Texas Instruments ESDS312DBVR
- Part No.:
- ESDS312DBVR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- SC-74A, SOT-753
- Datasheet:
-
ESDS312DBVR.pdf
- Description:
- TVS DIODE 3.6VWM 6.5VC SOT23-5
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ESDS312DBVR from Texas Instruments is a 2-channel unidirectional TVS diode array for high-speed data line ESD and surge protection, featuring ±30kV IEC 61000-4-2 contact/air discharge, 25A (8/20μs) IEC 61000-4-5 surge rating, 4.5pF typical IO-to-GND capacitance, 5.5V minimum DC breakdown voltage, and ultra-low 5nA typical leakage current. It protects Ethernet 10/100/1000Mbps, USB 2.0, and GPIO interfaces in industrial networking equipment.
For engineers reviewing the ESDS312DBVR datasheet, ESDS312DBVR pinout, ESDS312DBVR application, or ESDS312DBVR equivalent, this page delivers verified electrical parameters, SOT-23 (DBV) package layout guidance, channel-specific clamping behavior, and real-world implementation constraints for high-speed signal integrity preservation.
Technical Context
The ESDS312DBVR integrates two independent unidirectional TVS diodes in a single SOT-23-5 package, each with snapback-triggered clamping action that activates above ~4.5V (VBRF) and holds at ≤5V (VHOLD) during transient events. Its low dynamic resistance ensures minimal voltage overshoot under 25A surge conditions.
Designed for placement between connectors and PHY ICs, it operates within 0–3.6V DC signal range and –40°C to +125°C ambient, supporting up to 5Gbps data rates via sub-5pF line capacitance and <0.1pF cross-capacitance-critical for maintaining Ethernet 1000Base-T differential insertion loss below –1dB at 125MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IEC 61000-4-2 ESD Rating | ±30kV contact & air discharge - exceeds Level 4, enabling robust handling of human-body ESD in field-deployed Ethernet ports. |
| Surge Current (IEC 61000-4-5) | 25A (8/20μs) per channel - sustains lightning-induced surges on RJ-45 lines without degradation. |
| IO-to-GND Capacitance | 4.5pF typical - preserves signal integrity on 1Gbps Ethernet differential pairs with <–1dB insertion loss at 125MHz. |
| DC Breakdown Voltage | 5.5V minimum - ensures reliable clamping above 3.6V PHY supply while avoiding false triggering during normal operation. |
| Leakage Current | 5nA typical at 3.6V - prevents measurable loading on low-power GPIO or USB D+/D– lines. |
| Operating Temperature | –40°C to +125°C - supports deployment in industrial gateways and outdoor access points without derating. |
| Clamping Voltage (IPP = 25A) | 6.5V (IO→GND), 3.6V (GND→IO) - limits stress on downstream PHY transceivers during worst-case surge events. |
Pinout & Package
SOT-23 (DBV) 5-pin package: 1.45mm max height, 2.9mm × 1.6mm body, gull-wing leads, RoHS-compliant matte tin lead finish, MSL Level-1 (unlimited reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | NC | Not connected; enables straight-through PCB routing - may be left floating or grounded without affecting protection function. |
| 2 | GND | Common ground reference for both protection channels; must connect to low-impedance system ground plane near connector. |
| 3 | NC | Not connected; symmetric counterpart to Pin 1 for mechanical balance and routing flexibility. |
| 4 | I/O1 | First protected signal line (e.g., TP1+ or USB D+); clamps transients to GND when voltage exceeds 4.5V. |
| 5 | I/O2 | Second protected signal line (e.g., TP1– or USB D–); operates independently with identical clamping characteristics as I/O1. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through routing support | Two NC pins (1 & 3) allow linear trace layout from connector to PHY, minimizing stub length and impedance discontinuity. |
| Low clamping asymmetry | 3.6V reverse clamping (GND→I/O) vs. 6.5V forward clamping (I/O→GND) enables bidirectional surge suppression without polarity constraints. |
| Sub-5pF channel capacitance | 4.5pF typical, ±0.5pF max - maintains >90% signal amplitude at 125MHz, meeting IEEE 802.3ab return loss requirements. |
| Industrial thermal resilience | RθJB = 76.9°C/W - sustains full 25A surge rating at +125°C ambient due to efficient board-level heat dissipation. |
| ESD immunity beyond standard | ±30kV IEC 61000-4-2 - exceeds automotive and industrial immunity mandates, reducing need for secondary protection stages. |
Applications
| Ethernet 1000Base-T Port Protection | USB 2.0 Host Interface Protection |
|---|---|
Use Scenario: Protecting differential pairs (TP1+/TP1– through TP4+/TP4–) on an RJ-45 connector in a managed Ethernet switch operating at 1Gbps. IC Role / Device Role / Timing Role: Unidirectional TVS clamp placed immediately after the magnetics, shunting ESD and surge energy to chassis ground before reaching the PHY IC. Use Value: Maintains <–1dB differential insertion loss at 125MHz while clamping 25A surges to ≤6.5V, preventing PHY latch-up or damage during lightning-induced coupling. |
Use Scenario: Safeguarding D+ and D– lines of a USB 2.0 host controller in an industrial printer with exposed front-panel USB port. IC Role / Device Role / Timing Role: Bidirectional transient suppressor positioned between USB connector and upstream transceiver, leveraging asymmetric clamping for fast rise-time ESD capture. Use Value: 4.5pF capacitance avoids USB 2.0 eye diagram distortion; ±30kV ESD rating eliminates need for external spark gaps in CE/FCC-certified designs. |
| Industrial Gateway GPIO Protection | Video Surveillance NVR Data Line Protection |
Use Scenario: Shielding configurable GPIO pins (e.g., RS-485 enable, reset, or status indicators) on a ruggedized edge gateway deployed in factory automation. IC Role / Device Role / Timing Role: Low-leakage (5nA) unidirectional clamp isolating sensitive MCU I/O from cable-borne transients in noisy 24VDC environments. Use Value: 5.5V minimum breakdown prevents false triggers during 3.3V logic transitions; –40°C to +125°C rating ensures reliability in uncontrolled enclosures. |
