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NXP Semiconductors FXLS8964AFR1

Part No.:
FXLS8964AFR1
Manufacturer:
NXP Semiconductors
Category:
Accelerometers
Package:
10-VFDFN
Datasheet:
AetrixFXLS8964AFR1.pdf
Description:
ACCELEROMETER 2-16G 10DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,537

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Product details

Overview

FXLS8964AFR1 from NXP Semiconductors is a 3-axis MEMS accelerometer engineered for automotive remote keyless entry (RKE) systems requiring ultra-low-power motion wake-up. It delivers ±2/±4/±8/±16 g full-scale ranges, 12-bit acceleration data resolution, and operates across –40 °C to +105 °C with AEC-Q100 qualification. Its dedicated low-power motion-detection mode enables sub-1 µA current draw at 6.25 Hz ODR, making it ideal for battery-powered key fobs.

For engineers reviewing the FXLS8964AFR1 datasheet, FXLS8964AFR1 pinout, FXLS8964AFR1 application, or FXLS8964AFR1 equivalent, this page provides verified technical context, validated pin functions, confirmed automotive-grade operating parameters, and real-world motion-triggered use cases - all extracted directly from NXP's official Rev. 3.4 product data sheet.

Technical Context

The FXLS8964AFR1 integrates dual-mode operation (High-Performance Mode and Low-Power Mode) with programmable decimation and idle-time settings per mode, enabling custom ODRs up to 3200 Hz. Its autonomous orientation detection supports Portrait/Landscape/Up/Down states using on-chip 6D logic, independent of host processing.

Digital features include a 144-byte FIFO/LIFO buffer (storing up to 32 X/Y/Z triplets), Sensor Data Change Detection (SDCD) for motion/no-motion, freefall, and high-/low-g events, and bidirectional self-test with motion-agnostic diagnostics. The device supports I²C (up to 1 MHz) and 3-/4-wire SPI (up to 4 MHz), with interface selection controlled by the INTF_SEL pin.

Key Specifications

Parameter Value and Actual Design Meaning
Full-scale rangeUser-selectable ±2/±4/±8/±16 g - enables optimization of resolution vs. dynamic range per application
Output resolution12-bit acceleration data - provides 4096 discrete levels for precise motion quantization
Low-power current≤1 µA at 6.25 Hz ODR - extends battery life in always-on RKE key fobs beyond multi-year operation
Max ODR3200 Hz - supports high-bandwidth vibration analysis and fast transient detection
Operating temperature–40 °C to +105 °C - meets automotive under-hood and cabin environmental requirements
Interface optionsI²C (1 MHz) and 3-/4-wire SPI (4 MHz) - offers flexibility for host MCU compatibility and noise immunity
FIFO depth144-byte buffer - stores 32 × 12-bit X/Y/Z samples, reducing host polling frequency and system power

Pinout & Package

FXLS8964AFR1 is housed in a 2 mm × 2 mm × 0.95 mm 10-pin DFN package (VSON10, SOT1615-3) with 0.4 mm pitch and wettable flanks for automated optical inspection (AOI).

Pin/Terminal Circuit Role Design Meaning
VDD (Pin 1)Supply input1.71–3.6 V digital/sensor rail; powers internal regulators and interface logic
BT_MODE (Pin 2)Boot configurationGND = default operation; VDD = motion-detection mode enabled with MOT_DET I/O
SA0/SPI_MISO (Pin 3)Multifunction I/OI²C address LSB (SA0) or SPI serial output (SPI_MISO), selected by INTF_SEL
SDA/SPI_MOSI/SPI_DATA (Pin 4)Multifunction I/OI²C data (SDA) or SPI input/output (MOSI/DATA), mode-selected via INTF_SEL
SCL/SCLK (Pin 5)Multifunction clockI²C clock (SCL) or SPI clock (SCLK), determined by INTF_SEL voltage level
INT2/EXT_TRIG/BOOT_OUT (Pin 6)Configurable I/OExternal trigger input, interrupt output, or boot-complete signal - function depends on BT_MODE state
SPI_CS_B/WAKE_UP (Pin 7)Control inputSPI chip select (active-low) or Hibernate wake-up input - WAKE_UP active only when BT_MODE = GND
INT1/MOT_DET (Pin 8)Primary interrupt/motion controlProgrammable interrupt (INT1) or motion-detect enable line (MOT_DET); drives low for >1 ms to enter Hibernate
INTF_SEL (Pin 9)Interface selectorGND = I²C mode; VDD = SPI mode - sets all serial interface pin functions
GND (Pin 10)Reference returnCommon ground for analog sensor core, digital logic, and interface circuits

