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NXP Semiconductors FXLS8471QR1
- Part No.:
- FXLS8471QR1
- Manufacturer:
- NXP Semiconductors
- Category:
- Accelerometers
- Package:
- 16-VFQFN
- Datasheet:
-
FXLS8471QR1.pdf
- Description:
- ACCELEROMETER 2-8G I2C/SPI 16QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,802
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Product details
Overview
FXLS8471QR1 from NXP Semiconductors is a 3-axis linear accelerometer in a 3 mm × 3 mm × 1 mm VQFN16 package, delivering 14-bit resolution, ±2 g/±4 g/±8 g dynamically selectable full-scale ranges, and programmable output data rates from 1.563 Hz to 800 Hz. It supports both I²C (up to 400 kHz) and SPI (up to 1 MHz) interfaces and integrates embedded event detection-including freefall, motion, tap, orientation, and vector-magnitude change-for automotive tilt sensing and industrial vibration monitoring.
For engineers reviewing the FXLS8471QR1 datasheet, FXLS8471QR1 pinout, FXLS8471QR1 application, or FXLS8471QR1 equivalent, this page delivers verified electrical specs, validated pin functions, confirmed operating temperature (–40 °C to +105 °C), real-world use-value of its 192-byte FIFO and low-noise mode (99 µg/√Hz), and two rigorously cross-checked alternative accelerometers for system-level design continuity.
Technical Context
The FXLS8471QR1 implements a MEMS-based capacitive sensing architecture with on-chip signal conditioning, 14-bit ADC conversion, and dual-mode digital interface auto-detection (I²C/SPI) triggered by SA0 pin state at power-up. Its embedded functionality includes independent high-pass filtering, four oversampling options, and configurable interrupt generation via INT1/INT2 pins.
Power management is implemented through five distinct modes-OFF, Standby, Active (Wake/Sleep)-with automatic ODR scaling via Auto-Wake and Sleep transitions. The device uses separate VDD (1.95–3.6 V) and VDDIO (1.62–3.6 V) rails, enabling partial interface operation during host sleep, and features an integrated 8-bit temperature sensor (0.96 °C/LSB sensitivity).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Full-scale range | ±2 g / ±4 g / ±8 g - dynamically switchable per application demand; enables single-part support across low- and high-acceleration scenarios without hardware change. |
| Resolution | 14-bit ADC - provides 0.244 mg/LSB sensitivity in ±2 g mode, enabling sub-millig acceleration detection critical for precision tilt and orientation tracking. |
| Output data rate (ODR) | 1.563 Hz to 800 Hz - programmable in real time; allows trade-off between latency and power (e.g., 130 µA at 400 Hz in low-power mode). |
| Noise density | 99 µg/√Hz in low-noise mode - measured at 200-Hz bandwidth; ensures stable output for vibration analysis in industrial IoT equipment monitoring. |
| Digital interfaces | I²C (100/400 kHz) and SPI (≤1 MHz) - dual-interface support simplifies integration into MCU platforms with legacy I²C or resource-constrained SPI-only designs. |
| Operating temperature | –40 °C to +105 °C - qualified for under-hood automotive convenience systems and extended-temperature industrial edge nodes. |
| FIFO depth | 192-byte buffer - stores up to 32 XYZ samples; reduces host polling frequency and enables burst reads during low-power wake cycles. |
Pinout & Package
FXLS8471QR1 is housed in a 3 mm × 3 mm × 1 mm VQFN16 package (SOT1676-1) with exposed thermal pad. All pins are surface-mount compatible and require standard QFN reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main power supply | 1.95–3.6 V analog/digital core rail; decoupling requires 4.7 µF bulk + 100 nF ceramic capacitor placed adjacent to pin 14. |
| VDDIO | Interface I/O supply | 1.62–3.6 V logic-level reference for SDA, SCL, SA0, SA1, RST; pins clamp at VDDIO + 0.3 V - mandates voltage alignment with host MCU I/O domain. |
| SCL/SCLK | Clock input | Shared I²C clock / SPI clock line; open-drain for I²C (requires external pull-up); CMOS for SPI; max 400 kHz (I²C fast mode) or 1 MHz (SPI). |
| SDA/MOSI | Data bidirectional / master-out-slave-in | Combines I²C data (open-drain, pull-up required) and SPI MOSI; direction controlled by interface mode auto-detected at power-up via SA0. |
| SA0/MISO | I²C address bit 0 / SPI MISO | Configures I²C slave address (1Ch–1Fh) and selects interface mode: grounded or VDDIO = I²C; floating = SPI. Also serves as SPI data output during reads. |
| SA1/CS_B | I²C address bit 1 / SPI chip select | Second I²C address bit; active-low SPI chip select - must be driven low before SCLK toggling and held low throughout transaction. |
| INT1 / INT2 | Programmable interrupt outputs | Configurable as push-pull or open-drain; drive events like tap, freefall, orientation change; enable host processor to remain in deep sleep until triggered. |
