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STMicroelectronics ESDV5-1BF4
- Part No.:
- ESDV5-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESDV5-1BF4.pdf
- Description:
- TVS DIODE 5.5VWM 16.3VC ST0201
- Quantity:
- Payment:
- Shipping:
Inventory:34,388
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Product details
Overview
ESDV5-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode for ESD protection of high-speed data lines, featuring 5–8.5 V breakdown voltage, 16.3 V clamping voltage at 8 kV contact discharge, 5–7 pF line capacitance, 1.7 A peak pulse current, and 0201 (ST0201) package. It targets space-constrained, low-capacitance interfaces in portable consumer electronics.
For engineers reviewing the ESDV5-1BF4 datasheet, ESDV5-1BF4 pinout, ESDV5-1BF4 application, or ESDV5-1BF4 equivalent, key selection criteria include IEC 61000-4-2 Level 4 compliance (±12 kV contact / ±30 kV air), ultralow 0.18 mm² PCB footprint, sub-100 nA leakage at 5.5 V, and thermal robustness from –55 °C to +150 °C junction temperature.
Technical Context
The ESDV5-1BF4 operates as a symmetric, bidirectional transient voltage suppressor with avalanche-based clamping. Its low dynamic resistance (0.67 Ω) ensures rapid energy diversion during ESD events, while its 5–7 pF capacitance preserves signal integrity on USB 2.0, I²C, and MIPI D-PHY lines.
Designed for surface-mount integration in ultra-dense layouts, it uses silicon avalanche junction technology with controlled doping to achieve stable 5.8–8.5 V VBR and <16.3 V VCL under IEC 61000-4-2 8/20 μs pulses - enabling protection without signal degradation in <1 GHz analog/digital interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBR (min/typ) | 5.8 V / 8.5 V - Ensures reliable conduction above 5.5 V system rail while avoiding false triggering during normal operation |
| VCL @ 8 kV | 16.3 V - Limits transient overvoltage to safe levels for 1.8 V/3.3 V I/O structures |
| CLINE | 5–7 pF - Enables use on 480 Mbps USB 2.0 and 1 Gbps MIPI D-PHY without measurable signal distortion |
| IPP | 1.7 A - Sustains full IEC 61000-4-2 Level 4 contact discharge (12 kV) without degradation |
| RD | 0.67 Ω - Minimizes voltage overshoot during fast-rising ESD transients (100 ns pulse) |
| Leakage @ 5.5 V | <100 nA - Prevents DC loading on battery-powered sensor and touch interface lines |
| Package | ST0201 (0201 metric) - 0.3 mm × 0.6 mm footprint with 0.18 mm² PCB area for ultra-compact placement |
Pinout & Package
ESDV5-1BF4 is a two-terminal bidirectional device in the ST0201 (0201 metric) package. No polarity marking; terminals are functionally identical and interchangeable.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Terminal 1 | Anode/Cathode (bidirectional) | Connected to protected I/O line; conducts equally in both directions during ESD transients |
| Terminal 2 | Anode/Cathode (bidirectional) | Connected to ground reference; completes low-impedance path for ESD current return |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or differential lines (e.g., USB D+/D−, I²C SDA/SCL) without polarity concerns |
| Ultralow 5–7 pF capacitance | Maintains signal rise/fall times <1 ns on 50 Ω traces, critical for high-speed serial interfaces |
| 0.18 mm² PCB area | Reduces layout congestion in multi-layer smartphone PCBs where board space is allocated per 0.01 mm² |
| IEC 61000-4-2 Level 4 compliance | Guarantees immunity to real-world ESD events including direct human-body contact (±12 kV) and indirect air discharge (±30 kV) |
| ECOPACK®2 compliance | Meets RoHS, REACH, and halogen-free requirements for global consumer electronics certification |
Applications
| Smartphone Front Camera Interface | Wearable Heart Rate Sensor Bus |
|---|---|
Use Scenario: Protecting MIPI CSI-2 data lanes between image sensor and AP in space-limited front camera modules. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed directly at connector entry point to limit transient-induced bit errors. Use Value: 5–7 pF capacitance avoids skew between clock and data lanes; 16.3 V clamping prevents latch-up in 1.2 V sensor I/O cells. | Use Scenario: Shielding I²C bus connecting optical PPG sensor and MCU in wrist-worn fitness trackers. IC Role / Device Role / Timing Role: Low-leakage (≤100 nA) TVS on 3.3 V I²C lines to avoid pull-up current distortion and clock stretching. Use Value: Sub-100 nA leakage preserves battery life over multi-year wearable deployment; 0201 size fits 1.5 mm × 1.5 mm sensor module footprint. |
| Tablet USB 2.0 OTG Port | Home Automation Zigbee Module Antenna Feed |
