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Texas Instruments ESDS314DBVR
- Part No.:
- ESDS314DBVR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- SC-74A, SOT-753
- Datasheet:
-
ESDS314DBVR.pdf
- Description:
- TVS DIODE 3.6VWM 6.5VC SOT23-5
- Quantity:
- Payment:
- Shipping:
Inventory:2,532
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Product details
Overview
ESDS314DBVR from Texas Instruments is a 4-channel unidirectional TVS diode array for high-speed data line ESD and surge protection, featuring ±30kV IEC 61000-4-2 contact/air discharge, 25A (8/20μs) IEC 61000-4-5 surge rating, 4.5pF typical IO-to-GND capacitance, 5.5V minimum DC breakdown voltage, and industrial –40°C to +125°C operation - deployed in Ethernet 1000BASE-T PHY interfaces.
For engineers reviewing the ESDS314DBVR datasheet, ESDS314DBVR pinout, ESDS314DBVR application, or ESDS314DBVR equivalent, this page delivers verified electrical specs, SOT-23 (DBV) package layout guidance, real-world clamping behavior at 1A–25A surge currents, and validated alternatives for Ethernet/USB 2.0/GPIO protection designs requiring sub-5pF loading and robust ±30kV ESD immunity.
Technical Context
The ESDS314DBVR implements a passive snapback-triggered TVS structure with four identical unidirectional channels, each rated for 3.6V reverse stand-off and 5.5V minimum DC breakdown. Its low dynamic resistance enables clamping voltages as low as 5.0V (IPP = 1A, IO→GND) and 2.2V (IPP = 16A, GND→IO), critical for preserving signal integrity on 125MHz Ethernet differential pairs.
Designed specifically for flow-through routing in compact SOT-23-5 packages, it supports bidirectional transient suppression via dedicated GND pin (Pin 2) and four independent I/O pins (1,3,4,5), with no internal channel coupling - confirmed by 2.25–2.75pF line-to-line capacitance and <0.1pF capacitance variation across bias.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IEC 61000-4-2 ESD Rating | ±30kV contact & air discharge - exceeds Level 4, enabling direct interface protection without external shielding in consumer/industrial Ethernet ports. |
| Surge Current (IEC 61000-4-5) | 25A (8/20μs) per channel - sustains lightning-induced transients on RJ-45 lines coupled through 42Ω/0.5μF network. |
| IO-to-GND Capacitance | 4.5pF typical - preserves signal rise time and insertion loss <–1dB up to 2GHz, validated for 1Gbps Ethernet compliance. |
| DC Breakdown Voltage | 5.5V minimum - ensures reliable triggering above 3.6V PHY supply while avoiding false conduction during normal operation. |
| Leakage Current | 5nA typical at 3.6V - prevents measurable loading on high-impedance GPIO or USB D+/D− lines. |
| Operating Temperature | –40°C to +125°C - supports deployment in automotive infotainment gateways and industrial NVR enclosures without derating. |
Pinout & Package
SOT-23-5 (DBV) package: 2.9mm × 1.6mm × 1.45mm body, gull-wing leads, moisture sensitivity level 1 (260°C reflow unlimited), tape-and-reel packaging (3000 units/reel), pin 1 quadrant Q3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O1 | Surge-protected input/output channel - connects directly to TP1+ or other high-speed signal line; clamps transients to GND. |
| 2 | GND | Common ground reference - must be low-inductance connection to system ground plane to ensure effective clamping. |
| 3 | I/O2 | Surge-protected input/output channel - assigned to TP1− in Ethernet 1000BASE-T differential pair protection. |
| 4 | I/O3 | Surge-protected input/output channel - used for TP2+ or auxiliary GPIO line; electrically isolated from other I/O pins. |
| 5 | I/O4 | Surge-protected input/output channel - assigned to TP2− or second differential pair; maintains <0.1pF capacitance matching vs. I/O1–I/O3. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low IO capacitance | 4.5pF typical per channel - minimizes signal distortion on 125MHz Ethernet differential pairs and preserves eye diagram margin. |
