My Inquiry
My Account
STMicroelectronics H3LIS200DL
- Part No.:
- H3LIS200DL
- Manufacturer:
- STMicroelectronics
- Category:
- Accelerometers
- Package:
- 16-VFLGA
- Datasheet:
-
H3LIS200DL.pdf
- Description:
- ACCEL 100-200G I2C/SPI 16TFLGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,210
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
H3LIS200DL from STMicroelectronics is a low-power, high-g 3-axis digital MEMS accelerometer with I²C/SPI interface, ±100g/±200g dynamically selectable full scale, 8-bit output resolution, and ultra-low 10 μA current draw in low-power mode. It operates across -40 °C to +85 °C in a 3×3×1.0 mm³ TFLGA-16 package and is used for shock detection and impact logging in portable industrial sensors.
For engineers reviewing the H3LIS200DL datasheet, H3LIS200DL pinout, H3LIS200DL application, or H3LIS200DL equivalent, key selection criteria include shock survivability (10,000 g), sleep-to-wakeup latency, dual-interface flexibility (I²C vs. SPI), and factory-calibrated zero-g offset accuracy (±1.5 g) at ±1 g reference.
Technical Context
The H3LIS200DL integrates a capacitive MEMS sensing element with a low-noise analog front-end and 8-bit ADC, supporting configurable output data rates from 0.5 Hz to 1 kHz. Its digital interface logic supports both I²C (standard/fast mode) and 4-/3-wire SPI protocols with dedicated interrupt outputs (INT1, INT2) for motion event triggering.
Internal register mapping enables dynamic full-scale selection (FS bit), programmable high-pass filtering for offset cancellation, and independent interrupt configuration per axis. Power management includes three operational modes-normal (300 μA), low-power (10 μA), and power-down (1 μA)-with turn-on time of 1/ODR + 1 ms at 100 Hz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.16 V to 3.6 V - supports direct integration with 2.5 V or 3.3 V system rails without level-shifting. |
| I/O Voltage Compatibility | 1.8 V - enables direct connection to 1.8 V microcontrollers without external voltage translation. |
| Full-Scale Range | ±100 g / ±200 g - user-selectable via FS bit; ±100 g yields 780 mg/digit sensitivity for high-resolution impact detection. |
| Output Data Rate | 0.5 Hz to 1 kHz - covers slow-motion monitoring (e.g., structural settling) and fast transient capture (e.g., drop testing). |
| Shock Survivability | 10,000 g - ensures functional integrity during mechanical handling, packaging, or accidental drops. |
| Operating Temperature | -40 °C to +85 °C - validated for industrial environments including outdoor equipment and automotive under-hood proximity. |
| Zero-g Offset Accuracy | ±1.5 g (typ.) - factory calibrated at ±1 g; enables reliable baseline subtraction in static orientation applications. |
Pinout & Package
The H3LIS200DL is housed in a 3×3×1.0 mm³ thin-film land grid array (TFLGA-16) package with 16 terminals, optimized for space-constrained PCB layouts and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Vdd_IO | Independent 1.8 V I/O supply rail - decouples digital interface voltage from core sensor supply (Vdd), enabling mixed-voltage system interfacing. |
| 4 | SCL / SPC | Shared clock input - functions as I²C SCL or SPI SPC depending on CS logic state; supports up to 10 MHz SPI clock. |
| 6 | SDA / SDI / SDO | Multi-function bidirectional data line - serves as I²C SDA, SPI SDI (input), or 3-wire SDO (output); internal pull-ups simplify bus termination. |
| 7 | SDO / SA0 | Configurable terminal - outputs SPI data when CS=0; sets LSB of I²C address (SA0) when CS=1, enabling dual-device addressing on same bus. |
| 8 | CS | Interface mode selector - high = I²C mode, low = SPI mode; also acts as chip select for SPI transactions. |
| 9, 11 | INT2, INT1 | Dedicated inertial interrupt outputs - independently configurable for motion detection, free-fall, or shock events; open-drain, 1.8 V compatible. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low power consumption | 10 μA in low-power mode - extends battery life in wireless impact loggers beyond 1 year on coin-cell power. |
