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NXP Semiconductors FXLS8964AFR3
- Part No.:
- FXLS8964AFR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Accelerometers
- Package:
- 10-VFDFN
- Datasheet:
-
FXLS8964AFR3.pdf
- Description:
- ACCELEROMETER 2-16G 10DFN
- Quantity:
- Payment:
- Shipping:
Inventory:636
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Product details
Overview
FXLS8964AFR3 from NXP Semiconductors is a 3-axis MEMS accelerometer engineered for automotive remote keyless entry (RKE) systems requiring ultra-low-power motion wake-up. It delivers ±2/±4/±8/±16 g full-scale ranges, 12-bit acceleration resolution, and operates from –40 °C to +105 °C in an AEC-Q100-qualified DFN-10 package. Its ≤1 μA standby current at 6.25 Hz ODR enables multi-year battery life in key fobs.
For engineers reviewing the FXLS8964AFR3 datasheet, FXLS8964AFR3 pinout, FXLS8964AFR3 application, or FXLS8964AFR3 equivalent, this page provides verified technical context, validated pin functions, automotive-grade operating limits, and confirmed alternative options for RKE and motion-triggered security systems.
Technical Context
The FXLS8964AFR3 integrates dual operating modes-High Performance Mode (HPM) with 280 µg/√Hz noise density and Low Power Mode (LPM) supporting ≤1 μA current draw at 6.25 Hz ODR. Its autonomous Sensor Data Change Detection (SDCD) engine detects motion/no-motion, freefall, and high-/low-g events without host intervention.
It features a 144-byte FIFO buffer, programmable decimation, and dedicated hardware for portrait/landscape/orientation detection. The device supports I²C up to 1 MHz and 3-/4-wire SPI up to 4 MHz, with configurable interrupt outputs (INT1/MOT_DET, INT2/EXT_TRIG) and a dedicated WAKE_UP input for hibernate mode exit.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Full-scale range | ±2/±4/±8/±16 g - User-selectable to match mechanical shock tolerance and resolution needs in key fob drop or pocket motion detection. |
| Output resolution | 12-bit X/Y/Z data - Enables precise vector magnitude calculation and orientation discrimination (portrait/landscape/up/down). |
| Current consumption | ≤1 μA at 6.25 Hz ODR - Allows >10-year coin-cell battery life in always-on motion-detection mode for automotive RKE. |
| Noise spectral density | 280 µg/√Hz (HPM) - Supports reliable low-g motion detection (e.g., hand lift, pocket removal) with minimal false triggers. |
| Operating temperature | –40 °C to +105 °C - Fully qualified per AEC-Q100 Grade 2 for under-hood and exterior automotive environments. |
| Digital interfaces | I²C up to 1 MHz; 3-/4-wire SPI up to 4 MHz - Enables fast register access and burst data reads while maintaining compatibility with low-pin-count MCUs. |
| FIFO depth | 144 bytes (32 × 12-bit triplets) - Buffers motion event sequences during host sleep, reducing wake frequency and system power. |
Pinout & Package
FXLS8964AFR3 uses a 2 mm × 2 mm × 0.95 mm VSON10 (DFN-10) package with 0.4 mm pitch and wettable flanks for automated optical inspection (AOI) and solder joint reliability in automotive PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pin 1) | Power supply input | 1.71–3.6 V DC supply for sensor core and digital interface; requires local 100 nF decoupling. |
| BT_MODE (Pin 2) | Boot mode selector | GND = normal operation; VDD = dedicated motion-detection mode with MOT_DET pin control. |
| SA0/SPI_MISO (Pin 3) | I²C address / SPI output | I²C: sets LSB of 7-bit address (18h/19h); SPI: serial data output in 4-wire mode. |
| SDA/SPI_MOSI/SPI_DATA (Pin 4) | I²C data / SPI input/output | I²C: bidirectional SDA; SPI: MOSI (4-wire) or bidirectional DATA (3-wire). |
| SCL/SCLK (Pin 5) | I²C clock / SPI clock | I²C: serial clock input (pull-up required); SPI: synchronous clock input (3-/4-wire). |
| INT2/EXT_TRIG/BOOT_OUT (Pin 6) | Interrupt / trigger / boot signal | BT_MODE=GND: programmable interrupt or external trigger; BT_MODE=VDD: open-drain boot completion indicator. |
| SPI_CS_B/WAKE_UP (Pin 7) | SPI select / wake input | Active-low chip select for SPI; wake-up input for exiting hibernate mode (BT_MODE=GND only). |
| INT1/MOT_DET (Pin 8) | Primary interrupt / motion control | BT_MODE=GND: configurable push-pull/open-drain interrupt; BT_MODE=VDD: MOT_DET control line for enabling/disabling motion detection. |
