onsemi ESDM3551N2T5G
- Part No.:
- ESDM3551N2T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XDFN
- Datasheet:
-
ESDM3551N2T5G.pdf
- Description:
- TVS DIODE 5.5VWM 8.2VC 2X2DFN
- Quantity:
- Payment:

- Shipping:

Inventory:12,676
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Product details
Overview
ESDM3551N2T5G from onsemi is a bidirectional TVS diode designed for IEC 61000−4−2 Level 4 ESD protection of voltage-sensitive interfaces, featuring 5.5 V stand-off voltage, 21 pF junction capacitance at 0 V, 6.0 V clamping voltage at 1 A, ±30 kV contact/air ESD rating, and X2DFN2 (0402) package. It protects USB ID lines, SD card interfaces, audio paths, and GPIO in space-constrained portable electronics.
For engineers reviewing the ESDM3551N2T5G datasheet, pinout, applications, or equivalent options, key selection criteria include clamping voltage under 8.2 V at 8 A, leakage current ≤0.1 µA at 5.5 V, low 21 pF capacitance for high-speed signal integrity, and AEC−Q101 qualification for automotive-grade reliability.
Technical Context
The ESDM3551N2T5G implements a symmetric bidirectional TVS structure with silicon avalanche clamping, enabling equal protection for positive and negative transients. Its low dynamic resistance (0.11 Ω) and fast TLP response ensure sub-100 ns clamping during IEC 61000−4−2 events.
Designed for placement directly at I/O pads, it operates with no bias required and supports transient suppression across 0–5.5 V DC working range. The device meets ISO 10605 (150 pF/2 kΩ, 330 pF/2 kΩ, 330 pF/330 Ω) and delivers 7.5 V clamping at 16 A TLP, correlating to IEC Level 4 (±8 kV contact).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage | 5.5 V - Maximum continuous reverse voltage before leakage exceeds 0.1 µA; sets upper limit for protected line DC bias. |
| Clamping Voltage @ 1 A | 6.0 V - Peak voltage seen by downstream IC during 1 A 8/20 µs surge; ensures safe margin below typical 6.5 V IC absolute max ratings. |
| Clamping Voltage @ 8 A | 8.2 V - Sustained clamping level under severe 8 A transient; critical for protecting 3.3 V/5 V logic against latch-up. |
| Junction Capacitance | 21 pF @ 0 V, 1 MHz - Low enough to avoid signal degradation on USB 2.0 or SD card clock/data lines. |
| ESD Rating | ±30 kV contact & air per IEC 61000−4−2 Level 4 - Exceeds industrial and automotive immunity requirements without external circuitry. |
| Peak Pulse Current | 9.9 A @ 8/20 µs - Confirmed survivability under worst-case system-level ESD stress waveforms. |
| Leakage Current | ≤0.1 µA @ 5.5 V - Negligible loading on high-impedance analog or battery-backed GPIO lines. |
Pinout & Package
X2DFN2 (0402) surface-mount package: 1.00 mm × 0.60 mm × 0.37 mm body, 0.65 mm pitch, Pb-free, halogen-free, RoHS compliant. Two-terminal monolithic structure with no internal bias or control pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Shared terminal for symmetrical clamping; connects to protected signal line (e.g., USB ID, SD DAT0). |
| Pin 2 | Anode/Cathode (bidirectional) | Shared terminal tied to GND or common reference plane; completes low-inductance ESD current path. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or dual-polarity signals (e.g., USB ID, audio differential pairs) without polarity concerns. |
| 0402 footprint (X2DFN2) | Minimizes PCB area (0.6 mm²) and parasitic inductance-critical for >100 MHz signal paths and ultra-thin mobile designs. |
| AEC−Q101 qualified | Validated for automotive infotainment and body electronics where temperature cycling (−55 °C to +150 °C) and humidity resistance are mandatory. |
| 21 pF capacitance | Preserves signal rise/fall times on 48 MHz SD card clocks and 480 Mbps USB 2.0 data lines without added jitter or attenuation. |
| 7.5 V TLP clamping @ 16 A | Correlates to IEC ±8 kV contact discharge performance-provides design margin for field-reliability validation beyond spec minimums. |
Applications
| USB ID Line Protection | SD Card Protection |
|---|---|