| Sleep-to-wakeup function | Configurable wake threshold and duration - enables autonomous wake-up from deep sleep upon exceeding acceleration threshold, reducing host MCU polling overhead. |
| Dual digital interface | I²C and SPI support - allows flexible host processor selection: I²C for simplicity and reduced pin count; SPI for higher throughput and deterministic timing. |
| Factory-calibrated offset & sensitivity | ±1.5 g zero-g offset, ±0.01 %/°C sensitivity drift - eliminates need for end-of-line calibration in cost-sensitive industrial deployments. |
| High shock survivability | 10,000 g rating - guarantees continued operation after mechanical shock events common in logistics tracking and handheld test equipment. |
Applications
| Industrial Shock Monitoring | Portable Impact Logger |
|---|---|
Use Scenario: Continuous vibration and shock monitoring on factory floor machinery to detect abnormal impacts indicating bearing failure or misalignment. IC Role / Device Role / Timing Role: Primary acceleration transducer capturing transient g-force spikes above 50 g with 1 kHz ODR and timestamped via host MCU. Use Value: Enables predictive maintenance by correlating shock amplitude/frequency with machine health metrics without requiring external signal conditioning. | Use Scenario: Battery-powered handheld device used to record drop height and impact severity during product packaging validation. IC Role / Device Role / Timing Role: Standalone motion trigger with sleep-to-wakeup - remains in 10 μA mode until >20 g acceleration initiates data capture at 500 Hz. Use Value: Captures precise peak g-value and waveform shape of impact events while conserving energy between tests. |
| Automotive Event Data Recorder | Asset Tracking Shock Detection |
Use Scenario: Integration into vehicle-mounted EDR modules to detect crash-level deceleration (>50 g) and initiate secure memory write. IC Role / Device Role / Timing Role: High-reliability inertial sensor with 10,000 g survivability - operates through airbag deployment shock and maintains data integrity. Use Value: Provides tamper-resistant acceleration signature for post-incident forensic analysis without requiring external power backup. | Use Scenario: Embedded in shipping containers or pallets to log handling abuse (e.g., rough loading/unloading) during transit. IC Role / Device Role / Timing Role: Low-power shock detector with configurable INT1 threshold - triggers non-volatile storage write only on events >100 g lasting ≥10 ms. Use Value: Delivers auditable impact history with minimal false positives, supporting insurance claims and logistics process improvement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-g accelerometer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADXL372 | 2000 g range, 22-bit output, 2.5 μA ultra-low-power mode, integrated FFT engine | Targeted at high-frequency vibration analysis (e.g., bearing fault detection), not optimized for simple shock thresholding | Choose ADXL372 when spectral analysis or sub-μA power is required; H3LIS200DL better suits cost-sensitive, discrete-event logging. |
| MMA8452Q | 2 g / 4 g / 8 g full scale, 14-bit output, 6 μA standby, built-in motion detection engine | Designed for low-g human motion (e.g., tilt, tap), lacks high-g shock survivability and ±200 g range | Choose MMA8452Q for wearable or consumer electronics; H3LIS200DL is necessary where 100+ g measurement and 10,000 g ruggedness are mandatory. |
Compared with ADXL372 and MMA8452Q, the H3LIS200DL uniquely balances 10,000 g mechanical robustness, ±200 g full scale, and 10 μA low-power operation in a 3×3 mm package-making it optimal for industrial shock event recorders where extreme g-range and field reliability outweigh advanced signal processing needs.
Availability
H3LIS200DL is available at Aetrix Electronics and suitable for industrial shock monitoring, portable impact logging, automotive event data recording, and asset tracking shock detection requiring stable component supply over extended production lifecycles.
Supply support for H3LIS200DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and analog devices for industrial, automotive, and consumer markets.
