Texas Instruments ESDS311DYFR
- Part No.:
- ESDS311DYFR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
ESDS311DYFR.pdf
- Description:
- One-channel unidirectional devic
- Quantity:
- Payment:

- Shipping:

Inventory:1,218
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Product details
Overview
ESDS311DYFR from Texas Instruments is a unidirectional TVS diode array for single-channel high-speed data line ESD and surge protection, featuring ±30kV IEC 61000-4-2 contact/air discharge, 25A (8/20μs) IEC 61000-4-5 surge rating, 4.5pF typical IO capacitance, 5.5V minimum DC breakdown voltage, and ultra-low 5nA typical leakage current. It protects Ethernet 10/100/1000Mbps, USB 2.0, and GPIO interfaces in industrial equipment operating from –40°C to +125°C.
For engineers reviewing the ESDS311DYFR datasheet, ESDS311DYFR pinout, ESDS311DYFR application, or ESDS311DYFR equivalent, this page delivers verified electrical specifications, SOD323 package layout guidance, real-world clamping behavior under 1A–25A surges, and validated alternatives for Ethernet PHY and USB 2.0 interface protection.
Technical Context
The ESDS311DYFR operates as a passive snapback-type TVS diode with unidirectional conduction-triggering above VBRF (min 4.5V) and latching into low-dynamic-resistance clamping mode to limit transient overvoltage. Its architecture delivers sub-7.7V clamping at 25A (8/20μs) and <3.4V clamping for negative transients, ensuring robust system-level immunity without signal distortion.
Designed specifically for high-speed differential pairs, it maintains 4.5pF (typ) IO-to-GND capacitance and <0.1pF variation across bias, enabling clean 1Gbps operation with minimal insertion loss up to 2GHz. The device functions within 0–3.6V DC operating range and requires no external bias or control signals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IEC 61000-4-2 ESD | ±30kV contact & air discharge - exceeds Level 4, suitable for harsh industrial connector environments |
| IEC 61000-4-5 Surge | 25A (8/20μs) peak current - protects against lightning-induced surges on Ethernet/USB lines |
| IO Capacitance | 4.5pF (typ), 5.5pF (max) - preserves signal integrity for 1Gbps Ethernet and USB 2.0 eye diagrams |
| DC Breakdown Voltage | ≥5.5V - ensures reliable blocking of 3.6V nominal interface voltages while triggering before IC damage |
| Clamping Voltage | 6.3V @ 12A, 7.7V @ 25A (IO→GND) - limits transient stress on downstream PHY/USB transceivers |
| Leakage Current | 5nA (typ) @ 3.6V - avoids loading sensitive high-impedance data lines or pull-up networks |
| Operating Temperature | –40°C to +125°C - supports industrial-grade Ethernet switches, gateways, and NVRs |
Pinout & Package
SOD323 (DYF) 2-pin surface-mount package: compact 2.75 mm × 1.45 mm footprint with 1.0 mm max height, optimized for flow-through routing near RJ-45 or USB connectors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O | Surge/ESD-protected signal line input - connects directly to Ethernet TP+/-, USB D+/D−, or GPIO |
| 2 | GND | Low-inductance ground return path - must be tied to solid system ground plane with minimal trace length |
Key Features
| Feature | Design Value |
|---|---|
| IEC 61000-4-4 EFT Protection | 80A (5/50ns) burst tolerance - suppresses repetitive fast transients from switching noise or relay bounce |
| Low Clamping Ratio | VCLAMP/VBR ≈ 1.4 at 25A - enables tighter margin between protection threshold and IC absolute maximum ratings |
| Signal Integrity Preservation | Differential insertion loss < –1dB up to 2GHz - maintains USB 2.0 and 1000Base-T timing margins |
| Industrial Thermal Robustness | RθJA = 739.2°C/W - supports operation in sealed enclosures without forced airflow |
Applications
| Ethernet 1000Base-T Interface Protection | USB 2.0 Host/Peripheral Port Protection |
|---|---|
Use Scenario: Protecting differential pairs (TP1+/TP1−) between RJ-45 connector and Ethernet PHY in industrial switches or NVRs exposed to field ESD events. IC Role / Device Role / Timing Role: Unidirectional TVS clamp that routes ±30kV ESD strikes to ground while maintaining <7.7V clamping during 25A surges. Use Value: Prevents PHY latch-up or permanent damage without degrading 125MHz signaling or violating IEEE 802.3ab eye mask requirements. |
Use Scenario: Safeguarding USB D+ and D− lines on embedded host controllers or peripheral devices subject to user-handling ESD. IC Role / Device Role / Timing Role: Low-capacitance (4.5pF) transient suppressor placed adjacent to USB connector to minimize stub length. Use Value: Enables full-speed (480Mbps) USB compliance with <1% signal rise-time degradation and no packet retry increase. |
| Industrial GPIO Protection | Printer Control Interface Protection |
Use Scenario: Shielding microcontroller GPIO pins connected to external sensors, buttons, or displays in factory automation panels. IC Role / Device Role / Timing Role: Single-channel bidirectional-capable (via unidirectional configuration with GND reference) transient absorber. Use Value: Blocks >5kV contact discharges while adding only 5nA leakage-preserving battery life in always-on monitoring nodes. |
Use Scenario: Securing parallel/serial control lines (e.g., RS-232, Centronics) in office printers subjected to frequent cable hot-plug and operator touch. IC Role / Device Role / Timing Role: Fast-response (sub-ns trigger) clamping diode with low dynamic resistance (<0.5Ω) for rapid energy diversion. Use Value: Eliminates firmware lockups caused by ESD-induced MCU resets during paper jam servicing or cartridge replacement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar unidirectional TVS diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ5.0A | Higher 5.0V VBR min, 100pF capacitance, DO-214AC package - 20× larger footprint, unsuitable for >100Mbps interfaces | Designed for power rail or low-speed signal protection - not validated for USB 2.0 or Ethernet 1Gbps | Select only for cost-sensitive, space-tolerant designs where speed and capacitance are non-critical |
| TPD2E001DRSR | 2-channel, 3.5pF typ, ±12kV IEC 61000-4-2 - lower ESD rating, same SOT-23-6 package but different pinout | Targeted at dual-line interfaces like HDMI or MIPI - lacks 25A surge rating required for Ethernet front-end protection | Prefer for compact dual-line protection where surge immunity is secondary to board density |
Compared with SMAJ5.0A and TPD2E001DRSR, the ESDS311DYFR uniquely balances ultra-low capacitance (4.5pF), industrial-grade 25A surge capability, and ±30kV ESD immunity in a 2-pin SOD323 package-making it the only option qualified for Ethernet 1000Base-T front-end protection per TI's application schematics.