| RST | Active-high reset | Asynchronous reset input; internal pull-down; connect to GND if unused. Toggle confirms reset completion (INT1 high→low→high over 500 ns). |
Key Features
| Feature | Design Value |
|---|---|
| Embedded event detection engine | Hardware-accelerated freefall, motion, transient, pulse/tap (single/double), and orientation (portrait/landscape) detection - offloads host CPU and reduces system power by >70% in wearable activity monitors. |
| Auto-Wake/Sleep with programmable ODR shift | Enables dynamic transition from low-power standby (2 µA) to active sampling only when motion exceeds threshold - extends battery life in asset trackers beyond 12 months on coin cell. |
| Low-noise mode (99 µg/√Hz) | Independent of oversampling settings; delivers highest resolution for vibration signature capture in predictive maintenance sensors without increasing current draw disproportionately. |
| Integrated temperature sensor | 8-bit output, 0.96 °C/LSB sensitivity, –40 °C to +125 °C range - enables on-device thermal compensation of accelerometer offset and sensitivity drift in automotive ECUs. |
| Self-test function | Electrostatic actuation verifies MEMS transducer and signal chain integrity without mechanical stimulus - satisfies functional safety requirements (e.g., ISO 26262 ASIL-B diagnostic coverage). |
Applications
| Automotive Tilt Sensing | Industrial Vibration Monitoring |
|---|---|
Use Scenario: Detecting vehicle roll angle and headlight leveling position in ADAS-enabled lighting control modules. IC Role / Device Role / Timing Role: Primary 3-axis inertial sensor providing real-time angular orientation data at 200 Hz ODR with <1 ms latency. Use Value: Enables closed-loop correction of headlight beam pitch using ±2 g full-scale range and 0.244 mg/LSB resolution - meets ECE R112 photometric stability requirements. |
Use Scenario: Continuous vibration spectrum acquisition on rotating machinery (pumps, compressors) for early bearing fault detection. IC Role / Device Role / Timing Role: Edge-node accelerometer feeding FFT-ready time-series data into microcontroller-based spectral analysis firmware. Use Value: 99 µg/√Hz noise floor and 192-byte FIFO allow 32-sample bursts at 400 Hz - captures transient impacts missed by lower-resolution sensors in IIoT condition monitoring gateways. |
| Wearable Activity Tracking | Patient Monitoring Systems |
Use Scenario: Step counting, gesture recognition, and sleep-phase classification in wrist-worn fitness bands. IC Role / Device Role / Timing Role: Low-power motion coprocessor managing tap detection, orientation switching, and motion/no-motion state machine autonomously. Use Value: Embedded pulse/tap and orientation engines reduce host MCU wake-ups by 90%; 2 µA standby current extends battery life to 30+ days on 100 mAh cell. |
Use Scenario: Fall detection and posture logging in ambulatory patient monitors worn on chest or waist. IC Role / Device Role / Timing Role: Safety-critical inertial trigger generating interrupt on rapid deceleration (>3 g) or sustained horizontal orientation post-impact. Use Value: Freefall + orientation detection with programmable debounce eliminates false alarms from bed transfers; –40 °C to +105 °C rating ensures reliability across clinical environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 3-axis accelerometer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMA8451Q | 14-bit resolution, same ±2/4/8 g ranges, but lacks low-noise mode (125 µg/√Hz typical) and has no integrated temperature sensor. | Lower-cost option for basic tilt/orientation where thermal drift compensation is not required; unsuitable for high-fidelity vibration analysis. | Select MMA8451Q only when budget constraints outweigh need for 99 µg/√Hz noise performance and on-chip temperature sensing. |
| BMI160 | 6-axis IMU (3-axis accel + 3-axis gyro), 16-bit accel resolution, 100 µg/√Hz noise, but higher supply current (145 µA at 100 Hz) and larger 2.5 mm × 3.0 mm LGA-14 package. | Required when angular rate data is needed alongside acceleration (e.g., gesture-controlled HMI); adds complexity and cost if only linear motion is monitored. | Choose BMI160 only when gyroscope fusion is essential; FXLS8471QR1 remains optimal for pure acceleration sensing with superior power efficiency and smaller footprint. |
Compared with MMA8451Q and BMI160, FXLS8471QR1 uniquely balances ultra-low noise (99 µg/√Hz), integrated temperature sensing, compact 3 mm × 3 mm VQFN16 packaging, and industry-leading 2 µA standby current - making it the preferred choice for thermally sensitive, space-constrained, and battery-limited applications requiring high-fidelity linear motion data.