The H3LIS200DL belongs to ST's "nano" family of MEMS accelerometers, engineered specifically for high-g, low-power industrial sensing applications where shock survivability, wide temperature operation, and minimal footprint are critical design constraints.
FAQ
What is the maximum I²C clock frequency supported by the H3LIS200DL?
The H3LIS200DL supports I²C standard mode (up to 100 kHz) and fast mode (up to 400 kHz), with guaranteed timing parameters including SCL low/high times and SDA setup/hold requirements documented in Table 6 of the datasheet. Fast-mode operation requires proper bus capacitance control (Cb ≤ 400 pF) and pull-up resistor sizing.
How does the sleep-to-wakeup function operate in practice?
Sleep-to-wakeup is configured via CTRL_REG2 and INT1_CFG registers: the device enters low-power mode (10 μA), monitors acceleration continuously, and asserts INT1 when a user-defined threshold (INT1_THS) is exceeded for a minimum duration (INT1_DURATION). Wake latency is typically <1 ms, enabling rapid response to impact events without host MCU polling.
Can the H3LIS200DL measure static tilt angles accurately?
No - the H3LIS200DL is optimized for high-g dynamic events (shock, impact), not static tilt. Its ±100 g / ±200 g full scale and 8-bit resolution yield ~400 mg/LSB at ±100 g, insufficient for sub-degree tilt accuracy. For tilt sensing, ST's low-g accelerometers (e.g., LIS3DH) with 12–16 bit resolution and <1 mg/LSB sensitivity are recommended.
Is the H3LIS200DL RoHS and REACH compliant?
Yes - the H3LIS200DL is ECOPACK® certified, RoHS compliant (2011/65/EU), and "Green" compliant (halogen-free, lead-free terminations). Full material declarations and compliance documentation are available in ST's official product change notifications and environmental reports.
H3LIS200DL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 16-VFLGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Digital
- Axis:
- X, Y, Z
- Acceleration Range:
- ±100g, ±200g
- Sensitivity (LSB/g):
- 1 (±100g) ~ 0.6 (±200g)
- Sensitivity (mV/g):
- -
- Bandwidth:
- 25Hz ~ 500Hz
- Output Type:
- I2C, SPI
- Voltage - Supply:
- 2.16V ~ 3.6V
- Features:
- Selectable Scale
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TFLGA (3x3)
H3LIS200DL FAQ
1.How can I place an order for H3LIS200DL through Aetrix?
Please submit a Request for Quotation (RFQ) for H3LIS200DL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for H3LIS200DL reliable?
The price and inventory of H3LIS200DL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for H3LIS200DL is usually 5 days.
3.What payment methods are accepted for H3LIS200DL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for H3LIS200DL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for H3LIS200DL?
H3LIS200DL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your H3LIS200DL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for H3LIS200DL?
For technical support, including H3LIS200DL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your H3LIS200DL requirements.
6.How does Aetrix verify that H3LIS200DL is sourced from the original manufacturer or authorized distributors?
All H3LIS200DL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that H3LIS200DL meets industry standards.
7.What is the process for return or replacement of H3LIS200DL?
All H3LIS200DL units undergo pre-shipment inspection (PSI). If there is an issue with H3LIS200DL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The H3LIS200DL part is unused and in its original packaging.
Return procedure for H3LIS200DL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
H3LIS200DL Tags
-
MXC4005XC
Memsic Inc.
-
MC3419
Memsic Inc.
-
MC3479
Memsic Inc.
-
MXC6655XA
Memsic Inc.
-
MC3630
Memsic Inc.
.jpg)
-
LIS2HH12TR
STMicroelectronics
-
KX122-1037
Kionix Inc.
-
LIS2DE12TR
STMicroelectronics
-
LIS2DH12TR
STMicroelectronics
-
MC3635
Memsic Inc.
-
LIS2DS12TR
STMicroelectronics
-
LIS3DHTR
STMicroelectronics
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
