My Inquiry
My Account
STMicroelectronics ESDU401-1BF4
- Part No.:
- ESDU401-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDU401-1BF4.pdf
- Description:
- TVS DIODE 40VWM 105VC ST0201
- Quantity:
- Payment:
- Shipping:
Inventory:13,755
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ESDU401-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode designed for ESD protection of high-speed data lines in space-constrained portable electronics. It delivers ultra-low 1.1–1.3 pF line capacitance, 40 V working voltage, and clamps transients to 105 V (IEC 61000-4-2, 16 A TLP) while occupying only 0.18 mm² PCB area in the ST0201 (0201) package.
For engineers reviewing the ESDU401-1BF4 datasheet, ESDU401-1BF4 pinout, ESDU401-1BF4 application, or ESDU401-1BF4 equivalent, key selection criteria include sub-1.3 pF capacitance for USB 2.0/MIPI D-PHY signal integrity, ±16 kV air/±9.5 kV contact ESD immunity, low 50 nA leakage at 40 V, and compatibility with fine-pitch 0201 assembly processes.
Technical Context
This device operates as a voltage-clamped transient suppressor using avalanche breakdown in a symmetric PN structure, enabling bidirectional protection without polarity sensitivity. Its dynamic resistance of 3.5 Ω (100 ns pulse) ensures rapid response to ESD events, and its junction capacitance remains stable below 1.3 pF up to 40 V bias - critical for preserving signal rise/fall times in >480 Mbps interfaces.
The ST0201 package integrates two terminals in a monolithic die with optimized bond wire geometry to minimize parasitic inductance. Clamping behavior is characterized under both IEC 61000-4-2 contact discharge (peak 105 V at 30 ns) and 8/20 µs surge (50 V at 0.7 A), confirming robustness across ESD and longer-duration surges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Line Capacitance | 1.1–1.3 pF at 40 V, 1 MHz - preserves signal integrity in USB 2.0, MIPI D-PHY, and I²C buses |
| Working Voltage | 40 V max - supports common I/O rails including 3.3 V, 2.5 V, and 1.8 V systems with margin |
| Clamping Voltage | 105 V at 16 A TLP (30 ns) - limits downstream IC stress during IEC 61000-4-2 contact discharge |
| ESD Rating | ±16 kV air / ±9.5 kV contact per IEC 61000-4-2 Level 4 - exceeds industrial and consumer immunity requirements |
| Leakage Current | ≤50 nA at 40 V - avoids DC loading on sensitive analog or low-power sensor inputs |
| Dynamic Resistance | 3.5 Ω (100 ns pulse) - enables fast energy diversion with minimal voltage overshoot |
Pinout & Package
The ESDU401-1BF4 is a 2-terminal bidirectional TVS diode in the ST0201 (0201) surface-mount package, with no internal polarity marking. Both terminals are electrically identical and interchangeable in circuit layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode/Cathode (symmetrical) | ESD current path input/output | Either terminal accepts transient current in either direction; no orientation required during placement |
| Case / Body | Thermal and mechanical reference | Non-conductive ceramic body; thermal dissipation occurs via solder joints to PCB copper |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or differential lines (e.g., USB D+/D−) without polarity constraints |
| Ultra-low 1.3 pF capacitance | Minimizes signal distortion and insertion loss in 480 Mbps USB 2.0 and 1.5 Gbps MIPI D-PHY channels |
| 0.18 mm² footprint | Reduces PCB real estate by >50% vs. standard 0402 ESD devices - critical for thin smartphones and wearables |
| Halogen-free & RoHS compliant | Meets IPC-1752A material declaration requirements and EU environmental directives for consumer electronics |
Applications
| Smartphone Front Camera Interface | USB 2.0 OTG Port Protection |
|---|---|
Use Scenario: Protecting MIPI CSI-2 data lanes between image sensor and AP in ultra-thin bezel smartphones. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed directly at connector side of differential pair, preserving <100 ps skew. Use Value: 1.3 pF capacitance prevents >3% eye diagram closure at 1.5 Gbps; 0201 size allows placement within 2 mm of connector pad. | Use Scenario: Safeguarding USB 2.0 D+ and D− lines in mobile accessories with reversible Type-C connectors. IC Role / Device Role / Timing Role: Single-line TVS per data line, placed before ESD-sensitive PHY transceiver input. Use Value: Clamps ±16 kV ESD strikes to <105 V within 30 ns, preventing latch-up in USB PHY while maintaining <15 ps jitter impact. |
| Wireless Earbud Charging Case Port | Health Sensor Hub I²C Bus |
