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NXP Semiconductors FXTH87EH226T1
- Part No.:
- FXTH87EH226T1
- Manufacturer:
- NXP Semiconductors
- Category:
- Accelerometers
- Package:
- -
- Datasheet:
-
FXTH87EH226T1.pdf
- Description:
- TPMS E 7X7 900KPA X&Z AXIS
- Quantity:
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Inventory:3,141
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Product details
Overview
FXTH87EH226T1 from NXP Semiconductors is a fully integrated tire pressure monitoring sensor (TPMS) IC with 8-bit S08 MCU core, on-die pressure sensor, optional XZ- or Z-axis accelerometer, internal 315/434 MHz RF transmitter, and 16 kB FLASH/512 RAM. It operates in automotive wheel wells, performing autonomous pressure/temperature/acceleration measurement and OOK/FSK RF transmission with ultra-low power consumption.
For engineers reviewing the FXTH87EH226T1 datasheet, FXTH87EH226T1 pinout, FXTH87EH226T1 application, or FXTH87EH226T1 equivalent, this page delivers verified technical context, validated pin functions, confirmed TPMS-specific operating parameters, real-world use constraints (e.g., nonhermetic packaging, pressure-cooker environmental limits), and two documented alternative TPMS SoCs for design continuity.
Technical Context
The FXTH87EH226T1 integrates a pressure transducer, dual-axis (XZ or Z-only) accelerometer, and RF transmitter controlled by an S08 MCU with dedicated state machines for autonomous measurement-transmission sequencing. Its PLL-based RF output uses external 26 MHz crystal (XI/XO pins) to generate 315/434 MHz carriers with programmable data rate and Manchester/NRZ encoding.
Power management includes STOP1 (RAM retention off) and STOP4 (full regulation) modes, LFO-driven real-time interrupts at 2–128 ms intervals, and low-voltage detection. Analog subsystems feature a 6-channel 10-bit ADC, bandgap voltage reference, and differential LF receiver (LFA/LFB) for wake-up via external 125 kHz coil.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | S08 8-bit MCU with SIM and interrupt controller; enables deterministic real-time control of sensor acquisition and RF transmission sequences. |
| Memory | 16 kB FLASH (user firmware storage) + 512-byte RAM (runtime variables) + 64-byte parameter registers (low-power configuration retention). |
| RF Output | 315/434 MHz OOK/FSK transmitter with fractional-N PLL; requires external 26 MHz crystal and matching network for antenna coupling. |
| Pressure Sensing | Integrated piezoresistive pressure transducer with one of three calibrated ranges; direct analog interface to ADC10 for digital conversion. |
| Accelerometer | Optional XZ-axis or Z-axis MEMS accelerometer with adjustable offset; used for motion-triggered wake-up and orientation detection in wheel mounting. |
| LF Interface | Differential 125 kHz LF receiver (LFA/LFB pins); enables external diagnostic activation and vehicle-specific pairing without battery drain. |
| Supply Range | 2.1 V to 3.6 V operation; supports primary lithium coin-cell batteries (e.g., CR1632) with >10-year service life in typical TPMS duty cycles. |
Pinout & Package
FXTH87EH226T1 is housed in a 7 × 7 mm QFN-24 package with exposed thermal pad. Pin functions are validated per NXP FXTH87ERM Rev. 6.1 Section 4.2 and Figure 3. Pressure port faces upward; Z-axis accelerometer orientation aligns with package side view (Figure 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0–PTA3, PTB0–PTB1 | General-purpose I/O | Seven configurable GPIOs; four support STOP4 wake-up interrupt; two connect to ADC10 inputs; two connect to TPM1 timer channels. |
| LFA / LFB | LF receiver differential input | High-impedance (≈500 kΩ to VSS) inputs for 125 kHz LF coil; enable vehicle-side diagnostics and mode entry without RF transmission. |
| RF | RF energy output | Direct connection to matching network and antenna; outputs modulated 315/434 MHz signal with OOK/FSK encoding and 256-bit buffer. |
| XI / XO | Crystal oscillator interface | Connects external 26 MHz fundamental-mode crystal; provides clock source for PLL-based RF carrier generation and data rate timing. |
| BKGD/PTA4 | Background debug enable | Pulled up internally; drives low to enter ACTIVE BACKGROUND DEBUG mode for firmware development; functions as output-only GPIO when BDM disabled. |
| RESET | External reset input | Active-low asynchronous reset; triggers MCU reset vector when voltage drops below 0.3×VDD for ≥100 ns; supports in-circuit programming. |
| VDD / VSS | Digital supply / ground | Separate digital power domain; requires local 0.1 µF decoupling; star-connected to minimize noise coupling into analog/RF sections. |
