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Vishay General Semiconductor - Diodes Division GSOT08-HT3-GS08

Part No.:
GSOT08-HT3-GS08
Manufacturer:
Vishay General Semiconductor - Diodes Division
Category:
TVS Diodes
Package:
3-WDFN
Datasheet:
AetrixGSOT08-HT3-GS08.pdf
Description:
TVS DIODE 8VWM 19.2VC LLP75-3B
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,147

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Product details

Overview

GSOT08-HT3-GS08 from Vishay Semiconductors is a single-line bidirectional asymmetrical (BiAs) ESD protection diode in LLP75-3B package, rated for 8 V reverse standoff voltage (VRWM), ±30 kV IEC 61000-4-2 ESD immunity, and 18 A peak pulse current (IPPM), deployed to safeguard high-speed USB 2.0 data lines against transient overvoltage.

For engineers reviewing the GSOT08-HT3-GS08 datasheet, GSOT08-HT3-GS08 pinout, GSOT08-HT3-GS08 application, or GSOT08-HT3-GS08 equivalent, this device delivers low-capacitance (160–250 pF at 0 V), asymmetric clamping (10.7–13 V reverse / ≤3 V forward at 18 A), and MSL Level 1 solderability - critical for compact portable electronics requiring robust ESD resilience without signal integrity degradation.

Technical Context

The GSOT08-HT3-GS08 operates in BiAs-mode: pin 1 is ground, pin 3 connects to the protected line, and pin 2 serves as internal connection node enabling asymmetrical clamping - reverse conduction above 9–10 V breakdown (VBR), forward conduction near 1 V (VF). Its internal structure integrates a single silicon avalanche diode with series impedance optimized for fast transient response.

This device supports unidirectional signal paths with bidirectional protection: it blocks up to 8 V DC (VRWM) while clamping positive transients to ≤19.2 V and negative transients to ≤3 V at full 18 A surge (IPPM), maintaining <250 pF capacitance at 0 V to preserve signal rise time in 480 Mbps USB 2.0 interfaces.

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Standoff Voltage (VRWM) 8 V - maximum continuous DC voltage the device blocks without leakage; sets operating margin for 5 V logic or USB 2.0 data lines.
Peak Pulse Current (IPPM) 18 A - maximum single-shot 8/20 µs surge current it safely shunts to ground per IEC 61000-4-5, defining robustness against lightning-induced surges.
Reverse Clamping Voltage (VC) 15.2–19.2 V at 18 A - maximum voltage seen by protected IC during worst-case positive ESD event; ensures downstream ICs remain below absolute max ratings.
Forward Clamping Voltage (VF) ≤3 V at 18 A - limits negative transient excursion close to ground, preventing latch-up or damage in CMOS receivers.
Capacitance (CD) 160–250 pF at 0 V, 80 pF at 4 V - low enough to avoid signal distortion in USB 2.0 (480 Mbps), HDMI, or SDIO interfaces.
ESD Immunity ±30 kV contact / ±30 kV air per IEC 61000-4-2 - exceeds industrial and consumer immunity requirements, eliminating need for secondary protection layers.
Package LLP75-3B - 1.2 × 0.8 × 0.5 mm surface-mount package with e3 matte tin finish, MSL Level 1, UL 94 V-0 molding compound.

Pinout & Package

LLP75-3B package: 3-terminal leadless plastic package, 1.2 mm × 0.8 mm footprint, 0.5 mm height, pin 1 marked by dot, terminals exposed on bottom for thermal and electrical performance.

Pin/Terminal Circuit Role Design Meaning
Pin 1 Ground reference Low-inductance connection to PCB ground plane; must be routed with minimal trace length to maintain clamping speed.
Pin 2 Internal node / cathode-anode junction Not externally accessible; internal connection between diode anode and cathode structures enabling BiAs operation.
Pin 3 Protected line input Connects directly to signal/data line (e.g., USB D+); carries both normal signal and diverted ESD current.