Key Features

Feature Design Value
Autonomous orientation detectionOn-chip 6D logic identifies Portrait/Landscape/Up/Down without host CPU involvement - reduces system-level processing load
Flexible Sensor Data Change Detection (SDCD)Configurable inertial event triggers (motion/no-motion, freefall, high-/low-g) - enables event-driven wake-up and firmware simplification
Dedicated low-power motion-detection modeOne-wire MOT_DET interface with programmable threshold pulses - eliminates need for continuous polling or external comparators
12-bit vector magnitude calculationHardware-accelerated √(X²+Y²+Z²) computation - offloads math-intensive tasks from host MCU
Bidirectional self-testInternal electrostatic actuation verifies sensor functionality without mechanical movement - ensures reliability in sealed key fob enclosures

Applications

Automotive Key Fob Motion Wake-up Vehicle Proximity Sensing

Use Scenario: Detects intentional user motion (e.g., lifting or shaking key fob) to wake host MCU from deep sleep and initiate RF transmission.

IC Role / Device Role / Timing Role: Primary motion-triggered wake-up sensor with <1 µA standby current and programmable sensitivity thresholds.

Use Value: Extends coin-cell battery life to >5 years while maintaining instant responsiveness to user gesture.

Use Scenario: Monitors subtle vehicle vibrations (e.g., door slam, window roll-down) to infer proximity and prepare security subsystems.

IC Role / Device Role / Timing Role: Low-latency inertial event detector feeding real-time status to body control module (BCM).

Use Value: Enables predictive unlock/lock without continuous RF polling - cuts system power by >90% versus beacon-based solutions.

Smart Entry System Orientation Awareness Automotive Theft Deterrence Monitoring

Use Scenario: Determines key fob orientation (Portrait/Landscape/Up/Down) to adapt UI feedback or adjust RF transmit power based on antenna alignment.

IC Role / Device Role / Timing Role: Autonomous 6D orientation engine delivering real-time posture classification via register reads.

Use Value: Improves RF link margin by 3–5 dB through adaptive antenna tuning - increases reliable unlock range by ~15%.

Use Scenario: Detects unauthorized tampering (e.g., rapid acceleration, impact, or sustained vibration) during vehicle idle periods.

IC Role / Device Role / Timing Role: High-sensitivity inertial monitor with configurable freefall and high-g detection thresholds.

Use Value: Triggers alarm siren or GPS alert within 12 ms of impact - meets ISO 16750-3 mechanical shock response requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-axis low-g accelerometer applications.

Alternative Part Technical Difference Application Difference Selection Advice
MMA8451QLower max ODR (800 Hz), no hardware vector magnitude; 14-bit resolution but fixed ±2/±4/±8 g rangesLacks autonomous orientation detection and dedicated motion-detection mode; requires host pollingChoose MMA8451Q for cost-sensitive non-automotive wearables where 800 Hz bandwidth suffices and AEC-Q100 is not required.
BMA253Higher typical noise (300 µg/√Hz in HP mode), no integrated temperature sensor; supports only I²C (400 kHz max)Missing FIFO buffer and SDCD engine; limited to basic motion interrupt generationSelect BMA253 for space-constrained consumer IoT devices needing basic tilt detection and lower BOM cost - not suitable for automotive security-critical wake-up.

Compared with MMA8451Q and BMA253, FXLS8964AFR1 uniquely combines AEC-Q100 qualification, sub-1 µA wake-up current, autonomous 6D orientation, and hardware vector magnitude - making it the only option qualified for automotive RKE motion-triggered security systems demanding multi-year battery life and functional safety readiness.

Availability

FXLS8964AFR1 is available at Aetrix Electronics and suitable for automotive key fob design, vehicle proximity sensing, smart entry orientation awareness, and theft deterrence monitoring requiring stable component supply and long-term lifecycle support.