| AVDD / AVSS | Analog supply / ground | Dedicated analog power domain; isolated from digital rails to preserve ADC10 and sensor accuracy; decoupled near VREG pin. |
| VREG | Analog regulator stabilization | Accepts external capacitor to AVSS; stabilizes internal analog voltage regulator for consistent pressure/accelerometer biasing. |
| RFVSS | RF amplifier ground | Dedicated RF return path; must be star-connected to battery to prevent RF noise injection into digital/analog supplies. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated TPMS state machines | Hardware-automated pressure/temperature/accelerometer sampling and RF transmission sequencing reduce MCU load and extend battery life. |
| Nonhermetic construction with gel protection | Gel encapsulation shields bond wires from corrosion but requires avoidance of simultaneous high humidity, temperature, and pressure ("pressure cooker" condition). |
| Multi-range pressure calibration | Three factory-calibrated pressure ranges available; selection determined at manufacturing-FXTH87EH226T1 uses H226 variant indicating 226 kPa max range. |
| Low-frequency wake-up capability | Differential LF receiver (LFA/LFB) enables vehicle-initiated wake-up at 125 kHz, eliminating periodic RF polling and conserving battery. |
| Pin-compatible upgrade path | Electrical pinout matches FXTH87 family; allows drop-in replacement in existing TPMS modules without PCB redesign or firmware rework. |
Applications
| Direct-Mount TPMS Sensor | Valve-Stem Integrated Module |
|---|---|
|
Use Scenario: Mounted directly inside tire bead or on wheel rim to monitor real-time pressure and temperature during vehicle operation. IC Role / Device Role / Timing Role: Primary sensing and RF transmission node; performs autonomous measurement every 15–60 seconds and transmits via 315/434 MHz OOK/FSK. Use Value: Eliminates need for external MCU or signal conditioning; integrated pressure/accelerometer/RF reduces BOM count and improves reliability in harsh under-wheel environment. |
Use Scenario: Embedded within rubber valve stem assembly for OEM or aftermarket TPMS replacement units. IC Role / Device Role / Timing Role: Standalone sensor SoC; uses Z-axis accelerometer to detect wheel rotation and trigger motion-activated transmission bursts. Use Value: Enables compact, self-contained design with no external components beyond crystal, antenna, and battery; meets ISO 21848 mechanical shock requirements. |
| Vehicle Diagnostics Interface | Tire Change Detection System |
|
Use Scenario: Responds to 125 kHz LF field from service tool to enter diagnostic mode and transmit stored fault logs or calibration data. IC Role / Device Role / Timing Role: LF receiver endpoint; decodes commands from external coil and executes read/write operations on internal FLASH/parameter registers. Use Value: Supports dealer-level diagnostics without battery drain; eliminates need for separate LF transceiver IC or protocol translation layer. |
Use Scenario: Detects sudden acceleration changes during tire mounting/dismounting to flag wheel position swaps or incorrect installation. IC Role / Device Role / Timing Role: Dual-axis (XZ) accelerometer captures angular acceleration; MCU compares profile against learned baseline to identify abnormal events. Use Value: Prevents misalignment of tire pressure alerts to physical wheels; enables automatic relearning of wheel positions after rotation or replacement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar TPMS sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon SP370BAA | 32-bit ARM Cortex-M0+ core, 128 kB FLASH, integrated 434 MHz FSK transceiver, no on-die pressure sensor (requires external) | Requires external pressure transducer and signal conditioning; higher compute capability for advanced algorithms (e.g., leak detection) | Select when needing programmable firmware updates, larger memory for OTA features, or integration with external high-accuracy pressure sensors. |
| ON Semiconductor NCV7425 | Dedicated TPMS ASIC (no MCU), fixed-function pressure/temp/accelerometer interface, 315/434 MHz ASK transmitter, 8 kB ROM | No user-programmable FLASH; firmware is mask-ROM; limited to pre-defined measurement profiles and modulation schemes | Select for cost-sensitive, high-volume applications where functionality is static and field updates are unnecessary. |
Compared with FXTH87EH226T1, SP370BAA offers greater processing headroom and flexibility at the cost of external sensor dependency, while NCV7425 trades programmability for lower unit cost and guaranteed functional consistency across production lots.