Use Scenario: ESD hardening of USB 2.0 D+ and D− lines in tablet OTG ports exposed to frequent cable insertion/removal. IC Role / Device Role / Timing Role: Line-to-ground TVS placed immediately before USB PHY to absorb contact discharge before signal integrity loss. Use Value: 1.7 A IPP withstands repeated ±12 kV discharges; 0.67 Ω RD limits overshoot to <200 mV beyond clamping voltage. | Use Scenario: Transient suppression on RF front-end matching network feeding 2.4 GHz Zigbee antenna in smart home hubs. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on 50 Ω RF trace to prevent ESD-induced gate oxide rupture in PA/LNA. Use Value: 7 pF max capacitance introduces <0.1 dB insertion loss at 2.4 GHz; 16.3 V clamping protects 3.3 V RF ICs without degrading VSWR. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E05U06DPYR | 6.0 V VBR, 12 pF CI/O, 1.2 A IPP, same 0201 package | Higher capacitance limits use to ≤100 Mbps interfaces; lower IPP reduces margin for repeated ESD stress | Select when cost sensitivity outweighs need for USB 2.0 or MIPI support |
| ESD9X5.0ST5G | 5.0 V VBR, 25 pF CI/O, 3.0 A IPP, SOD-523 package (1.2 × 0.8 mm) | Larger footprint (6.7× PCB area) but higher surge rating; unsuitable for sub-1 mm pitch layouts | Choose for industrial-grade durability where board space permits larger package |
Compared with TPD1E05U06DPYR and ESD9X5.0ST5G, ESDV5-1BF4 uniquely balances ultra-low capacitance (5–7 pF), compact 0201 size, and 1.7 A surge capability - making it optimal for next-gen mobile interfaces where signal fidelity and miniaturization are co-constrained.
Availability
ESDV5-1BF4 is available at Aetrix Electronics and suitable for smartphone front camera modules, wearable biometric sensors, tablet USB OTG ports, and home automation Zigbee modules requiring stable component supply across high-volume production cycles.
Supply support for ESDV5-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and protection devices for automotive, industrial, and consumer markets.
The ESDV5-1BF4 belongs to ST's ECOPACK®2-compliant ESD protection portfolio, engineered specifically for high-density portable electronics where board space, signal integrity, and IEC 61000-4-2 robustness must coexist.
FAQ
What is the maximum operating temperature for ESDV5-1BF4?
The ESDV5-1BF4 has a specified operating junction temperature range of –55 °C to +150 °C, validated per absolute ratings in ST's DocID029509 Rev 1. This allows reliable operation in thermally demanding environments such as sealed smartphone chassis or wearable devices worn against skin during extended use.
Does ESDV5-1BF4 require orientation during PCB placement?
No - ESDV5-1BF4 is a symmetric, bidirectional two-terminal device with no anode/cathode distinction. The ST0201 package marking may be rotated by multiples of 90° per assembly plant practice, but orientation has no electrical impact; only mechanical alignment to the solder pad footprint matters.
Can ESDV5-1BF4 protect USB 3.0 SuperSpeed lines?
No - ESDV5-1BF4's 5–7 pF capacitance and bandwidth limitations make it unsuitable for USB 3.0 (5 Gbps) differential pairs, which require sub-0.5 pF protection devices. It is qualified for USB 2.0 (480 Mbps), MIPI D-PHY, I²C, and other ≤1 Gbps interfaces per ST's application guidance.
How does ESDV5-1BF4 compare to polymer-based ESD suppressors?
Unlike polymer-based suppressors, ESDV5-1BF4 uses silicon avalanche junction technology, delivering precise 5.8–8.5 V VBR, consistent 16.3 V clamping, and nanosecond response time. Polymer devices exhibit higher dynamic resistance and variable clamping, making them less suitable for low-voltage, high-speed I/O protection.
ESDV5-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5.5V
- Voltage - Breakdown (Min):
- 8.5V
- Voltage - Clamping (Max) @ Ipp:
- 16.3V
- Current - Peak Pulse (10/1000µs):
- 1.7A
- Power - Peak Pulse:
- 20W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 7pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- ST0201
ESDV5-1BF4 FAQ
1.How can I place an order for ESDV5-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDV5-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDV5-1BF4 reliable?
The price and inventory of ESDV5-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDV5-1BF4 is usually 5 days.
3.What payment methods are accepted for ESDV5-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDV5-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDV5-1BF4?
ESDV5-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDV5-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDV5-1BF4?
For technical support, including ESDV5-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDV5-1BF4 requirements.
6.How does Aetrix verify that ESDV5-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESDV5-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDV5-1BF4 meets industry standards.
7.What is the process for return or replacement of ESDV5-1BF4?
All ESDV5-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDV5-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDV5-1BF4 part is unused and in its original packaging.
Return procedure for ESDV5-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDV5-1BF4 Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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