Use Scenario: Protecting USB On-The-Go (OTG) ID pin from ESD during cable insertion/removal in smartphones and tablets. IC Role / Device Role / Timing Role: Bidirectional TVS clamp placed between ID pin and system ground to shunt transients before reaching USB PHY. Use Value: Prevents false OTG role detection and PHY damage using 21 pF capacitance that avoids disrupting 1.5 Mbps ID signal timing. |
Use Scenario: Safeguarding SD card interface lines (CLK, CMD, DAT0–DAT3) against user-handling ESD in digital cameras and IoT edge devices. IC Role / Device Role / Timing Role: Per-line ESD suppressor mounted adjacent to SD card connector to minimize trace inductance and maintain signal integrity. Use Value: Enables full 48 MHz SDHC clock operation with <0.01 dB insertion loss and clamping below 8.2 V at 8 A peak pulse current. |
| Audio Line Protection | GPIO Protection |
Use Scenario: Shielding stereo headphone output (L/R) and microphone input lines in wearables from electrostatic discharge during user interaction. IC Role / Device Role / Timing Role: Low-capacitance TVS on analog audio paths to prevent pop-noise, amplifier latch-up, or ADC saturation. Use Value: 21 pF capacitance avoids high-frequency roll-off in 20 kHz audio band; 6.0 V clamping prevents clipping distortion during ±8 kV ESD events. |
Use Scenario: Hardening general-purpose I/O pins (e.g., reset, interrupt, status flags) on microcontrollers used in industrial HMI panels and medical sensors. IC Role / Device Role / Timing Role: Standalone ESD guard for unbuffered MCU pins exposed to operator touch or cable coupling. Use Value: 0.1 µA leakage ensures no impact on battery life in always-on sensor nodes; −55 °C to +150 °C operating range supports extended thermal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD9B5.0ST5G | Lower capacitance (12 pF), same 5.5 V VRWM, but lower 6.5 A IPP and non-AEC−Q101 rated. | Suitable for consumer USB 3.0/PCIe where ultra-low capacitance is prioritized over automotive qualification. | Select when signal bandwidth >5 GHz is required and AEC−Q101 is not mandated. |
| SZESDM3551N2T5G | Identical electrical specs and package; differs only in SZ prefix denoting automotive-specific PPAP documentation and site control. | Required for Tier 1 automotive programs needing full PPAP submission and change notification tracking. | Choose for production automotive ECUs where traceability and process control exceed standard industrial requirements. |
Compared with ESDM3551N2T5G, ESD9B5.0ST5G trades AEC−Q101 compliance and higher surge robustness for lower capacitance, while SZESDM3551N2T5G provides identical protection with enhanced automotive supply-chain governance-no layout or schematic changes needed between the three.
Availability
ESDM3551N2T5G is available at Aetrix Electronics and suitable for USB ID line protection, SD card interface hardening, and audio path safeguarding requiring stable component supply across high-volume consumer, industrial, and automotive programs.
Supply support for ESDM3551N2T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESDM3551 series belongs to onsemi's Micro-Packaged ESD Protection Diodes product line, engineered specifically for board-level I/O protection in miniaturized, high-speed electronic systems where space, capacitance, and reliability are critical constraints.
FAQ
What is the maximum working voltage supported by the ESDM3551N2T5G?
The ESDM3551N2T5G has a working peak reverse voltage (VRWM) of 5.5 V, meaning it can continuously block up to 5.5 V DC or peak AC voltage without significant leakage. This makes it suitable for protecting 3.3 V and 5 V logic interfaces, including USB, SD card, and GPIO lines, while maintaining <0.1 µA leakage current at rated voltage. Exceeding 5.5 V risks premature conduction and compromised protection margin.
Does the ESDM3551N2T5G require any external bias or control circuitry?
No, the ESDM3551N2T5G is a passive, bidirectional TVS diode requiring no external bias, power, or control signals. It operates solely based on its intrinsic avalanche breakdown characteristics, clamping transients automatically when voltage exceeds ~5.6 V (VBR min). This simplifies layout, reduces BOM count, and eliminates startup or configuration dependencies in the ESDM3551N2T5G implementation.
