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NXP Semiconductors FXLS8974CFR3
- Part No.:
- FXLS8974CFR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Accelerometers
- Package:
- 10-VFDFN
- Datasheet:
-
FXLS8974CFR3.pdf
- Description:
- IC 3-AXIS ACCELEROMETER 10-DFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,237
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Product details
Overview
FXLS8974CFR3 from NXP Semiconductors is a 3-axis MEMS accelerometer optimized for ultra-low-power wake-up-on-motion in industrial and medical IoT systems. It delivers ±2/±4/±8/±16 g full-scale ranges, 12-bit acceleration data resolution, and 230 µg/√Hz noise density in high-performance mode - enabling precise motion detection in asset tracking, patient monitors, and smart inhalers.
For engineers reviewing the FXLS8974CFR3 datasheet, FXLS8974CFR3 pinout, FXLS8974CFR3 application, or FXLS8974CFR3 equivalent, key selection criteria include its 10-pin DFN package with wettable flanks, dual I²C/SPI interface support up to 1 MHz / 4 MHz, autonomous orientation detection (Portrait/Landscape/Up/Down), and sub-1 µA current draw at 6.25 Hz ODR - critical for battery-constrained edge nodes.
Technical Context
The FXLS8974CFR3 integrates a triaxial capacitive MEMS sensor with on-chip ADC, digital signal processing, and configurable power modes - including High-Performance Mode (HPM), Low-Power Mode (LPM), and Hibernate. Its flexible ODR supports programmable decimation and idle-time settings across 0.781 Hz to 3200 Hz, enabling trade-offs between resolution, bandwidth, and current consumption.
Dedicated hardware blocks include a 144-byte FIFO buffer, Sensor Data Change Detection (SDCD) logic for motion/no-motion, freefall, and high-/low-g events, and a 12-bit vector magnitude calculator. The device also features bidirectional self-test, temperature compensation, and a built-in 8-bit temperature sensor with ±2.5% sensitivity tolerance over –40 °C to +105 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Full-scale range | ±2/±4/±8/±16 g - user-selectable via register; enables optimal SNR for low-g motion (e.g., patient activity) or higher-g shock detection (e.g., equipment drop). |
| Output resolution | 12-bit X/Y/Z acceleration data - provides 128 LSB/g at ±16 g, enabling 7.81 mg/LSB granularity for fine-grained motion analysis. |
| Noise spectral density | 230 µg/√Hz (HPM, ±4 g) - ensures stable baseline for detecting subtle vibrations in predictive maintenance sensors. |
| Supply current | ≤1 µA at 6.25 Hz ODR (LPM) - extends battery life to years in always-on wake-up applications like tamper-detection meters. |
| Interface support | I²C up to 1 MHz (Fm+) and 3-/4-wire SPI up to 4 MHz - allows direct connection to low-latency microcontrollers without external level-shifting. |
| Operating temperature | –40 °C to +105 °C - qualified for harsh environments including industrial motor controllers and clinical diagnostic devices. |
| FIFO depth | 144-byte buffer (32 × 12-bit XYZ triplets) - reduces host polling frequency and enables burst-read efficiency in intermittent connectivity scenarios. |
Pinout & Package
FXLS8974CFR3 is housed in a 2 mm × 2 mm × 0.95 mm 10-pin DFN package (VSON10, SOT1615-3) with 0.4 mm pitch and wettable flanks - supporting automated optical inspection (AOI) and reliable solder-joint quality in high-volume manufacturing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pin 1) | Power supply input | 1.71–3.6 V DC supply for sensor core and digital interface; requires local 100 nF decoupling. |
| BT_MODE (Pin 2) | Boot mode selector | GND = normal operation; VDD = dedicated motion-detection mode with MOT_DET handshake protocol. |
| SA0/SPI_MISO (Pin 3) | Interface multiplex pin | I²C address LSB (SA0) when INTF_SEL = GND; SPI serial data output (MISO) when INTF_SEL = VDD. |
| SDA/SPI_MOSI/SPI_DATA (Pin 4) | Interface multiplex pin | I²C bidirectional data (SDA) or SPI input/output (MOSI/DATA) depending on INTF_SEL state. |
| SCL/SCLK (Pin 5) | Interface clock input | I²C clock (SCL) or SPI clock (SCLK); requires external pull-up resistor for I²C operation. |
| INT2/EXT_TRIG/BOOT_OUT (Pin 6) | Configurable interrupt/trigger | Programmable interrupt output or external trigger input; BOOT_OUT active during boot when BT_MODE = VDD. |
| SPI_CS_B/WAKE_UP (Pin 7) | Chip select / wake source | Active-low SPI chip select; functions as wake-up input from Hibernate mode when BT_MODE = GND. |