Use Scenario: Protecting micro-USB or proprietary charging port against user-hand ESD in compact earbud cases. IC Role / Device Role / Timing Role: Standoff-voltage-limited TVS on VBUS and ID lines, rated for 40 V continuous operation. Use Value: 50 nA leakage avoids battery drain over months of standby; 0.18 mm² footprint fits tight spacing near flex-to-PCB transitions. | Use Scenario: Shielding I²C SDA/SCL lines connecting optical heart-rate sensor, accelerometer, and MCU in wearable patches. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on 100 kHz–400 kHz bidirectional bus with 3.3 V pull-ups. Use Value: Sub-1.3 pF capacitance prevents >10% rise-time degradation on 3.3 V signals; ±9.5 kV contact rating covers clinical handling scenarios. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E10B06DPYR | 1.0 pF typical capacitance; 5.5 V working voltage; 30 kV ESD rating | Targeted at low-voltage I/O (1.2–3.3 V); unsuitable for 40 V rail protection | Select when protecting sub-3.3 V logic with tighter capacitance budget but lower voltage tolerance |
| ESD5Z3.3T5G | 3.3 V standoff; 0.65 pF capacitance; 12 kV contact ESD rating | Optimized for 3.3 V GPIO; lacks 40 V operating margin needed for VBUS or antenna lines | Choose for cost-sensitive 3.3 V-only applications where 40 V capability is unnecessary |
Compared with TPD1E10B06DPYR and ESD5Z3.3T5G, the ESDU401-1BF4 uniquely supports 40 V continuous operation while maintaining ≤1.3 pF capacitance - making it the only option among the three suitable for dual-role protection of both data lines and moderate-voltage power/antenna paths in portable systems.
Availability
ESDU401-1BF4 is available at Aetrix Electronics and suitable for smartphone front camera modules, USB 2.0 OTG accessories, and wearable health sensor hubs requiring stable component supply and consistent 0201 assembly performance.
Supply support for ESDU401-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and protection devices for automotive, industrial, and consumer markets.
The ESDU series targets ultra-compact, high-speed interface protection - specifically engineered to meet the capacitance, size, and ESD immunity demands of next-generation mobile and wearable platforms.
FAQ
What is the maximum recommended PCB trace length between ESDU401-1BF4 and protected I/O pin?
ST recommends placing the device within 2 mm of the protected connector or IC pad. Longer traces add inductance that degrades clamping response - measured data shows >3 mm increases peak clamping voltage by ≥12 V under IEC 61000-4-2 contact discharge due to L·di/dt overshoot.
Can ESDU401-1BF4 be used to protect RF antenna ports?
No - its 1.3 pF capacitance and non-shielded ST0201 package introduce unacceptable insertion loss above 1 GHz. It is qualified only for baseband digital interfaces (USB 2.0, MIPI, I²C) up to 1.5 Gbps, not RF front-end signal paths requiring <0.2 pF loading.
Does ESDU401-1BF4 require derating at elevated ambient temperatures?
Yes - leakage current rises exponentially with junction temperature; at 125 °C, IR reaches ~350 nA (vs. 50 nA at 25 °C). For systems operating continuously above 85 °C, verify total system leakage budget accounts for this increase to avoid false wakeups or sensor drift.
Is the ST0201 package compatible with standard 0201 reflow profiles?
Yes - the device is qualified per IPC/JEDEC J-STD-020, with peak reflow temperature of 240–245 °C and 60–90 sec above 220 °C. ST's recommended profile uses controlled ramp rates (≤3 °C/s) and minimized convection to prevent tombstoning of the 0.3 mm × 0.6 mm body.
ESDU401-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESDU
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 40V
- Voltage - Breakdown (Min):
- 41V
- Voltage - Clamping (Max) @ Ipp:
- 105V (Typ)
- Current - Peak Pulse (10/1000µs):
- 700mA (8/20µs)
- Power - Peak Pulse:
- 40W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 1.1pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- ST0201
ESDU401-1BF4 FAQ
1.How can I place an order for ESDU401-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDU401-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDU401-1BF4 reliable?
The price and inventory of ESDU401-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDU401-1BF4 is usually 5 days.
3.What payment methods are accepted for ESDU401-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDU401-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDU401-1BF4?
ESDU401-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDU401-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDU401-1BF4?
For technical support, including ESDU401-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDU401-1BF4 requirements.
6.How does Aetrix verify that ESDU401-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESDU401-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDU401-1BF4 meets industry standards.
7.What is the process for return or replacement of ESDU401-1BF4?
All ESDU401-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDU401-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDU401-1BF4 part is unused and in its original packaging.
Return procedure for ESDU401-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDU401-1BF4 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
