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Texas Instruments ESDS302DBVR
- Part No.:
- ESDS302DBVR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- SC-74A, SOT-753
- Datasheet:
-
ESDS302DBVR.pdf
- Description:
- TVS DIODE 3.6VWM 3VC SOT23-5
- Quantity:
- Payment:
- Shipping:
Inventory:3,864
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Product details
Overview
ESDS302DBVR from Texas Instruments is a 2-channel unidirectional TVS diode array for high-speed data line ESD and surge protection, featuring ±30kV IEC 61000-4-2 contact/air discharge, 12A IEC 61000-4-5 surge clamping at 6V, 2.3pF typical IO-to-GND capacitance, and DC breakdown voltage ≥4.5V - deployed in Ethernet 1000BASE-T, USB 2.0, and GPIO interfaces.
For engineers reviewing the ESDS302DBVR datasheet, ESDS302DBVR pinout, ESDS302DBVR application, or ESDS302DBVR equivalent, this page delivers verified electrical parameters, SOT-23 (DBV) package layout guidance, industrial temperature support (–40°C to +125°C), ultra-low leakage (3nA typ), and real-world interface compatibility up to 1 Gbps.
Technical Context
The ESDS302DBVR operates as a passive snapback-triggered TVS device with bidirectional conduction capability per channel: forward conduction begins at ~0.8V (1mA), reverse breakdown initiates at ≥4.5V, and dynamic clamping engages within nanoseconds during transients. Its low RDYN ensures minimal voltage overshoot under 12A (8/20μs) surge events.
Designed specifically for signal integrity preservation on high-speed lines, it maintains ≤2.8pF max IO-to-GND capacitance and <1.5pF line-to-line capacitance, enabling <0.5dB differential insertion loss at 1 GHz - critical for maintaining eye diagram integrity in 125MHz Ethernet PHY interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection | ±30kV contact & air discharge (IEC 61000-4-2 Level 4) - withstands direct human-body ESD events without latch-up or degradation |
| Surge Clamping Voltage | 6V at 12A (8/20μs) - limits transient overvoltage to safe levels for 3.3V/3.6V PHY ICs |
| IO-to-GND Capacitance | 2.3pF typical - preserves signal rise/fall times and minimizes jitter on 1Gbps links |
| DC Breakdown Voltage | ≥4.5V - ensures reliable operation above 3.6V nominal interface voltage with margin |
| Leakage Current | 3nA typical at 3.6V - avoids loading of high-impedance receiver inputs |
| Operating Temperature | –40°C to +125°C - supports industrial-grade deployment in gateways, NVRs, and outdoor access points |
| EFT Protection | 80A (5/50ns, IEC 61000-4-4) - suppresses repetitive burst noise from switching power supplies or motor drives |
Pinout & Package
ESDS302DBVR is housed in a 5-pin SOT-23 (DBV) package with 2.9mm × 1.6mm footprint and 1.45mm max height. Pin 1 is marked via index area; pins 1 and 3 are NC (not connected), used optionally for straight-through PCB routing. The device uses standard JEDEC MO-178 compliant land pattern with exposed metal solder mask defined.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | NC | Not connected; may be left floating or grounded - enables flow-through trace routing without vias |
| Pin 2 | GND | Low-inductance ground return path for transient current dissipation; must connect directly to solid ground plane |
| Pin 3 | NC | Not connected; identical function to Pin 1 - supports symmetrical board layout |
| Pin 4 | I/O1 | Protected signal line 1 - connects to first high-speed data line (e.g., ETH_MDIO or USB_DP) |
| Pin 5 | I/O2 | Protected signal line 2 - connects to second high-speed data line (e.g., ETH_MDC or USB_DM) |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 2.3pF typical IO-to-GND - enables clean 1Gbps signal transmission without measurable eye closure |
| Low clamping voltage | 6V at 12A surge - protects 3.3V/3.6V Ethernet PHYs and USB transceivers from destructive overvoltage |
| High ESD robustness | ±30kV IEC 61000-4-2 - exceeds Level 4 requirements and supports long-term reliability in field-deployed equipment |
| Industrial temperature range | –40°C to +125°C - validated for use in uncontrolled environments including outdoor gateways and industrial NVR enclosures |
| Flow-through routing | Pins 1 & 3 NC - allows linear PCB trace layout between connector and PHY, minimizing stub length and impedance discontinuity |
Applications
| Ethernet 1000BASE-T Interface | USB 2.0 Data Lines |
|---|---|
Use Scenario: Protecting differential pairs of Gigabit Ethernet PHYs (e.g., DP83867IR) against lightning-induced surges and connector ESD in enterprise switches and PoE-powered access points. IC Role / Device Role / Timing Role: Unidirectional TVS clamp placed between RJ45 magnetics and PHY IC - absorbs transients before they reach sensitive analog front-end circuitry. Use Value: Maintains <0.5dB insertion loss at 125MHz while clamping 12A surges to ≤6V, preserving link training success rate and reducing PHY reset events. |
Use Scenario: Safeguarding USB 2.0 DP/DM lines on host controllers in printers and embedded gateways exposed to frequent cable hot-plug events. IC Role / Device Role / Timing Role: Signal-line ESD suppressor mounted adjacent to USB Type-A receptacle - shunts ±30kV discharges directly to chassis ground. Use Value: 2.3pF capacitance prevents signal edge degradation, ensuring full-speed (480 Mbps) enumeration and sustained data throughput without packet retries. |
| Industrial GPIO Protection | Network Video Recorder (NVR) Front Panel |
Use Scenario: Shielding isolated digital I/O pins (e.g., opto-isolated control signals) in programmable logic controllers subjected to EFT bursts from nearby VFDs. IC Role / Device Role / Timing Role: Standalone transient suppressor on each GPIO line - triggered only during >4.5V overvoltage events, otherwise transparent. Use Value: 3nA leakage avoids false triggering of high-impedance input buffers; –40°C to +125°C rating ensures operation inside sealed control cabinets. |
