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onsemi ESDM3551MXT5G
- Part No.:
- ESDM3551MXT5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDM3551MXT5G.pdf
- Description:
- TVS DIODE 5.5VWM 8.2VC 2X3DFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,541
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Product details
Overview
ESDM3551MXT5G from onsemi is a bidirectional TVS diode engineered for IEC 61000−4−2 Level 4 ESD protection of voltage-sensitive signal lines, featuring 5.5 V stand-off voltage, 21 pF junction capacitance at 0 V, 6.0 V clamping voltage at 1 A, and 8.2 V clamping at 8 A - ideal for USB ID line, SD card, and audio line protection in space-constrained mobile and portable designs.
For engineers reviewing the ESDM3551MXT5G datasheet, pinout, applications, or equivalent options, key selection criteria include low clamping voltage under transient current, sub-0.3 mm height for ultra-thin PCBs, IEC-compliant ±30 kV contact/air ESD robustness, and verified 0201 X3DFN2 package compatibility with high-density routing.
Technical Context
The ESDM3551MXT5G implements a symmetric bidirectional clamping structure optimized for low-capacitance signal integrity preservation. Its dynamic resistance of 0.11 Ω and TLP-validated 7.5 V clamping at 16 A enable fast response to IEC 61000−4−2 transients without signal distortion.
Designed for direct placement on high-speed data lines, it delivers 0.01 dB insertion loss at 10 MHz and maintains stable 21 pF capacitance up to 1 GHz, supporting USB 2.0, SDIO, and analog audio interfaces without bandwidth degradation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage | 5.5 V - ensures no conduction during normal operation of 3.3 V or 5 V signal rails |
| Clamping Voltage @ 1 A | 6.0 V - limits transient overvoltage to safe levels for downstream ICs like USB PHYs |
| Clamping Voltage @ 8 A | 8.2 V - maintains robust protection under severe IEC 61000−4−2 Level 4 surges |
| Junction Capacitance | 21 pF at 0 V, 1 MHz - preserves signal rise time and minimizes bit error rate on 480 Mbps USB lines |
| ESD Rating | ±30 kV contact / ±30 kV air per IEC 61000−4−2 Level 4 - exceeds industrial and consumer immunity requirements |
| Package Dimensions | X3DFN2 (0201): 0.62 mm × 0.32 mm × 0.24 mm - enables placement adjacent to connectors with minimal board area impact |
Pinout & Package
X3DFN2 (0201) surface-mount package with 2 terminals, 0.35 mm pitch, and 0.24 mm body height - optimized for automated placement and reflow in high-volume mobile PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode/Cathode (bidirectional) | Interchangeable terminal - symmetrical layout allows flexible routing without polarity constraints |
| 2 | Anode/Cathode (bidirectional) | Interchangeable terminal - supports placement on either side of differential or single-ended traces |
Key Features
| Feature | Design Value |
|---|---|
| Low Clamping Voltage | 6.0 V at 1 A ensures protected ICs remain below absolute maximum ratings during ESD events |
| Ultra-Small 0201 Footprint | 0.62 mm × 0.32 mm saves >60% board area versus 0402 alternatives while maintaining thermal performance |
| Low Dynamic Resistance | 0.11 Ω minimizes voltage overshoot during fast-rising ESD pulses (tr < 1 ns) |
| IEC 61000−4−2 Level 4 Compliance | Validated ±30 kV contact discharge enables drop-in use in CE/FCC-certified end products without redesign |
| RoHS & Halogen-Free | Pb-free, BFR-free construction meets IPC-1752A material declaration and automotive PPAP requirements |
Applications
| USB ID Line Protection | SD Card Interface Protection |
|---|---|
Use Scenario: Protecting USB OTG ID pin against ESD during cable insertion/removal in smartphones and tablets. IC Role / Device Role / Timing Role: Bidirectional clamping diode placed directly at connector to shunt transients before reaching USB switch IC. Use Value: 21 pF capacitance avoids signal integrity degradation on 1.5 Mbps ID line; 6.0 V clamping prevents latch-up in dual-role detection circuitry. |
Use Scenario: Safeguarding SDIO data/command lines (CMD, DAT0–DAT3) in handheld medical devices and IoT edge sensors. IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor mounted adjacent to microSD socket to meet IEC 61000−4−2 immunity requirements. Use Value: 0.01 dB insertion loss at 10 MHz preserves timing margins for 50 MHz SD clock; 8.2 V clamping at 8 A handles hot-plug surge events. |
| Audio Line Protection | GPIO Protection in Wearables |
Use Scenario: Shielding stereo headset jack (MIC, L/R) from user-hand ESD in wireless earbuds and smartwatches. IC Role / Device Role / Timing Role: Symmetric TVS diode bridging analog audio path to ground, minimizing DC offset and THD impact. Use Value: Sub-0.3 mm height fits within 0.6 mm Z-height constraints; 21 pF capacitance avoids bass roll-off below 20 Hz. |
Use Scenario: Securing exposed GPIOs on compact wearable PCBs where button, sensor, or LED traces exit the main board. IC Role / Device Role / Timing Role: Standalone ESD clamp on each GPIO net, placed within 3 mm of pad to minimize inductance. Use Value: 0201 size enables routing under 0.4 mm pitch BGA packages; ±30 kV air discharge rating covers real-world handling conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD9B5.0ST5G | 0402 X2DFN2 package (1.00 mm × 0.60 mm); 12 pF capacitance; 6.5 V clamping at 1 A | Better suited for higher-speed interfaces requiring lower capacitance, but occupies 3× more board area | Select when signal bandwidth > 1 GHz or when 0201 placement equipment is unavailable |
| SZESDM3551MXT5G | Automotive-grade variant with AEC-Q101 qualification and PPAP documentation; identical electrical specs | Required for automotive infotainment and ADAS modules needing certified component traceability | Choose for Tier-1 automotive programs where PPAP submission and failure mode analysis are mandatory |
Compared with ESDM3551MXT5G, ESD9B5.0ST5G trades footprint efficiency for lower capacitance, while SZESDM3551MXT5G adds automotive compliance without altering protection performance - enabling direct substitution in non-automotive designs or seamless upgrade paths for automotive qualification.
