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NXP Semiconductors FXLS8967AFR3
- Part No.:
- FXLS8967AFR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Accelerometers
- Package:
- 10-VFDFN
- Datasheet:
-
FXLS8967AFR3.pdf
- Description:
- IC 3-AXIS ACCELEROMETER 10-DFN
- Quantity:
- Payment:
- Shipping:
Inventory:689
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Product details
Overview
FXLS8967AFR3 from NXP Semiconductors is a compact 3-axis MEMS accelerometer engineered for automotive security and convenience systems requiring ultra-low-power wake-up on motion. It delivers ±2/4/8/16 g full-scale ranges, 12-bit acceleration data resolution, and operates across –40 °C to +105 °C with AEC-Q100 qualification. Its dual-mode operation (high-performance and low-power) enables motion-triggered infotainment wake-up, telematics event logging, and SmartLock inertial state detection.
For engineers reviewing the FXLS8967AFR3 datasheet, FXLS8967AFR3 pinout, FXLS8967AFR3 application, or FXLS8967AFR3 equivalent, key selection criteria include its 1 µA standby current at 6.25 Hz ODR, integrated 144-byte FIFO, autonomous orientation detection (Portrait/Landscape/Up/Down), and dual I²C (up to 1 MHz) / SPI (up to 4 MHz) interface support with wettable-flank DFN-10 packaging.
Technical Context
The FXLS8967AFR3 implements a configurable digital signal path with programmable decimation, idle-time control, and flexible performance mode (FPM) enabling custom ODRs up to 3200 Hz. Its sensor core features low-noise analog front-end (230 µg/√Hz in HPM) and integrated 8-bit temperature sensor (±2.5% sensitivity tolerance, –40 to +105 °C range).
Dual interrupt outputs (INT1/MOT_DET and INT2/EXT_TRIG/BOOT_OUT) support autonomous motion-detection wake-up, external trigger synchronization, and boot completion signaling. The device supports both 3-wire and 4-wire SPI, plus I²C with selectable secondary address (0x18/0x19), all accessible via dedicated interface mode pin (INTF_SEL).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Full-scale range | ±2/4/8/16 g - User-selectable to match mechanical shock and resolution requirements without hardware change |
| Output resolution | 12-bit acceleration data - Enables precise motion vector magnitude calculation and high-fidelity orientation detection |
| Low-power ODR | ≤1 µA at 6.25 Hz - Sustains battery-powered automotive sensors for years in always-on monitoring mode |
| FIFO depth | 144-byte buffer - Stores up to 32 X/Y/Z 12-bit triplets for burst capture without host CPU intervention |
| Interface speed | I²C up to 1 MHz / SPI up to 4 MHz - Supports real-time streaming in telematics and infotainment subsystems |
| Operating temperature | –40 °C to +105 °C - Qualified per AEC-Q100 Grade 2 for under-hood and cabin-mounted automotive applications |
| Package | VSON10 (DFN-10), 2 mm × 2 mm × 0.95 mm, 0.4 mm pitch - Wettable flanks enable automated optical solder-joint inspection |
Pinout & Package
VSON10 (DFN-10) package: 2 mm × 2 mm × 0.95 mm body, 0.4 mm pitch, wettable flanks, exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pin 1) | Supply input | 1.71–3.6 V power for sensor and digital logic; decoupling capacitor required near pin |
| BT_MODE (Pin 2) | Boot configuration | GND = default operating mode; VDD = motion-detection mode with MOT_DET wire interface |
| SA0/SPI_MISO (Pin 3) | Multifunction I/O | I²C address LSB (SA0) or SPI serial output (SPI_MISO), selected by INTF_SEL voltage |
| SDA/SPI_MOSI/SPI_DATA (Pin 4) | Multifunction I/O | I²C bidirectional data or SPI input/output; 3-wire SPI enabled when SA0 and SDA tied |
| SCL/SCLK (Pin 5) | Multifunction clock | I²C clock input or SPI clock input; pull-up resistor required for I²C operation |
| INT2/EXT_TRIG/BOOT_OUT (Pin 6) | Configurable I/O | External trigger input, programmable interrupt output, or boot-complete open-drain signal |
| SPI_CS_B/WAKE_UP (Pin 7) | Chip select / wake | Active-low SPI chip select or Hibernate-mode wake-up input (BT_MODE = GND only) |