Use Scenario: Securing HDMI or MIPI CSI-2 data lanes connecting camera modules to an NVR's video processor in outdoor security systems. IC Role / Device Role / Timing Role: High-speed ESD array placed at board edge to intercept connector-coupled discharges before signal integrity degrades. Use Value: 2.25pF typical line-to-line capacitance minimizes crosstalk between adjacent high-speed lanes; 5Gbps support future-proofs for 4K streaming upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar unidirectional TVS diode array applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD321DPYR | Single-channel, SOD-323 (2-pin), 3.6V standoff, 5.5V clamping @ 1A - lacks dual-channel integration and flow-through routing. | Requires two devices for same 2-line protection; higher board area and routing complexity than ESDS312DBVR. | Select when space permits discrete placement or when only one line requires protection per footprint. |
| TPD2E001DRSR | 2-channel, SOT-23-6, 5.5V standoff, 12V clamping @ 1A - higher clamping voltage, 8pF capacitance, no IEC 61000-4-5 surge rating. | Not suitable for 1Gbps Ethernet or 25A surge environments; limited to low-speed GPIO or audio lines. | Choose only for cost-sensitive, non-surge applications where 12V clamping and 8pF capacitance are acceptable. |
Compared with ESD321DPYR and TPD2E001DRSR, the ESDS312DBVR uniquely combines dual-channel integration, 25A surge capability, 4.5pF capacitance, and flow-through routing in a single SOT-23-5 package-making it the only option qualified for industrial 1Gbps Ethernet port hardening.
Availability
ESDS312DBVR is available at Aetrix Electronics and suitable for Ethernet switches, industrial gateways, and USB 2.0 host interfaces requiring stable component supply across extended temperature ranges and high-reliability surge environments.
Supply support for ESDS312DBVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision analog, power management, and signal chain solutions.
The ESDS31x family is designed specifically for high-speed data line protection in industrial and networking applications, balancing ultra-low capacitance, high surge tolerance, and compact packaging for seamless integration into space-constrained PCB layouts.
FAQ
What is the maximum surge current rating for ESDS312DBVR per channel?
The ESDS312DBVR is rated for 25A peak pulse current (8/20μs waveform) per I/O channel under IEC 61000-4-5 compliance testing. This rating applies individually to I/O1 and I/O2 when referenced to the common GND pin (Pin 2), and is validated across the full –40°C to +125°C operating temperature range with appropriate PCB thermal relief.
Does ESDS312DBVR support bidirectional signal lines like USB D+ and D–?
Yes, ESDS312DBVR supports bidirectional high-speed data lines such as USB 2.0 D+ and D–. Its unidirectional architecture clamps positive transients from I/O to GND (6.5V @ 25A) and negative transients from GND to I/O (3.6V @ 25A), providing effective protection for both signal polarities without requiring external biasing or polarity selection.
Can ESDS312DBVR be used for 1000Base-T Ethernet differential pair protection?
Yes, ESDS312DBVR is explicitly validated for 1000Base-T Ethernet protection. With 4.5pF typical IO-to-GND capacitance and 2.25pF typical line-to-line capacitance, it maintains differential insertion loss below –1dB at 125MHz - meeting IEEE 802.3ab signal integrity requirements while clamping 25A surges to ≤6.5V on each line.
What is the significance of the NC pins (1 and 3) on ESDS312DBVR?
Pins 1 and 3 on ESDS312DBVR are not connected internally and serve solely to enable flow-through PCB routing. They allow traces to pass straight from the RJ-45 connector to the PHY IC without vias or bends, minimizing stub length and impedance mismatch - a critical layout advantage for maintaining signal integrity on 1Gbps differential pairs.
How does ESDS312DBVR's leakage current impact low-power GPIO applications?
ESDS312DBVR exhibits 5nA typical leakage current at 3.6V, which introduces negligible loading on low-power GPIO circuits. At 3.3V operation, leakage remains below 10nA across –40°C to +125°C, ensuring no measurable effect on sleep-mode current budgets or weak pull-up/pull-down networks in battery-powered or energy-harvesting edge devices.
ESDS312DBVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- SC-74A, SOT-753
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.6V (Max)
- Voltage - Breakdown (Min):
- 4.5V
- Voltage - Clamping (Max) @ Ipp:
- 6.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 25A (8/20µs)
- Power - Peak Pulse:
- 170W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 4.5pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-5
ESDS312DBVR FAQ
1.How can I place an order for ESDS312DBVR through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDS312DBVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDS312DBVR reliable?
The price and inventory of ESDS312DBVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDS312DBVR is usually 5 days.
3.What payment methods are accepted for ESDS312DBVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDS312DBVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDS312DBVR?
ESDS312DBVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDS312DBVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDS312DBVR?
For technical support, including ESDS312DBVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDS312DBVR requirements.
6.How does Aetrix verify that ESDS312DBVR is sourced from the original manufacturer or authorized distributors?
All ESDS312DBVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDS312DBVR meets industry standards.
7.What is the process for return or replacement of ESDS312DBVR?
All ESDS312DBVR units undergo pre-shipment inspection (PSI). If there is an issue with ESDS312DBVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDS312DBVR part is unused and in its original packaging.
Return procedure for ESDS312DBVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDS312DBVR Tags

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