| INT1/MOT_DET (Pin 8) | Motion detection I/O | Open-drain interrupt output (INT1) or bidirectional MOT_DET control line for enabling/disabling motion detection. |
| INTF_SEL (Pin 9) | Interface mode selector | GND = I²C mode; VDD = SPI mode - sets serial interface protocol at power-on reset. |
| GND (Pin 10) | Ground reference | Primary return path for analog and digital circuits; must be connected to low-impedance system ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous orientation detection | Hardware-accelerated Portrait/Landscape/Up/Down classification - eliminates host CPU load for UI rotation or fall-detection posture analysis. |
| Flexible Sensor Data Change Detection (SDCD) | Configurable inertial event engine for motion/no-motion, freefall, and high-/low-g thresholds - enables zero-host-intervention wake-up decisions. |
| Dedicated low-power motion-detection mode | One-wire MOT_DET handshake protocol with <1 µA quiescent current - ideal for battery-powered asset trackers requiring multi-year operation. |
| 12-bit vector magnitude calculation | On-chip RMS computation of √(X²+Y²+Z²) - reduces host processing overhead and memory usage in vibration monitoring algorithms. |
| Bidirectional self-test | Electrostatic actuation verifies sensor integrity without mechanical stimulus - ensures field reliability in medical devices where physical calibration is impractical. |
Applications
| Asset Tracking | Patient Activity Monitoring |
|---|---|
Use Scenario: Real-time location and movement history logging for high-value logistics containers in warehouse or transport environments. IC Role / Device Role / Timing Role: Motion-triggered wake-up sensor providing XYZ acceleration data to MCU only upon movement, minimizing system power. Use Value: Enables >5-year battery life using coin-cell power while maintaining tamper-detection responsiveness and orientation-aware reporting. |
Use Scenario: Continuous ambulatory monitoring of gait, posture transitions, and activity duration in chronic disease management wearables. IC Role / Device Role / Timing Role: Primary motion classifier feeding orientation and vector-magnitude data to health algorithm firmware. Use Value: Delivers medically relevant metrics (e.g., step count, fall risk score) with <2.5% sensitivity drift over –40 °C to +105 °C operating range. |
| Smart Meter Tamper Detection | Smart Inhaler Usage Analytics |
Use Scenario: Detecting unauthorized meter removal, tilting, or impact events in utility smart meters deployed outdoors. IC Role / Device Role / Timing Role: Always-on inertial event detector triggering secure log entries and wireless alerts upon threshold-exceeding acceleration. Use Value: Meets ANSI C12.22 security requirements with 10,000 g shock survivability and programmable SDCD thresholds for false-alarm suppression. |
Use Scenario: Capturing actuation timing, orientation, and inhalation force profile in connected respiratory therapy devices. IC Role / Device Role / Timing Role: High-fidelity motion capture node synchronized to drug-delivery actuation via EXT_TRIG input. Use Value: Supports FDA-regulated adherence analytics with 12-bit resolution and ±2.5% temperature-compensated accuracy across body-worn thermal conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 3-axis low-g accelerometer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STMicroelectronics LIS2DW12 | Lower max ODR (2600 Hz vs. 3200 Hz); no integrated vector magnitude engine; 10-bit default resolution (upgradable to 12-bit via oversampling). | Lacks autonomous orientation detection; requires host-side computation for portrait/landscape classification. | Preferred when cost sensitivity outweighs need for on-chip orientation logic and highest ODR. |
| Analog Devices ADXL362 | Higher noise floor (300 µg/√Hz vs. 230 µg/√Hz); deeper FIFO (512 bytes); supports only SPI interface (no I²C). | Requires external I²C-to-SPI bridge for I²C-based host systems; lacks SDCD hardware for complex inertial event detection. | Chosen for ultra-low-power (<300 nA standby) applications where SPI-only integration is acceptable and extended FIFO is critical. |
Compared with LIS2DW12 and ADXL362, FXLS8974CFR3 uniquely combines I²C/SPI dual-interface flexibility, on-chip orientation detection, and sub-1 µA wake-up current - making it optimal for compact, thermally demanding, and host-CPU-constrained IoT endpoints.