| INTF_SEL (Pin 9) | Interface selection | GND = I²C mode; VDD = SPI mode - hardwired selection determines serial protocol before initialization. |
| GND (Pin 10) | Ground reference | Supply return path; must be connected to low-impedance system ground plane for noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous motion detection | Hardware-accelerated SDCD engine performs real-time motion/no-motion, freefall, and orientation analysis without MCU involvement. |
| Dedicated low-power wake mode | ≤1 μA current draw at 6.25 Hz ODR enables continuous motion monitoring with coin-cell longevity in automotive key fobs. |
| Programmable orientation detection | On-chip 6D orientation logic delivers portrait/landscape/up/down states using vector magnitude and cross-axis correlation. |
| Bidirectional self-test | Internal electrostatic actuation verifies sensor functionality and mounting integrity without mechanical stimulus or orientation dependency. |
| Flexible digital interface | Pin-strapped I²C (1 MHz) or SPI (4 MHz) support simplifies integration with diverse host MCUs while minimizing PCB routing complexity. |
Applications
| Automotive Key Fob Motion Wake-Up | Vehicle Proximity Sensing |
|---|---|
Use Scenario: Detects hand movement or pocket removal to wake a key fob from deep sleep and initiate secure RF transmission. IC Role / Device Role / Timing Role: Primary motion-triggered wake source; autonomously asserts MOT_DET or generates interrupt to enable RF transceiver. Use Value: Extends CR2032 battery life beyond 10 years by eliminating periodic polling and enabling sub-1 µA hibernate current. |
Use Scenario: Monitors subtle vibrations when a user approaches vehicle door handle to pre-activate passive entry system. IC Role / Device Role / Timing Role: Low-latency inertial event detector feeding timing-critical proximity decision logic in body control module. Use Value: Reduces system response time to <100 ms via hardware SDCD, avoiding software-based polling delays. |
| Smart Entry System Tamper Detection | Automotive Occupancy Monitoring |
Use Scenario: Identifies unauthorized physical manipulation (e.g., prying, impact) of key fob housing during theft attempts. IC Role / Device Role / Timing Role: High-g event monitor with configurable threshold; triggers tamper alert via INT1 before host MCU boots. Use Value: Enables immediate cryptographic lockout using 10,000 g shock rating and hardware-level interrupt assertion within 5.56 ms. |
Use Scenario: Detects seat vibration patterns and occupant micro-movements to distinguish between human presence and static objects. IC Role / Device Role / Timing Role: Precision low-g sensor providing 12-bit XYZ data for machine learning inference on occupancy state. Use Value: Supports ASIL-B–compliant cabin monitoring with ±2 g range and 280 µg/√Hz noise floor for reliable micro-motion capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 3-axis low-g accelerometer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMA8451Q | Lower max ODR (800 Hz vs. 3200 Hz); no dedicated MOT_DET pin; 250 µg/√Hz noise in HP mode. | Lacks hardware motion-detection mode and wake-up pin; requires host-driven polling for RKE wake. | Choose MMA8451Q only if ODR < 800 Hz suffices and system-level motion logic resides in MCU. |
| BMA253 | Higher typical current (3 µA at 12.5 Hz vs. 1 µA); no AEC-Q100 qualification; 10-bit resolution (vs. 12-bit). | Not automotive-qualified; unsuitable for production RKE modules requiring AEC-Q100 Grade 2 compliance. | Select BMA253 only for non-automotive consumer prototypes where qualification and resolution are secondary. |
Compared with MMA8451Q and BMA253, FXLS8964AFR3 uniquely combines AEC-Q100 qualification, hardware motion-detection mode with MOT_DET control, 12-bit resolution, and sub-1 µA wake-current - making it the only option qualified for production automotive key fob designs demanding long battery life and functional safety alignment.
Availability
FXLS8964AFR3 is available at Aetrix Electronics and suitable for automotive key fob motion wake-up, vehicle proximity sensing, smart entry tamper detection, and cabin occupancy monitoring requiring stable component supply across extended temperature and lifecycle requirements.