Use Scenario: Hardening HDMI/USB front-panel connectors on NVR chassis against user-hand ESD and electrostatic buildup in dry warehouse environments. IC Role / Device Role / Timing Role: Dual-channel ESD guard for bidirectional data lanes - placed immediately after connector to minimize inductance in discharge path. Use Value: Flow-through pinout (Pins 1 & 3 NC) permits direct trace routing from connector to SoC, eliminating stubs that degrade ESD immunity test margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar TVS diode array applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMA6J33A-Q | Single-channel, 33V standoff, 600W peak power - higher clamping (~65V at 10A), no sub-pF capacitance | Designed for power rail protection, not high-speed data lines - unsuitable for USB/Ethernet due to excessive capacitance and slow response | Select only for DC power line hardening where speed and capacitance are irrelevant |
| TPD2E001DRSR | 2-channel, 5.5V standoff, 1.5pF typ capacitance, ±15kV ESD - lower ESD rating and no IEC 61000-4-5 surge rating | Targeted at portable electronics; lacks 12A surge rating and industrial temp validation - limited to consumer-grade USB ports | Choose when cost sensitivity outweighs surge robustness and extended temperature needs |
Compared with SMA6J33A-Q and TPD2E001DRSR, ESDS302DBVR uniquely balances ±30kV ESD immunity, 12A surge capability, 2.3pF capacitance, and –40°C to +125°C operation - making it the only option qualified for industrial Ethernet and ruggedized USB 2.0 interfaces requiring both speed and survivability.
Availability
ESDS302DBVR is available at Aetrix Electronics and suitable for Ethernet switches, network video recorders, and industrial gateways requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for ESDS302DBVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, precision, and industrial-grade qualification.
The ESDS30x family was engineered specifically for high-speed interface protection - targeting Ethernet, USB, and GPIO applications where low capacitance, fast transient response, and system-level IEC compliance are mandatory design requirements.
FAQ
What is the maximum surge current rating for ESDS302DBVR?
The ESDS302DBVR is rated for 12A peak pulse current under IEC 61000-4-5 (8/20μs waveform), with a clamping voltage of 6V at that level. This rating is validated across the full operating temperature range (–40°C to +125°C) and applies to each I/O pin referenced to GND. It is not a repetitive rating - the device is intended for infrequent transient suppression.
Does ESDS302DBVR support bidirectional signal lines like USB D+ and D–?
Yes, ESDS302DBVR supports bidirectional high-speed data lines including USB 2.0 D+ and D–. Its unidirectional architecture protects each line against positive transients relative to GND, while the low forward voltage (~0.8V) ensures minimal impact on signal swing during normal operation. For true bidirectional protection, two devices may be used back-to-back - though ESDS302DBVR alone suffices for most USB 2.0 implementations per TI's reference designs.
Can ESDS302DBVR be used on 2.5G or 5G Ethernet interfaces?
No - ESDS302DBVR is characterized and validated for up to 1 Gbps (125MHz) interfaces such as 1000BASE-T. Its 2.3pF capacitance and insertion loss profile are optimized for that bandwidth. For 2.5G/5G Ethernet, TI recommends ESDS304DBVR (4-channel variant) or newer devices like ESDS312, which offer lower capacitance and extended frequency response per official application notes and S-parameter data.
What is the meaning of "NC" pins 1 and 3 on ESDS302DBVR?
Pins 1 and 3 of ESDS302DBVR are Not Connected (NC) terminals. They serve no internal electrical function but enable flow-through PCB routing: traces can pass directly beneath the package without vias or bends, reducing parasitic inductance and simplifying layout near high-speed connectors. These pins may be left floating or tied to GND - neither affects device performance.
Is ESDS302DBVR RoHS compliant and lead-free?
Yes, ESDS302DBVR is RoHS compliant and features 100% matte tin (Sn) lead finish. Per TI's packaging documentation, it carries MSL Level-1 rating (unlimited floor life at ≤30°C/60% RH) and is qualified for peak reflow temperatures up to 260°C. The part marking "1R5B" and tape-and-reel packaging (3000 units per reel) confirm full production status and environmental compliance.
ESDS302DBVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- SC-74A, SOT-753
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 3.6V (Max)
- Voltage - Breakdown (Min):
- 4.5V
- Voltage - Clamping (Max) @ Ipp:
- 3V (Typ)
- Current - Peak Pulse (10/1000µs):
- 12A (8/20µs)
- Power - Peak Pulse:
- 85W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 2.3pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-5
ESDS302DBVR FAQ
1.How can I place an order for ESDS302DBVR through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDS302DBVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDS302DBVR reliable?
The price and inventory of ESDS302DBVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDS302DBVR is usually 5 days.
3.What payment methods are accepted for ESDS302DBVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDS302DBVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDS302DBVR?
ESDS302DBVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDS302DBVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDS302DBVR?
For technical support, including ESDS302DBVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDS302DBVR requirements.
6.How does Aetrix verify that ESDS302DBVR is sourced from the original manufacturer or authorized distributors?
All ESDS302DBVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDS302DBVR meets industry standards.
7.What is the process for return or replacement of ESDS302DBVR?
All ESDS302DBVR units undergo pre-shipment inspection (PSI). If there is an issue with ESDS302DBVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDS302DBVR part is unused and in its original packaging.
Return procedure for ESDS302DBVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDS302DBVR Tags
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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