCB real estate in compact wearable PCBs. |
Pinout & Package
ESDM2033MX4T5G uses the X4DFN2 (Case 152AX) 2-terminal micro-DNF package: 0.60 mm × 0.30 mm body, 0.36 mm pitch, 0.20 mm nominal height. Pin 1 and Pin 2 are symmetrical anode/cathode terminals for bidirectional protection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Connects to protected I/O line; no polarity assignment required due to symmetric internal structure. |
| Pin 2 | Anode/Cathode (bidirectional) | Connects to system ground; forms low-inductance path for ESD current diversion during both positive/negative transients. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 5.5 pF max enables integration on high-speed data lines (e.g., USB 2.0, MIPI D-PHY) without degrading eye diagram margin. |
| Bidirectional ESD clamping | Single-device protection against ±15 kV contact/air discharges eliminates need for dual-diode arrays or external polarity management. |
| Sub-0201 footprint | 0.6 mm × 0.3 mm outline allows placement adjacent to connector pins or ASIC BGA pads in ultra-thin smartphone bezels. |
| Pb-free, RoHS-compliant | Meets global environmental regulations and reflow soldering profiles up to 260 °C peak temperature for lead-free assembly. |
Applications
| Smartphone Front-Panel Touch Interface | USB-C Port ESD Protection |
|---|---|
Use Scenario: Protecting capacitive touch sensor I/O traces routed along narrow front-glass bezel edges exposed to finger-contact ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at touch controller input pins. Use Value: 5.5 pF capacitance prevents touch response latency or false reporting; ±15 kV rating ensures pass/fail compliance in IEC 61000−4−2 pre-scan testing. | Use Scenario: Safeguarding USB-C CC, SBU, and sideband-use pins against user-handling ESD during cable insertion/removal. IC Role / Device Role / Timing Role: Low-capacitance clamp on auxiliary signal lines operating at <10 Mbps, not high-speed SuperSpeed lanes. Use Value: Sub-0.6 mm × 0.3 mm size permits placement within 2 mm of USB-C receptacle; 5.5 V clamping prevents damage to USB PD controller GPIOs. |
| Wearable Fitness Tracker Display Flex | Industrial Handheld Barcode Scanner I/O |
Use Scenario: Shielding OLED display flex-cable connections from ESD generated by wristband friction or direct fingertip contact. IC Role / Device Role / Timing Role: ESD shunt on display data/control lines (e.g., SPI, I²C) between main PCB and flex assembly. Use Value: −55 °C to +125 °C operating range accommodates skin-contact thermal cycling; 0.1 µA leakage preserves battery life over multi-year device lifespan. | Use Scenario: Hardening RS-232/RS-485 serial communication lines and button matrix inputs against ESD in warehouse environments. IC Role / Device Role / Timing Role: Point-of-entry protection on all user-accessible I/O connectors and membrane switch traces. Use Value: Verified 8 A/16 A TLP clamping ensures survivability under repeated 15 kV discharges; RoHS compliance supports global industrial certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E05U06DPYR | 6.0 pF typical capacitance; 5.5 V clamping at 8 A; same 0201 DFN package. | Slightly higher capacitance may impact margin on >200 Mbps interfaces; identical IEC 61000−4−2 Level 4 rating. | Valid alternative when layout allows minor capacitance increase; identical mounting and reflow profile. |
| ESD9X3.3SCT5G | 3.3 V VRWM; 5.0 V clamping at 8 A; 0.6 mm × 0.3 mm DFN but 0.4 mm pitch. | Lower clamping voltage improves margin for 3.3 V logic, but tighter pitch requires updated stencil aperture design. | Preferred where lower clamping is prioritized over legacy footprint reuse; verify solder paste volume for 0.4 mm pitch. |
Compared with ESDM2033MX4T5G, TPD1E05U06DPYR offers nearly identical electrical specs and mechanical fit, while ESD9X3.3SCT5G trades slightly reduced package pitch for lower clamping - requiring layout revision but delivering enhanced protection headroom on 3.3 V rails.
Availability
ESDM2033MX4T5G is available at Aetrix Electronics and suitable for smartphone front-panel interfaces, USB-C accessory ports, and wearable display flex connections requiring stable component supply and guaranteed long-term manufacturability.