| INT1/MOT_DET (Pin 8) | Motion-detection I/O | Programmable interrupt output or wired-AND motion-detect input with pulse timing control |
| INTF_SEL (Pin 9) | Interface mode | GND = I²C mode; VDD = SPI mode - determines function of pins 3–5 and 6–7 |
| GND (Pin 10) | Ground reference | Primary supply return; must be low-impedance connection to system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous orientation detection | Real-time Portrait/Landscape/Up/Down classification using internal vector-magnitude and threshold logic - eliminates host-side fusion algorithms |
| Sensor Data Change Detection (SDCD) | Configurable motion/no-motion, freefall, high-g/low-g event triggering - reduces host polling and system power |
| Dedicated low-power motion-detection mode | Single-wire MOT_DET interface with programmable thresholds and pulse timing - enables sub-µA wake-up in SmartLock and door-checker systems |
| Bidirectional self-test | Electrostatic actuation verifies sensor functionality without mechanical movement - ensures reliability in safety-critical automotive deployments |
| Flexible Performance Mode (FPM) | User-defined ODR, decimation factor, and idle time - balances noise, bandwidth, and power for unique use cases like inclinometer vs. alarm sensing |
Applications
| Infotainment Wake-up | Telematics Event Logging |
|---|---|
Use Scenario: Detecting vehicle entry or dashboard interaction to wake infotainment head unit from deep sleep. IC Role / Device Role / Timing Role: Primary motion-triggered wake source with <1 µA quiescent current and <5 ms interrupt latency. Use Value: Extends battery backup runtime in parked vehicle scenarios while maintaining instant responsiveness to user presence. |
Use Scenario: Capturing crash or sudden deceleration events in T-Box for emergency call (eCall) initiation. IC Role / Device Role / Timing Role: Autonomous high-bandwidth (3200 Hz ODR) inertial sensor with 144-byte FIFO for pre/post-event buffering. Use Value: Guarantees capture of critical acceleration transients without host CPU involvement or bus contention. |
| Car Alarm Motion Sensing | SmartLock Inertial State Detection |
Use Scenario: Monitoring vehicle cabin for unauthorized movement during armed state using ultra-low-power wake-on-motion. IC Role / Device Role / Timing Role: Standalone motion detector with programmable sensitivity and activity/inactivity counters. Use Value: Reduces false alarms via configurable SDCD logic and eliminates need for external microcontroller in basic alarm modules. |
Use Scenario: Determining door/window open/closed state and orientation (e.g., trunk lid angle) in keyless entry systems. IC Role / Device Role / Timing Role: Orientation classifier with built-in Portrait/Landscape/Up/Down detection and temperature-compensated offset. Use Value: Enables context-aware locking/unlocking and reduces reliance on mechanical switches or additional sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 3-axis low-g accelerometer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMA8451Q | Lower max ODR (800 Hz), no wettable flanks, 2× larger footprint (3×3 mm QFN), higher typical current (6 µA @ 1.56 Hz) | Limited to lower-bandwidth automotive comfort functions; lacks FIFO depth and orientation autonomy of FXLS8967AFR3 | Choose for cost-sensitive legacy designs where 800 Hz ODR suffices and PCB rework for wettable flanks is prohibitive |
| BNO055 | Fusion sensor (accelerometer + gyroscope + magnetometer + processor); 10× higher power (1.5 mA active), larger 14-pin LGA package | Provides full 9-DOF AHRS output but requires no host motion processing - unsuitable for ultra-low-power wake-only roles | Choose only when absolute orientation (yaw/pitch/roll) is required and system power budget allows >1 mA continuous draw |
Compared with MMA8451Q and BNO055, FXLS8967AFR3 uniquely balances AEC-Q100 qualification, sub-µA wake-current, 3200 Hz ODR capability, and autonomous orientation detection in a wettable-flank DFN-10 - making it optimal for next-generation automotive security and convenience modules demanding minimal power and maximal integration.