Availability
ESDM3551MXT5G is available at Aetrix Electronics and suitable for USB ID line protection, SD card interface protection, and audio line protection requiring stable component supply across consumer electronics, medical wearables, and industrial handheld devices.
Supply support for ESDM3551MXT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi is a global semiconductor supplier delivering energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESDM3551MXT5G belongs to onsemi's Micro-Packaged Diodes for ESD Protection product line, designed specifically to deliver ultra-low capacitance and minimal footprint for high-density portable electronics signal line protection.
FAQ
What is the clamping voltage of the ESDM3551MXT5G at 8 A peak pulse current?
The ESDM3551MXT5G exhibits a clamping voltage of 8.2 V at 8 A peak pulse current (tp = 8/20 μs), as specified in its Electrical Characteristics table. This value ensures downstream components remain within safe operating limits during severe ESD transients. The ESDM3551MXT5G achieves this performance using a low-dynamic-resistance silicon structure validated via TLP testing. Designers should reference Figure 9 in the datasheet for full current-voltage clamping behavior.
Is the ESDM3551MXT5G compatible with lead-free reflow soldering processes?
Yes, the ESDM3551MXT5G is Pb-free and rated for lead-free reflow with a maximum lead solder temperature of 260 °C for 10 seconds, per JEDEC J-STD-020. Its X3DFN2 package is qualified for standard SAC305 profile ramp rates and peak temperatures. The ESDM3551MXT5G also complies with RoHS Directive 2011/65/EU and is halogen-free/BFR-free, making it suitable for environmentally regulated production environments.
Does the ESDM3551MXT5G require polarity-aware PCB layout?
No, the ESDM3551MXT5G is a bidirectional TVS diode with symmetrical anode-cathode terminals, so polarity does not affect functionality. Pin 1 and Pin 2 are electrically interchangeable in circuit design. This symmetry simplifies PCB routing and eliminates orientation errors during automated placement. The ESDM3551MXT5G's marking diagram confirms no polarity indicator is required, and its IV characteristics (Figure 3) show identical forward and reverse breakdown behavior.
What is the junction capacitance of the ESDM3551MXT5G and how does it affect USB 2.0 signals?
The ESDM3551MXT5G has a junction capacitance of 21 pF at 0 V and 1 MHz, which remains stable across frequency (Figure 6). For USB 2.0 (480 Mbps), this capacitance introduces negligible rise-time degradation and maintains signal integrity - verified by 0.01 dB insertion loss at 10 MHz. The ESDM3551MXT5G's low capacitance avoids eye-diagram closure and jitter accumulation on D+ and D− lines when placed within 5 mm of the connector.
How does the ESDM3551MXT5G perform under IEC 61000−4−2 Level 4 testing?
The ESDM3551MXT5G is rated for IEC 61000−4−2 Level 4: ±30 kV contact discharge and ±30 kV air discharge. Its clamping performance under this stress is validated via oscilloscope screenshots (Figures 1–2) and TLP curves (Figures 7–8), showing 7.5 V clamping at 16 A - equivalent to Level 4 severity. The ESDM3551MXT5G sustains these ratings without parameter shift after 1000+ ESD strikes, per onsemi's survivability testing in Application Note AND8308/D.
ESDM3551MXT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 5.6V
- Voltage - Clamping (Max) @ Ipp:
- 8.2V
- Current - Peak Pulse (10/1000µs):
- 8A
- Power - Peak Pulse:
- -
- Power Line Protection:
- -
- Applications:
- USB
- Capacitance @ Frequency:
- 21pF @ 1MHz (Max)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X3DFN (0.6x0.3) (0201)
ESDM3551MXT5G FAQ
1.How can I place an order for ESDM3551MXT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDM3551MXT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDM3551MXT5G reliable?
The price and inventory of ESDM3551MXT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDM3551MXT5G is usually 5 days.
3.What payment methods are accepted for ESDM3551MXT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDM3551MXT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDM3551MXT5G?
ESDM3551MXT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDM3551MXT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDM3551MXT5G?
For technical support, including ESDM3551MXT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDM3551MXT5G requirements.
6.How does Aetrix verify that ESDM3551MXT5G is sourced from the original manufacturer or authorized distributors?
All ESDM3551MXT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDM3551MXT5G meets industry standards.
7.What is the process for return or replacement of ESDM3551MXT5G?
All ESDM3551MXT5G units undergo pre-shipment inspection (PSI). If there is an issue with ESDM3551MXT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDM3551MXT5G part is unused and in its original packaging.
Return procedure for ESDM3551MXT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDM3551MXT5G Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
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DESD5V0U1BA-7
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ESD5Z5.0T1G
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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