Availability
FXLS8974CFR3 is available at Aetrix Electronics and suitable for industrial IoT asset tracking, medical patient monitors, and smart meter tamper detection requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for FXLS8974CFR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in sensor fusion and low-power embedded systems.
The FXLS8974CFR3 belongs to NXP's FXLS family of intelligent MEMS accelerometers, designed specifically for battery-operated edge devices needing motion-triggered wake-up, autonomous event detection, and robust operation across industrial temperature extremes.
FAQ
What is the operating voltage range for FXLS8974CFR3?
The FXLS8974CFR3 operates from 1.71 V to 3.6 V DC on its VDD pin. This wide supply range supports direct integration with common lithium coin cells (e.g., CR2032), single-cell Li-ion batteries, and regulated 3.3 V or 2.8 V rails - ensuring compatibility across portable and industrial power architectures without external regulators.
Does FXLS8974CFR3 support both I²C and SPI interfaces simultaneously?
No - FXLS8974CFR3 uses a hardware pin (INTF_SEL) to select either I²C or SPI mode at power-on; it cannot operate both protocols concurrently. When INTF_SEL = GND, the device configures for I²C (SCL/SDA pins active); when INTF_SEL = VDD, it enables SPI (SCLK/SPI_MOSI/SPI_MISO/SPI_CS_B). Interface reconfiguration requires a power cycle or soft reset.
How does the motion-detection mode work on FXLS8974CFR3?
In motion-detection mode (BT_MODE = VDD), FXLS8974CFR3 uses the MOT_DET pin for bidirectional handshake: host pulls MOT_DET high to enable detection, and FXLS8974CFR3 pulses it low for 5 ms upon motion event. Thresholds are set via pulse-width programming on MOT_DET, and the device draws <1 µA in this ultra-low-power state - ideal for always-on sensing in battery-powered nodes.
What is the function of the 144-byte FIFO in FXLS8974CFR3?
The FXLS8974CFR3's 144-byte FIFO stores up to 32 complete 12-bit X/Y/Z acceleration data triplets. It operates in FIFO or LIFO mode and relieves host MCU polling burden by enabling burst reads after interrupt assertion (e.g., DRDY or MOT_DET), reducing bus traffic and power consumption in intermittently connected IoT gateways and wearables.
Can FXLS8974CFR3 perform self-test without external equipment?
Yes - FXLS8974CFR3 implements bidirectional electrostatic self-test: applying a test command triggers internal actuation of the proof mass, generating a known output shift (e.g., ±1600 LSB in ±4 g mode). Results are independent of device orientation or external motion, enabling in-system verification during production test or field diagnostics without mechanical fixtures.
FXLS8974CFR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 10-VFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Digital
- Axis:
- X, Y, Z
- Acceleration Range:
- ±2g, 4g, 8g, 16g
- Sensitivity (LSB/g):
- 1024 (±2g) ~ 128 (±16g)
- Sensitivity (mV/g):
- -
- Bandwidth:
- 1.6kHz
- Output Type:
- I2C, SPI
- Voltage - Supply:
- 1.71V ~ 3.6V
- Features:
- Adjustable Bandwidth, Sleep Mode, Temperature Sensor
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-DFN (2x2)
FXLS8974CFR3 FAQ
1.How can I place an order for FXLS8974CFR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for FXLS8974CFR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FXLS8974CFR3 reliable?
The price and inventory of FXLS8974CFR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FXLS8974CFR3 is usually 5 days.
3.What payment methods are accepted for FXLS8974CFR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FXLS8974CFR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FXLS8974CFR3?
FXLS8974CFR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FXLS8974CFR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FXLS8974CFR3?
For technical support, including FXLS8974CFR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FXLS8974CFR3 requirements.
6.How does Aetrix verify that FXLS8974CFR3 is sourced from the original manufacturer or authorized distributors?
All FXLS8974CFR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FXLS8974CFR3 meets industry standards.
7.What is the process for return or replacement of FXLS8974CFR3?
All FXLS8974CFR3 units undergo pre-shipment inspection (PSI). If there is an issue with FXLS8974CFR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FXLS8974CFR3 part is unused and in its original packaging.
Return procedure for FXLS8974CFR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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