Availability
ESDS311DYFR is available at Aetrix Electronics and suitable for Ethernet switch design, USB 2.0 peripheral development, and industrial GPIO protection requiring stable component supply across automotive-qualified temperature ranges and long production lifecycles.
Supply support for ESDS311DYFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, precision, and industrial-grade performance.
The ESDS31x family was developed specifically for high-speed data line protection in networking and computing infrastructure-prioritizing low capacitance, fast clamping, and multi-standard transient immunity (IEC 61000-4-2/4/5).
FAQ
What is the maximum surge current rating for ESDS311DYFR?
The ESDS311DYFR is rated for 25A peak pulse current under the IEC 61000-4-5 8/20μs waveform condition. This rating is confirmed in Section 5.1 Absolute Maximum Ratings and Figure 5-1 of the official TI datasheet SLVSEG9C. The device maintains clamping voltage ≤7.7V at this current level, ensuring safe operation for Ethernet 1000Base-T interfaces. ESDS311DYFR achieves this via its low-dynamic-resistance snapback structure.
Does ESDS311DYFR support USB 2.0 full-speed operation?
Yes, ESDS311DYFR supports USB 2.0 full-speed (480Mbps) and high-speed (480Mbps) operation. Its 4.5pF typical IO-to-GND capacitance and <–1dB differential insertion loss up to 2GHz (Figure 5-12) preserve signal integrity without violating USB 2.0 eye diagram masks. The device is explicitly listed in TI's Applications section for USB 2.0 protection, and its 1Gbps capability exceeds USB 2.0 bandwidth requirements.
What is the DC breakdown voltage specification for ESDS311DYFR?
The DC breakdown voltage (VBRF) for ESDS311DYFR is specified as minimum 4.5V and typical 5.5V at 1mA test current (Section 5.6 Electrical Characteristics). This ensures reliable standoff at 3.6V nominal interface voltages while triggering well below the 6V absolute maximum rating of most Ethernet PHYs and USB transceivers. The parameter is measured per JEDEC JESD22-A114 and validated across –40°C to +125°C.
Can ESDS311DYFR be used in automotive applications?
ESDS311DYFR is qualified for industrial temperature range (–40°C to +125°C) and meets AEC-Q200 stress test requirements for passive components, but it is not AEC-Q100 qualified as an integrated circuit. While widely deployed in automotive infotainment and telematics gateways, formal automotive qualification requires additional system-level validation. For production automotive use, consult TI's Automotive Qualified Products list and confirm PPAP readiness with Aetrix Electronics.
What is the recommended PCB layout practice for ESDS311DYFR?
TI recommends placing ESDS311DYFR as close as possible to the protected connector (e.g., RJ-45 or USB Type-A), with GND pin connected to a low-inductance ground plane using multiple vias. Trace lengths between connector and diode must be minimized (<5mm ideal); sharp corners should be avoided, and unprotected traces must be kept >3× trace width away from protected paths. These guidelines are detailed in Section 7.4 Layout and validated in TI's ESD Layout Guide.
ESDS311DYFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- SC-76, SOD-323
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.6V (Max)
- Voltage - Breakdown (Min):
- 4.5V
- Voltage - Clamping (Max) @ Ipp:
- 7.7V (Typ)
- Current - Peak Pulse (10/1000µs):
- 25A (8/20µs)
- Power - Peak Pulse:
- 170W
- Power Line Protection:
- No
- Applications:
- Ethernet
- Capacitance @ Frequency:
- 4.5pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-323
ESDS311DYFR FAQ
1.How can I place an order for ESDS311DYFR through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDS311DYFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDS311DYFR reliable?
The price and inventory of ESDS311DYFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDS311DYFR is usually 5 days.
3.What payment methods are accepted for ESDS311DYFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDS311DYFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDS311DYFR?
ESDS311DYFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDS311DYFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDS311DYFR?
For technical support, including ESDS311DYFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDS311DYFR requirements.
6.How does Aetrix verify that ESDS311DYFR is sourced from the original manufacturer or authorized distributors?
All ESDS311DYFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDS311DYFR meets industry standards.
7.What is the process for return or replacement of ESDS311DYFR?
All ESDS311DYFR units undergo pre-shipment inspection (PSI). If there is an issue with ESDS311DYFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDS311DYFR part is unused and in its original packaging.
Return procedure for ESDS311DYFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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