| Low clamping voltage | 5.0V at 1A (IO→GND); 2.2V at 16A (GND→IO) - limits stress on downstream PHY transceivers during fast ESD events. |
| High surge current capability | 25A (8/20μs) per channel - meets IEC 61000-4-5 requirements for industrial Ethernet switch front-ends. |
| Industrial temperature range | –40°C to +125°C - enables use in sealed NVR enclosures and outdoor access point housings without thermal derating. |
| Flow-through routing support | Pins 1–5 arranged for straight PCB trace routing - reduces stub length and impedance discontinuity in high-speed layouts. |
Applications
| Ethernet 1000BASE-T Interface Protection | USB 2.0 Data Line Protection |
|---|---|
Use Scenario: Protecting differential pairs (TP1+/TP1−, TP2+/TP2−) between RJ-45 connector and Ethernet PHY IC in enterprise switches and gateways. IC Role / Device Role / Timing Role: Unidirectional TVS clamp that diverts ±30kV ESD strikes and 25A surges to GND while maintaining <5pF loading on 125MHz signals. Use Value: Enables compliance with IEC 61000-4-2 Level 4 and IEC 61000-4-5 without sacrificing 1Gbps data throughput or requiring board-level shielding. |
Use Scenario: Safeguarding USB 2.0 D+ and D− lines on host controllers or peripheral devices exposed to user-handled connectors. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor placed adjacent to USB connector to limit clamping voltage to ≤5.6V at 12A surge. Use Value: Prevents PHY latch-up or damage during hot-plug ESD events while maintaining full-speed (480Mbps) signal integrity via 4.5pF channel capacitance. |
| Industrial GPIO Protection | Video Surveillance DVR/NVR Port Protection |
Use Scenario: Shielding general-purpose microcontroller GPIOs connected to external sensors, buttons, or actuators in factory automation equipment. IC Role / Device Role / Timing Role: Four independent ESD paths (Pins 1,3,4,5 → Pin 2) with 5nA leakage - avoids signal degradation on 3.3V logic lines. Use Value: Eliminates need for discrete diodes per line, reducing BOM count and PCB area while delivering ±30kV air-gap immunity per pin. |
Use Scenario: Hardening analog video inputs (CVBS), Ethernet control ports, and SD card interfaces in outdoor-rated digital video recorders. IC Role / Device Role / Timing Role: Multi-channel surge protector mounted at board edge to shunt induced lightning energy before reaching SoC or codec ICs. Use Value: Withstands 25A (8/20μs) surges from long cable runs and meets extended temperature requirements (–40°C to +125°C) for sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar TVS diode array applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMA6J33A-Q | Single-channel, 33V standoff, 600W peak power - higher clamping voltage (64.3V @ 10A), 100pF capacitance. | Not suitable for high-speed data lines; limited to power rail or low-frequency signal protection. | Select only for non-data applications where capacitance and speed are irrelevant. |
| TPD2E001DRYR | 2-channel, 5V standoff, 4.5pF capacitance, ±15kV ESD - lower IEC 61000-4-2 rating and no 25A surge rating. | Valid for USB 2.0 but insufficient for Ethernet 1000BASE-T surge testing per IEC 61000-4-5. | Use where cost is prioritized over full industrial surge immunity; verify system-level test pass with 12A max. |
Compared with ESDS314DBVR, SMA6J33A-Q lacks high-speed suitability due to excessive capacitance and clamping voltage, while TPD2E001DRYR provides adequate ESD protection for USB but falls short on 25A surge capability required for Ethernet front-end hardening - making ESDS314DBVR the only option meeting both ±30kV ESD and 25A surge in a 4-channel, sub-5pF SOT-23 package.
Availability
ESDS314DBVR is available at Aetrix Electronics and suitable for Ethernet switch design, USB 2.0 peripheral development, and industrial GPIO protection requiring stable component supply, full production traceability, and long-term lifecycle assurance.
Supply support for ESDS314DBVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision analog, power management, and signal chain solutions.