Availability
FXLS8967AFR3 is available at Aetrix Electronics and suitable for automotive security, telematics, and smart access systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for FXLS8967AFR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in sensor signal conditioning and automotive-grade reliability.
The FXLS8967AFR3 belongs to NXP's automotive-qualified low-g accelerometer family, designed specifically to replace discrete motion-sensing subsystems in security, convenience, and driver-assistance functions with single-chip, ultra-low-power inertial intelligence.
FAQ
What is the operating temperature range qualified for FXLS8967AFR3?
The FXLS8967AFR3 is AEC-Q100 qualified for continuous operation from –40 °C to +105 °C, meeting Grade 2 automotive requirements. This extended range supports placement in engine compartments, door modules, and cabin-mounted infotainment units where ambient temperatures exceed consumer-grade limits. All specifications in the FXLS8967AFR3 datasheet are validated across this full range.
Does FXLS8967AFR3 support both I²C and SPI interfaces simultaneously?
No, FXLS8967AFR3 does not support simultaneous I²C and SPI operation. Interface selection is controlled by the INTF_SEL pin: GND configures pins for I²C (SCL/SDA), while VDD configures them for SPI (SCLK/SPI_MOSI/SPI_MISO). The FXLS8967AFR3 must be initialized in one mode at power-up; switching requires reset and reconfiguration.
How does the motion-detection mode work on FXLS8967AFR3?
In motion-detection mode (BT_MODE = VDD), FXLS8967AFR3 uses the MOT_DET pin as a wired-AND interface: host pulls it high to enable detection, and FXLS8967AFR3 pulses it low for 5 ms upon motion event. Thresholds are set via pulse-width timing (TPULSE-THRES1–3), and the device enters Hibernate mode if MOT_DET is held low for 1 ms. This enables zero-software, ultra-low-power wake-up in SmartLock and alarm systems.
What is the purpose of the 144-byte FIFO in FXLS8967AFR3?
The 144-byte FIFO in FXLS8967AFR3 stores up to 32 complete 12-bit X/Y/Z acceleration data triplets. It enables burst capture without host CPU intervention, supports data logging during transient events (e.g., crash detection), and decouples sensor sampling from host read timing - critical for deterministic response in automotive safety and telematics applications.
Is FXLS8967AFR3 pin-compatible with earlier NXP accelerometers like FXLS8471Q?
No, FXLS8967AFR3 is not pin-compatible with FXLS8471Q. It uses a 10-pin VSON package with different pin assignments (e.g., BT_MODE, INTF_SEL, and dual-interrupt architecture), whereas FXLS8471Q uses an 8-pin DFN. Migration requires PCB layout revision and firmware adaptation due to differences in register map, interrupt behavior, and interface configuration logic.
FXLS8967AFR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 10-VFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Digital
- Axis:
- X, Y, Z
- Acceleration Range:
- ±2g, 4g, 8g, 16g
- Sensitivity (LSB/g):
- 1024 (±2g) ~ 128 (±16g)
- Sensitivity (mV/g):
- -
- Bandwidth:
- 1.6kHz
- Output Type:
- I2C, SPI
- Voltage - Supply:
- 1.71V ~ 3.6V
- Features:
- Adjustable Bandwidth, Sleep Mode, Temperature Sensor
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-DFN (2x2)
FXLS8967AFR3 FAQ
1.How can I place an order for FXLS8967AFR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for FXLS8967AFR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FXLS8967AFR3 reliable?
The price and inventory of FXLS8967AFR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FXLS8967AFR3 is usually 5 days.
3.What payment methods are accepted for FXLS8967AFR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FXLS8967AFR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FXLS8967AFR3?
FXLS8967AFR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FXLS8967AFR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FXLS8967AFR3?
For technical support, including FXLS8967AFR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FXLS8967AFR3 requirements.
6.How does Aetrix verify that FXLS8967AFR3 is sourced from the original manufacturer or authorized distributors?
All FXLS8967AFR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FXLS8967AFR3 meets industry standards.
7.What is the process for return or replacement of FXLS8967AFR3?
All FXLS8967AFR3 units undergo pre-shipment inspection (PSI). If there is an issue with FXLS8967AFR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FXLS8967AFR3 part is unused and in its original packaging.
Return procedure for FXLS8967AFR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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