Availability
FXLS8471QR1 is available at Aetrix Electronics and suitable for automotive convenience systems, industrial IoT vibration analytics, and medical patient monitors requiring stable component supply across extended temperature and long product lifecycles.
Supply support for FXLS8471QR1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in sensor signal processing and embedded intelligence.
The FXLS8471QR1 belongs to NXP's FXLS family of intelligent MEMS accelerometers, designed specifically for low-power, event-driven inertial sensing in harsh-environment applications demanding extended temperature operation and autonomous interrupt generation.
FAQ
What is the maximum output data rate supported by the FXLS8471QR1?
The FXLS8471QR1 supports a maximum output data rate (ODR) of 800 Hz in normal mode. At this rate, the device draws 240 µA (typical at 25 °C) and maintains full 14-bit resolution. The ODR is fully programmable from 1.563 Hz to 800 Hz via register configuration over I²C or SPI, enabling precise optimization for latency versus power in applications such as real-time vibration analysis or low-duty-cycle wearables.
Does the FXLS8471QR1 support both I²C and SPI interfaces simultaneously?
No, the FXLS8471QR1 does not support simultaneous I²C and SPI operation. Interface selection is determined at power-up or reset by the SA0 pin state: grounded or tied to VDDIO selects I²C mode; floating selects SPI mode. Once configured, the interface remains fixed until the next reset or power cycle. This auto-detection mechanism prevents bus contention and simplifies PCB layout by sharing pins (e.g., SDA/MOSI, SA0/MISO) between protocols.
What is the purpose of the BYP pin on the FXLS8471QR1?
The BYP pin on the FXLS8471QR1 connects to the internal regulator's output bypass capacitor (75–470 nF recommended). This capacitor stabilizes the internal analog voltage reference and directly impacts noise performance and measurement accuracy. Incorrect BYP capacitance causes increased output noise and potential instability in low-noise mode - proper placement adjacent to pin 2 with low-ESR ceramic dielectric is mandatory per NXP layout guidelines.
How does the embedded self-test function work on the FXLS8471QR1?
The FXLS8471QR1 self-test applies electrostatic actuation force to the MEMS proof mass, simulating a known acceleration step. When activated, X/Y/Z output registers shift by predictable amounts (e.g., 192–6000 LSB depending on axis and full-scale range), verifying transducer integrity and signal chain functionality without mechanical stimulus. This feature is used during production test and field diagnostics to meet ISO 26262 functional safety requirements for automotive applications.
Can the FXLS8471QR1 operate reliably at +105 °C ambient temperature?
Yes, the FXLS8471QR1 is fully specified and guaranteed to operate from –40 °C to +105 °C. Electrical parameters including zero-g offset (±80 mg), sensitivity accuracy (±2.5%), and supply current (274 µA max in normal mode) are characterized across this full range. Its qualification per AEC-Q100 Grade 2 standards confirms suitability for under-hood automotive modules and industrial control cabinets exposed to elevated thermal stress.
FXLS8471QR1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 16-VFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Digital
- Axis:
- X, Y, Z
- Acceleration Range:
- ±2g, 4g, 8g
- Sensitivity (LSB/g):
- 4096 (±2g) ~ 1024 (±8g)
- Sensitivity (mV/g):
- -
- Bandwidth:
- 0.78Hz ~ 400Hz
- Output Type:
- I2C, SPI
- Voltage - Supply:
- 1.95V ~ 3.6V
- Features:
- Adjustable Bandwidth, Selectable Low Pass Filter, Selectable Scale
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-QFN (3x3)
FXLS8471QR1 FAQ
1.How can I place an order for FXLS8471QR1 through Aetrix?
Please submit a Request for Quotation (RFQ) for FXLS8471QR1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FXLS8471QR1 reliable?
The price and inventory of FXLS8471QR1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FXLS8471QR1 is usually 5 days.
3.What payment methods are accepted for FXLS8471QR1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FXLS8471QR1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FXLS8471QR1?
FXLS8471QR1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FXLS8471QR1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FXLS8471QR1?
For technical support, including FXLS8471QR1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FXLS8471QR1 requirements.
6.How does Aetrix verify that FXLS8471QR1 is sourced from the original manufacturer or authorized distributors?
All FXLS8471QR1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FXLS8471QR1 meets industry standards.
7.What is the process for return or replacement of FXLS8471QR1?
All FXLS8471QR1 units undergo pre-shipment inspection (PSI). If there is an issue with FXLS8471QR1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FXLS8471QR1 part is unused and in its original packaging.
Return procedure for FXLS8471QR1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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