Key Features

Feature Design Value
Bidirectional Asymmetrical (BiAs) clamping Clamps positive transients at ≥9 V (VBR) to ≤19.2 V (VC), negative transients to ≤3 V (VF) - protects both supply-rail-referenced and ground-referenced receivers.
Low dynamic capacitance 80 pF at 4 V bias - minimizes signal attenuation and timing skew in high-speed digital interfaces like USB 2.0 and SD card slots.
High ESD immunity ±30 kV contact/air per IEC 61000-4-2 - eliminates field failures in handheld devices subjected to repeated human-body-model discharges.
Lead (Pb)-free & RoHS-compliant e3 matte tin termination, UL 94 V-0 molding, MSL Level 1 - supports lead-free reflow assembly and environmental compliance without derating.
Space-saving LLP75-3B package 1.2 × 0.8 mm footprint - enables placement adjacent to connectors or IC pads in ultra-thin mobile designs where board area is constrained.

Applications

USB 2.0 Interface Protection Industrial HMI Touch Panel

Use Scenario: Protecting D+ and D− lines of USB 2.0 ports in portable medical monitors against repeated ESD events during clinical handling.

IC Role / Device Role / Timing Role: Standalone ESD suppressor placed between connector and USB transceiver IC, operating in BiAs mode to clamp both polarities without DC blocking.

Use Value: Maintains 480 Mbps data integrity with <250 pF loading while surviving >10,000 ±30 kV contact discharges - extending field life and reducing service returns.

Use Scenario: Safeguarding projected capacitive touch controller inputs in factory-floor HMIs exposed to charged tool discharge and dry-environment static.

IC Role / Device Role / Timing Role: Point-of-entry protection on I²C or GPIO lines connecting touch sensor to MCU, leveraging low VF to prevent negative overshoot beyond MCU's -0.3 V absolute minimum.

Use Value: Enables reliable operation at -40 °C to +125 °C ambient with no derating, avoiding false touches or resets caused by ESD-induced latch-up.

Automotive Infotainment USB Port POS Terminal Data Line

Use Scenario: Securing USB host ports in automotive head units subject to ISO 10605 (330 pF/330 Ω) and IEC 61000-4-2 stress during service bay handling.

IC Role / Device Role / Timing Role: Primary ESD clamp on USB data lines, coordinated with system-level TVS to handle combined ESD/surge threats without interaction.

Use Value: Delivers 18 A IPPM capability and 15.2 V VC at full surge - ensuring microcontroller I/O remains within safe SOA limits even under worst-case coupled transients.

Use Scenario: Protecting RS-232 or USB-to-serial converter lines in retail point-of-sale terminals frequently touched by customers wearing synthetic fabrics.

IC Role / Device Role / Timing Role: Low-capacitance shunt protector on serial interface lines, placed immediately after ESD-prone DB9 or micro-USB receptacle.

Use Value: 80 pF at 4 V bias prevents baud-rate degradation at 115.2 kbps, while ±30 kV rating eliminates certification test failures during EMC lab validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
SMAJ8.0A Unidirectional, DO-214AC package (4.5 × 3.3 mm), 100 V PPP, higher capacitance (>500 pF), 100 A IPPM Designed for power rail protection, not signal lines; unsuitable for USB/SDIO due to size and capacitance Select only for 8 V DC power line clamping where board space and signal speed are non-critical
TPD2E001DRYR 2-channel, SOT-553 package, 5.5 V VRWM, 12 pF @ 0 V, ±8 kV IEC 61000-4-2, 4 A IPPM Lower voltage rating and surge capacity; optimized for low-capacitance high-speed interfaces like HDMI, not robust ESD environments Prefer for space-constrained, low-voltage (≤5.5 V), low-energy applications - not for ±30 kV or 8 V bus protection

Compared with SMAJ8.0A and TPD2E001DRYR, GSOT08-HT3-GS08 uniquely balances 8 V VRWM, ±30 kV ESD rating, 18 A surge capability, and 80–250 pF capacitance in a 1.2 × 0.8 mm footprint - making it the only option among the three qualified for industrial-grade USB 2.0 port protection with full IEC 61000-4-2 compliance.

Availability

GSOT08-HT3-GS08 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, industrial HMI touch panels, and automotive infotainment systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for GSOT08-HT3-GS08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, optoelectronics, and passive components for industrial, automotive, and computing markets.