Supply support for ESDM2033MX4T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient innovation, serving automotive, industrial, cloud, medical, and consumer markets with discrete, analog, and power management solutions.
The ESDM2033MX4T5G belongs to onsemi's Micro-Packaged ESD Protection Diodes product line, engineered specifically for ultra-compact, high-fidelity signal line protection in next-generation portable and wearable electronics.
FAQ
What is the maximum clamping voltage of the ESDM2033MX4T5G under IEC 61000−4−2 stress?
The ESDM2033MX4T5G does not specify clamping voltage under direct IEC 61000−4−2 waveform testing; instead, its clamping performance is characterized via Transmission Line Pulse (TLP) testing. At 8 A TLP (equivalent to IEC Level 2), the clamping voltage is 5.5 V; at 16 A TLP (equivalent to IEC Level 4), it is 6.5 V. These values are measured per ANSI/ESD STM5.5.1 and correlate to real-world ESD event suppression capability for the ESDM2033MX4T5G.
Can the ESDM2033MX4T5G be used on 1.8 V I/O lines?
Yes, the ESDM2033MX4T5G is compatible with 1.8 V I/O lines. Its 3.3 V reverse working voltage (VRWM) provides sufficient margin above 1.8 V rail voltage, and its low leakage (<0.1 µA at 3.3 V) ensures negligible static power draw. The 5.5 pF capacitance also avoids signal integrity issues on low-voltage, moderate-speed interfaces like I²C or UART - making the ESDM2033MX4T5G suitable for mixed-voltage SoC designs.
Does the ESDM2033MX4T5G require orientation during PCB placement?
No, the ESDM2033MX4T5G does not require specific orientation during PCB placement. It is a bidirectional ESD protection diode with symmetrical anode–cathode terminals, meaning either pin can connect to the protected I/O line and the other to ground. This simplifies automated pick-and-place programming and eliminates risk of reverse-mounting errors - a key advantage of the ESDM2033MX4T5G in high-volume manufacturing.
What is the thermal resistance (θJA) of the ESDM2033MX4T5G package?
The ESDM2033MX4T5G datasheet does not publish junction-to-ambient thermal resistance (θJA) because, as a passive ESD protection device, it is not operated continuously under power dissipation. Its thermal performance is validated through IEC 61000−4−2 and TLP testing across −55 °C to +125 °C ambient conditions. No derating or heatsinking is required for the ESDM2033MX4T5G under normal ESD transient duty cycles.
Is the ESDM2033MX4T5G compliant with AEC-Q200 for automotive applications?
No, the ESDM2033MX4T5G is not qualified to AEC-Q200. It is specified for commercial and industrial temperature ranges (−55 °C to +125 °C) and meets IEC 61000−4−2 Level 4, but lacks the extended reliability testing (e.g., temperature cycling, humidity bias, vibration) required for automotive qualification. For AEC-Q200-compliant alternatives, consult onsemi's Automotive ESD portfolio - the ESDM2033MX4T5G is intended for consumer, wearable, and industrial portable equipment.
ESDM2033MX4T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 3.68V
- Voltage - Clamping (Max) @ Ipp:
- 6.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 16A
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 5.5pF @ 1MHz (Max)
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-DFN (0.6x0.3)
ESDM2033MX4T5G FAQ
1.How can I place an order for ESDM2033MX4T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDM2033MX4T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDM2033MX4T5G reliable?
The price and inventory of ESDM2033MX4T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDM2033MX4T5G is usually 5 days.
3.What payment methods are accepted for ESDM2033MX4T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDM2033MX4T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDM2033MX4T5G?
ESDM2033MX4T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDM2033MX4T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDM2033MX4T5G?
For technical support, including ESDM2033MX4T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDM2033MX4T5G requirements.
6.How does Aetrix verify that ESDM2033MX4T5G is sourced from the original manufacturer or authorized distributors?
All ESDM2033MX4T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDM2033MX4T5G meets industry standards.
7.What is the process for return or replacement of ESDM2033MX4T5G?
All ESDM2033MX4T5G units undergo pre-shipment inspection (PSI). If there is an issue with ESDM2033MX4T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDM2033MX4T5G part is unused and in its original packaging.
Return procedure for ESDM2033MX4T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDM2033MX4T5G Tags
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