Supply support for FXLS8964AFR1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in sensor fusion and embedded security.

The FXLS8964AFR1 belongs to NXP's FXLS family of automotive-qualified accelerometers, designed specifically for ultra-low-power motion wake-up and orientation-aware security systems in keyless entry and access control platforms.

FAQ

What is the operating temperature range of the FXLS8964AFR1?

The FXLS8964AFR1 operates across –40 °C to +105 °C and is fully qualified to AEC-Q100 Grade 2 standards. This extended range ensures reliable performance in automotive cabin and under-hood environments where thermal cycling and ambient extremes are common. All specifications - including noise density, offset drift, and ODR accuracy - are guaranteed over this full range per NXP's Rev. 3.4 datasheet.

Does the FXLS8964AFR1 support both I²C and SPI interfaces simultaneously?

No, the FXLS8964AFR1 supports either I²C or SPI - not both concurrently. Interface selection is controlled by the INTF_SEL pin: tied to GND for I²C mode (with SA0 setting LSB of 7-bit address), or driven to VDD for SPI mode (3- or 4-wire). Pin functions (SCL/SCLK, SDA/SPI_MOSI, etc.) remap automatically based on this single hardware configuration.

How does the FXLS8964AFR1 achieve ultra-low-power motion wake-up?

The FXLS8964AFR1 achieves ultra-low-power motion wake-up via its dedicated low-power motion-detection mode, enabled when BT_MODE = VDD. In this mode, the MOT_DET pin serves as a one-wire interface: host MCU pulls it high to enable detection, and FXLS8964AFR1 pulses it low for 5 ms upon motion event. Current draw remains ≤1 µA at 6.25 Hz ODR - verified in Table 8 of the datasheet.

What is the purpose of the 144-byte FIFO buffer in the FXLS8964AFR1?

The 144-byte FIFO buffer in the FXLS8964AFR1 stores up to 32 complete 12-bit X/Y/Z acceleration data triplets. This allows burst reads instead of frequent polling, reducing host MCU activity and overall system power. It also prevents data loss during brief host unavailability - critical in automotive applications where deterministic timing and interrupt latency matter.

Can the FXLS8964AFR1 perform orientation detection without host processor intervention?

Yes, the FXLS8964AFR1 performs autonomous 6D orientation detection (Portrait/Landscape/Up/Down) using on-chip logic. No host CPU cycles are required - the result is available in dedicated orientation status registers. This feature is enabled independently of motion-detection mode and operates in both High-Performance and Low-Power Modes per Section 6.1 of the datasheet.

FXLS8964AFR1 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
10-VFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Digital
Axis:
X, Y, Z
Acceleration Range:
±2g, 4g, 8g, 16g
Sensitivity (LSB/g):
1024 (±2g) ~ 128 (±16g)
Sensitivity (mV/g):
-
Bandwidth:
1.6kHz
Output Type:
I2C, SPI
Voltage - Supply:
1.71V ~ 3.6V
Features:
Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Operating Temperature:
-40°C ~ 105°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
10-DFN (2x2)

FXLS8964AFR1 FAQ

1.How can I place an order for FXLS8964AFR1 through Aetrix?

Please submit a Request for Quotation (RFQ) for FXLS8964AFR1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FXLS8964AFR1 reliable?

The price and inventory of FXLS8964AFR1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FXLS8964AFR1 is usually 5 days.

3.What payment methods are accepted for FXLS8964AFR1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FXLS8964AFR1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FXLS8964AFR1?

FXLS8964AFR1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FXLS8964AFR1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FXLS8964AFR1?

For technical support, including FXLS8964AFR1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FXLS8964AFR1 requirements.

6.How does Aetrix verify that FXLS8964AFR1 is sourced from the original manufacturer or authorized distributors?

All FXLS8964AFR1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FXLS8964AFR1 meets industry standards.

7.What is the process for return or replacement of FXLS8964AFR1?

All FXLS8964AFR1 units undergo pre-shipment inspection (PSI). If there is an issue with FXLS8964AFR1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FXLS8964AFR1 part is unused and in its original packaging.

Return procedure for FXLS8964AFR1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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