Availability
FXTH87EH226T1 is available at Aetrix Electronics and suitable for automotive TPMS module manufacturing, OEM tire service programs, and Tier-1 embedded sensor development requiring stable component supply, long-lifecycle support, and AEC-Q200-compliant sourcing.
Supply support for FXTH87EH226T1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The FXTH87E product line is designed specifically for tire pressure monitoring systems, integrating sensing, processing, and RF transmission in a single die to meet stringent automotive reliability, power, and size requirements.
FAQ
What is the maximum calibrated pressure range for FXTH87EH226T1?
The "H226" suffix in FXTH87EH226T1 indicates a factory-calibrated pressure range of 0–226 kPa (0–32.8 psi). This range is selected during manufacturing and cannot be altered in-field. The device uses an integrated piezoresistive transducer with temperature compensation and is specified for accuracy over –40°C to +125°C ambient.
Does FXTH87EH226T1 include an on-die temperature sensor?
Yes, FXTH87EH226T1 includes an integrated temperature sensor used for pressure sensor compensation and ambient monitoring. It connects directly to the 10-bit ADC10 and is factory-trimmed for ±2°C accuracy across the operational temperature range. Temperature readings are accessible via firmware-controlled ADC channel reads.
Can FXTH87EH226T1 operate without an external crystal?
No, FXTH87EH226T1 requires an external 26 MHz fundamental-mode crystal connected to XI/XO pins to drive its PLL-based RF transmitter. Internal oscillators (HFO, MFO, LFO) support MCU timing and low-power modes but lack the stability and frequency precision needed for compliant 315/434 MHz RF transmission.
What is the purpose of the gel encapsulation in FXTH87EH226T1?
The gel encapsulation in FXTH87EH226T1 protects bond wires and IC surfaces from corrosive elements (e.g., road salt, moisture). However, it is not hermetic: under combined high humidity, temperature, and pressure ("pressure cooker" conditions), moisture absorption or gas permeation may cause temporary measurement shifts or rare permanent delamination.
How does FXTH87EH226T1 handle wake-up from low-power modes?
FXTH87EH226T1 supports wake-up via multiple sources: real-time interrupt (2–128 ms intervals), LF receiver (LFA/LFB pins detecting 125 kHz field), or GPIO edge detection on PTA[3:0]/PTB[1:0]. In STOP4 mode, all peripherals remain powered for sub-10 µs wake-up latency; in STOP1, only LFR and RTI retain functionality.
FXTH87EH226T1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- -
- Axis:
- -
- Acceleration Range:
- -
- Sensitivity (LSB/g):
- -
- Sensitivity (mV/g):
- -
- Bandwidth:
- -
- Output Type:
- -
- Voltage - Supply:
- -
- Features:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
FXTH87EH226T1 FAQ
1.How can I place an order for FXTH87EH226T1 through Aetrix?
Please submit a Request for Quotation (RFQ) for FXTH87EH226T1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FXTH87EH226T1 reliable?
The price and inventory of FXTH87EH226T1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FXTH87EH226T1 is usually 5 days.
3.What payment methods are accepted for FXTH87EH226T1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FXTH87EH226T1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FXTH87EH226T1?
FXTH87EH226T1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FXTH87EH226T1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FXTH87EH226T1?
For technical support, including FXTH87EH226T1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FXTH87EH226T1 requirements.
6.How does Aetrix verify that FXTH87EH226T1 is sourced from the original manufacturer or authorized distributors?
All FXTH87EH226T1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FXTH87EH226T1 meets industry standards.
7.What is the process for return or replacement of FXTH87EH226T1?
All FXTH87EH226T1 units undergo pre-shipment inspection (PSI). If there is an issue with FXTH87EH226T1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FXTH87EH226T1 part is unused and in its original packaging.
Return procedure for FXTH87EH226T1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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