Supply support for FXLS8964AFR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive MCUs, radar, and sensor technologies.
The FXLS8964AFR3 belongs to NXP's automotive-qualified low-power MEMS sensor family, designed specifically for battery-operated security and convenience systems requiring motion-triggered wake-up, orientation awareness, and AEC-Q100 reliability.
FAQ
What is the operating temperature range of the FXLS8964AFR3?
The FXLS8964AFR3 operates from –40 °C to +105 °C and is fully qualified to AEC-Q100 Grade 2 standards. This extended range ensures reliable performance in automotive environments including under-hood locations, door modules, and exterior key fobs exposed to direct sunlight or cold ambient conditions. All specifications-including noise density, offset drift, and ODR accuracy-are guaranteed across this full range.
How does the FXLS8964AFR3 achieve ultra-low-power motion wake-up?
The FXLS8964AFR3 achieves ultra-low-power motion wake-up through its dedicated low-power mode (LPM) with ≤1 μA current draw at 6.25 Hz ODR and autonomous Sensor Data Change Detection (SDCD) hardware. When BT_MODE = GND, the device runs background motion analysis without host CPU involvement, asserting INT1/MOT_DET only upon valid event detection-eliminating continuous polling and extending CR2032 battery life beyond 10 years in key fob applications.
What interfaces does the FXLS8964AFR3 support, and how are they selected?
The FXLS8964AFR3 supports both I²C (up to 1 MHz) and 3-/4-wire SPI (up to 4 MHz), selected via the INTF_SEL pin: GND configures I²C mode, VDD configures SPI mode. Interface selection is latched at power-on reset and cannot be changed dynamically. Pin SA0 sets the I²C secondary address LSB (18h/19h), while SCL/SCLK and SDA/SPI_MOSI/SPI_DATA pins serve dual roles depending on the selected interface.
Can the FXLS8964AFR3 detect orientation changes like portrait/landscape?
Yes, the FXLS8964AFR3 includes on-chip 6D orientation detection logic that autonomously determines portrait/landscape/up/down states using vector magnitude and cross-axis correlation. This function operates independently in both HPM and LPM, requires no host processing, and outputs results directly to dedicated registers-enabling instant UI adaptation or security state transitions in automotive key fobs and access devices.
Is the FXLS8964AFR3 pin-compatible with other NXP accelerometers like the FXLS8471Q?
No, the FXLS8964AFR3 is not pin-compatible with FXLS8471Q or other legacy NXP accelerometers. It uses a unique 10-pin DFN layout with dedicated BT_MODE, MOT_DET, and WAKE_UP pins not present in earlier families. PCB redesign is required for migration; however, register mapping and interrupt behavior are optimized for motion-triggered automotive use cases rather than general-purpose sensing.
FXLS8964AFR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 10-VFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Digital
- Axis:
- X, Y, Z
- Acceleration Range:
- ±2g, 4g, 8g, 16g
- Sensitivity (LSB/g):
- 1024 (±2g) ~ 128 (±16g)
- Sensitivity (mV/g):
- -
- Bandwidth:
- 1.6kHz
- Output Type:
- I2C, SPI
- Voltage - Supply:
- 1.71V ~ 3.6V
- Features:
- Adjustable Bandwidth, Sleep Mode, Temperature Sensor
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-DFN (2x2)
FXLS8964AFR3 FAQ
1.How can I place an order for FXLS8964AFR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for FXLS8964AFR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FXLS8964AFR3 reliable?
The price and inventory of FXLS8964AFR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FXLS8964AFR3 is usually 5 days.
3.What payment methods are accepted for FXLS8964AFR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FXLS8964AFR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FXLS8964AFR3?
FXLS8964AFR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FXLS8964AFR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FXLS8964AFR3?
For technical support, including FXLS8964AFR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FXLS8964AFR3 requirements.
6.How does Aetrix verify that FXLS8964AFR3 is sourced from the original manufacturer or authorized distributors?
All FXLS8964AFR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FXLS8964AFR3 meets industry standards.
7.What is the process for return or replacement of FXLS8964AFR3?
All FXLS8964AFR3 units undergo pre-shipment inspection (PSI). If there is an issue with FXLS8964AFR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FXLS8964AFR3 part is unused and in its original packaging.
Return procedure for FXLS8964AFR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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