The GSOT-HT3 family was engineered specifically for single-line BiAs ESD protection in ultra-compact portable and ruggedized electronics, addressing the need for high-surge-capable, low-capacitance solutions in sub-2 mm² footprints.

FAQ

What is the maximum continuous operating voltage for GSOT08-HT3-GS08?

The GSOT08-HT3-GS08 has a reverse standoff voltage (VRWM) of 8 V, meaning it reliably blocks voltages up to 8 V DC in normal operation. This rating is measured at IR = 5 µA and defines the highest steady-state voltage the device can withstand without significant leakage - ideal for protecting 5 V USB data lines while allowing margin for ripple and tolerance.

Does GSOT08-HT3-GS08 support both contact and air discharge ESD testing per IEC 61000-4-2?

Yes, GSOT08-HT3-GS08 is rated for ±30 kV contact discharge and ±30 kV air discharge per IEC 61000-4-2 (10 pulses), verified in production testing. This level exceeds standard industrial and consumer requirements and ensures robust field reliability in environments with frequent human interaction, such as medical handhelds or retail terminals.

What is the clamping behavior of GSOT08-HT3-GS08 during a negative ESD event?

During a negative ESD event, GSOT08-HT3-GS08 conducts in forward bias: its forward clamping voltage is ≤1.2 V at 1 A and ≤3 V at full 18 A peak pulse current (IPPM). This low forward voltage prevents negative overshoot beyond the protected IC's absolute minimum rating (typically –0.3 V), avoiding latch-up or gate oxide damage in CMOS receivers.

Can GSOT08-HT3-GS08 be used in high-speed USB 2.0 applications without degrading signal integrity?

Yes, GSOT08-HT3-GS08 is specifically designed for USB 2.0: its capacitance is 160–250 pF at 0 V and drops to 80 pF at 4 V bias, minimizing insertion loss and maintaining signal rise/fall times required for 480 Mbps operation. Layout best practices (short traces, solid ground plane) ensure full compliance with USB eye diagram specifications.

What is the package type and soldering profile for GSOT08-HT3-GS08?

GSOT08-HT3-GS08 uses the LLP75-3B package - a 1.2 × 0.8 × 0.5 mm leadless plastic package with e3 matte tin terminations. It is rated MSL Level 1 per J-STD-020 and supports lead-free reflow with peak temperature of 260 °C for 10 seconds at the terminals, compatible with standard Class 3 assembly processes.

GSOT08-HT3-GS08 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay General Semiconductor - Diodes Division
Package/Case:
3-WDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
8V (Min)
Voltage - Breakdown (Min):
9V
Voltage - Clamping (Max) @ Ipp:
19.2V
Current - Peak Pulse (10/1000µs):
18A (8/20µs)
Power - Peak Pulse:
345W
Power Line Protection:
No
Applications:
-
Capacitance @ Frequency:
160pF @ 1MHz
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
LLP75-3B

GSOT08-HT3-GS08 FAQ

1.How can I place an order for GSOT08-HT3-GS08 through Aetrix?

Please submit a Request for Quotation (RFQ) for GSOT08-HT3-GS08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for GSOT08-HT3-GS08 reliable?

The price and inventory of GSOT08-HT3-GS08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GSOT08-HT3-GS08 is usually 5 days.

3.What payment methods are accepted for GSOT08-HT3-GS08?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GSOT08-HT3-GS08 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for GSOT08-HT3-GS08?

GSOT08-HT3-GS08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your GSOT08-HT3-GS08 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for GSOT08-HT3-GS08?

For technical support, including GSOT08-HT3-GS08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GSOT08-HT3-GS08 requirements.

6.How does Aetrix verify that GSOT08-HT3-GS08 is sourced from the original manufacturer or authorized distributors?

All GSOT08-HT3-GS08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GSOT08-HT3-GS08 meets industry standards.

7.What is the process for return or replacement of GSOT08-HT3-GS08?

All GSOT08-HT3-GS08 units undergo pre-shipment inspection (PSI). If there is an issue with GSOT08-HT3-GS08, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The GSOT08-HT3-GS08 part is unused and in its original packaging.

Return procedure for GSOT08-HT3-GS08:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

GSOT08-HT3-GS08 Tags

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