Is the ESDM3551N2T5G qualified for automotive applications?
The standard ESDM3551N2T5G is not AEC−Q101 qualified; however, its automotive-grade variant SZESDM3551N2T5G carries full AEC−Q101 certification and PPAP capability. Both share identical electrical parameters and X2DFN2 packaging, but only the SZ-prefixed version meets automotive quality system requirements for temperature cycling, humidity resistance, and process traceability in ESDM3551N2T5G-based vehicle designs.
What is the junction capacitance of the ESDM3551N2T5G and why does it matter?
The ESDM3551N2T5G exhibits 21 pF junction capacitance at 0 V and 1 MHz, measured directly across its terminals. This low value minimizes signal distortion on high-speed lines-such as 48 MHz SD card clocks or 480 Mbps USB 2.0 data-by avoiding excessive RC time constants or insertion loss (>0.01 dB at 10 MHz). Maintaining this capacitance ensures timing margins remain intact in ESDM3551N2T5G-protected interfaces.
How does the ESDM3551N2T5G perform under IEC 61000−4−2 Level 4 ESD testing?
The ESDM3551N2T5G is rated for IEC 61000−4−2 Level 4: ±30 kV contact and ±30 kV air discharge. Its 7.5 V clamping voltage at 16 A TLP current directly correlates to ±8 kV contact performance, ensuring downstream ICs see less than 8.2 V during worst-case 8 A surges. This validated clamping behavior enables pass/fail compliance without additional protection stages in ESDM3551N2T5G-deployed systems.
ESDM3551N2T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 5.6V
- Voltage - Clamping (Max) @ Ipp:
- 8.2V
- Current - Peak Pulse (10/1000µs):
- 8A
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- USB
- Capacitance @ Frequency:
- 21pF @ 1MHz (Max)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X2DFN (1x0.6)
ESDM3551N2T5G FAQ
1.How can I place an order for ESDM3551N2T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDM3551N2T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDM3551N2T5G reliable?
The price and inventory of ESDM3551N2T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDM3551N2T5G is usually 5 days.
3.What payment methods are accepted for ESDM3551N2T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDM3551N2T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDM3551N2T5G?
ESDM3551N2T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDM3551N2T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDM3551N2T5G?
For technical support, including ESDM3551N2T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDM3551N2T5G requirements.
6.How does Aetrix verify that ESDM3551N2T5G is sourced from the original manufacturer or authorized distributors?
All ESDM3551N2T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDM3551N2T5G meets industry standards.
7.What is the process for return or replacement of ESDM3551N2T5G?
All ESDM3551N2T5G units undergo pre-shipment inspection (PSI). If there is an issue with ESDM3551N2T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDM3551N2T5G part is unused and in its original packaging.
Return procedure for ESDM3551N2T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDM3551N2T5G Tags

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ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

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ESD5Z3.3T1G
onsemi

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D5V0H1B2LP-7B
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D5V0P1B2LP-7B
Diodes Incorporated

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DESD5V0U1BA-7
Diodes Incorporated

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ESD5Z5.0T1G
onsemi

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DESD5V0U1BB-7
Diodes Incorporated

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D12V0L1B2LP-7B
Diodes Incorporated

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PESD2V0Y1BSFYL
Nexperia USA Inc.

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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

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D5V0L1B2WS-7
Diodes Incorporated
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