The ESDS31x family is designed specifically for high-speed data line protection in Ethernet, USB, and GPIO applications - emphasizing ultra-low capacitance, robust IEC-compliant transient immunity, and compact flow-through packaging for signal integrity preservation.
FAQ
What is the maximum surge current rating for ESDS314DBVR per channel?
The ESDS314DBVR is rated for 25A peak pulse current (8/20μs waveform) per I/O channel under IEC 61000-4-5 testing conditions. This rating is validated across all four channels simultaneously when properly decoupled to a low-inductance ground plane, and remains stable over the full –40°C to +125°C operating range. The ESDS314DBVR achieves this with a clamping voltage of 6.5V at 25A (IO→GND) and 3.6V (GND→IO), ensuring downstream IC protection.
Does ESDS314DBVR support bidirectional signal lines like USB D+ and D−?
Yes, ESDS314DBVR supports bidirectional high-speed data lines including USB 2.0 D+ and D−. Its unidirectional architecture uses separate forward and reverse clamping paths: during positive transients, current flows from I/O pin to GND (clamping ~5.0V at 1A); during negative transients, current flows from GND to I/O pin (clamping ~2.2V at 16A). This dual-path behavior preserves signal symmetry and meets USB 2.0 eye diagram requirements without adding DC offset.
What is the recommended PCB layout for ESDS314DBVR in Ethernet 1000BASE-T applications?
Place ESDS314DBVR within 3mm of the RJ-45 connector with shortest possible traces to Pins 1,3,4,5 and direct low-inductance connection to Pin 2 (GND) via multiple vias to inner ground plane. Avoid stubs, right-angle bends, or parallel routing near unprotected nets. Use the manufacturer's DBV0005A land pattern (1.1mm pad length, 0.6mm width) and 0.125mm stencil aperture to ensure solder joint reliability and thermal performance under repeated surge events.
How does ESDS314DBVR's 4.5pF capacitance impact 1000BASE-T Ethernet performance?
The 4.5pF typical IO-to-GND capacitance of ESDS314DBVR introduces <0.1dB insertion loss at 125MHz and maintains >12dB return loss across the Ethernet 1000BASE-T band (1–125MHz), as confirmed by Figure 5-12 (D012_S21.grf) in the official datasheet. This ensures minimal jitter accumulation and preserves the 1Gbps eye opening - unlike higher-capacitance TVS devices (>10pF) that degrade common-mode rejection and increase bit error rate.
Is ESDS314DBVR compliant with automotive AEC-Q200 requirements?
No, ESDS314DBVR is not AEC-Q200 qualified. It is specified for industrial temperature operation (–40°C to +125°C) and meets IEC 61000-4-2/4-4/4-5 standards, but lacks the stress testing, failure analysis, and qualification documentation required for automotive-grade components. For automotive Ethernet applications, TI recommends AEC-Q200-qualified alternatives such as the TPD4E001DQAR or TPD2EUSB30.
ESDS314DBVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- SC-74A, SOT-753
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.6V (Max)
- Voltage - Breakdown (Min):
- 4.5V
- Voltage - Clamping (Max) @ Ipp:
- 6.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 25A (8/20µs)
- Power - Peak Pulse:
- 170W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 4.5pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-5
ESDS314DBVR FAQ
1.How can I place an order for ESDS314DBVR through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDS314DBVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDS314DBVR reliable?
The price and inventory of ESDS314DBVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDS314DBVR is usually 5 days.
3.What payment methods are accepted for ESDS314DBVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDS314DBVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDS314DBVR?
ESDS314DBVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDS314DBVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDS314DBVR?
For technical support, including ESDS314DBVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDS314DBVR requirements.
6.How does Aetrix verify that ESDS314DBVR is sourced from the original manufacturer or authorized distributors?
All ESDS314DBVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDS314DBVR meets industry standards.
7.What is the process for return or replacement of ESDS314DBVR?
All ESDS314DBVR units undergo pre-shipment inspection (PSI). If there is an issue with ESDS314DBVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDS314DBVR part is unused and in its original packaging.
Return procedure for ESDS314DBVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDS314DBVR Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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Diodes Incorporated
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Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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